FPGA Prototyping Speeds Design Realization for the Internet of Things

FPGA Prototyping Speeds Design Realization for the Internet of Things
by Daniel Nenni on 04-02-2018 at 7:00 am

When we talk about the Internet of Things (IoT), it isn’t a stretch to say that every intelligent device we interact with will become connected, sharing vast amounts of data with one another to make our lives more efficient. It isn’t only consumers of smart home, infotainment, and wearable technologies that are driving the demand,… Read More


FlexE at SoC IP Days with Open Silicon

FlexE at SoC IP Days with Open Silicon
by Daniel Nenni on 03-30-2018 at 12:00 pm

On Thursday April 5th the Design and Reuse SoC IP days continues in Santa Clara at the Hyatt Regency (my favorite hangout). SemiWiki is a co-sponsor and I am Chairman of the IP Security Track. More than 400 people have registered thus far and I expect a big turnout, if you look at the program you will see why. You should also know that registration… Read More


Webinar: Fastest Lowest-Cost Route to Developing ARM based Mixed Signal SoCs

Webinar: Fastest Lowest-Cost Route to Developing ARM based Mixed Signal SoCs
by Daniel Nenni on 03-28-2018 at 7:00 am

When it comes to building edge devices for the internet-of-things (IoT), you don’t want to have to break the bank to prototype an idea before diving into the deep water. At the same time, if your idea is to shrink an edge device down to it’s smallest dimensions, lowest power and lowest cost, you really want to be able to prototype your… Read More


Siemens Leverages Mentor Embedded IoT Framework for Industry 4.0

Siemens Leverages Mentor Embedded IoT Framework for Industry 4.0
by Daniel Nenni on 03-21-2018 at 7:00 am

For those of you who wondered at the logic behind Siemens acquisition of Mentor Graphics last year, look no further than a recent announcement by Mentor, now a Siemens business, regarding the release of their new Mentor Embedded IoT Framework (MEIF). To help connect the dots, we need to back up a bit and review a few things about how… Read More


Webinar: Achieve High-performance and High-throughput with Intel based FPGA Prototyping

Webinar: Achieve High-performance and High-throughput with Intel based FPGA Prototyping
by Daniel Nenni on 03-19-2018 at 12:00 pm

FPGAs have been used for ASIC prototyping since the beginning of FPGAs (1980s) allowing hardware and software designers to work in harmony developing, testing, and optimizing their products. We covered the history of FPGAs in Chapter 3 of our book “Fabless: The Transformation of the Semiconductor Industry”, which includes … Read More


CEO Interview: Ramy Iskander of Intento Design

CEO Interview: Ramy Iskander of Intento Design
by Daniel Nenni on 03-14-2018 at 7:00 am

One of the more interesting parts of blogging for SemiWiki is getting to know emerging EDA and IP companies from around the world. As I have mentioned before, there are some incredibly intelligent people in the fabless semiconductor ecosystem solving very complex problems. It is a two way exchange of course since we know the market… Read More


ClioSoft and SemiWiki Winning

ClioSoft and SemiWiki Winning
by Daniel Nenni on 03-05-2018 at 7:00 am

There is a bit of nostalgia here since ClioSoft was one of the first companies that we (SemiWiki) worked with 7 years ago. Back then it was hard for an emerging EDA company to get noticed by the mainstream media much less collaborate with them. Since then we have published 80 blogs with ClioSoft that have garnered more than 350,000 views.… Read More


CEO Interview: Rene Donkers of Fractal Technologies

CEO Interview: Rene Donkers of Fractal Technologies
by Daniel Nenni on 02-28-2018 at 7:00 am

We (SemiWiki) have been working with Fractal for close to five years now publishing 25 blogs that have garnered more than 100,000 views. Generally speaking QA people are seen as the unsung heroes of EDA since the only time you really hear about them is when something goes wrong and a tapeout is delayed or a chip is respun.

FinFETs really… Read More


Herb Reiter on the Challenges of 2.5D ASIC SiPs

Herb Reiter on the Challenges of 2.5D ASIC SiPs
by Daniel Nenni on 02-23-2018 at 12:00 pm

Years ago my good friend Herb Reiter promoted the importance of 2.5D packaging to anybody and everybody who would listen including myself. Today Herb’s vision is in production and the topic of many papers, webinars, and conferences. According to Herb, and I agree completely, advanced IC packaging is an important technology for… Read More