As a professional conference attendee I see a direct correlation between the number of people attending and the quality of the keynotes. Let’s face it, it’s all about the keynotes so you had better get some big names if you want more than your friends and family to show up. In this regards the upcoming CASPA event will probably be one… Read More
Author: Daniel Nenni
Intel Invades China Mobile Market!
As you may have heard, Intel is making some interesting moves into the China mobile market. At first it had me a bit puzzled but I had some lengthy discussions about it during ARM TechCon last week so I’m ready to start writing. Spoiler alert: This will be pro Intel so please sit down and take some deep breaths before reading.
The first… Read More
Silicon Does NOT Lie!
In the 30+ years that I have worked in Silicon Valley I have seen many great products fail and even more mediocre products succeed, the difference being how the companies communicate to the outside world. In the semiconductor industry, presenting the value proposition of your company or product is under even more scrutiny now that… Read More
The Apple Samsung TSMC Intel 14nm Mashup!
One of the strengths of the fabless semiconductor ecosystem is competition since it keeps innovation high and prices low. One of the challenges of fostering competition is that you have to make good on a threat of using a competing product during a pricing negotiation. Well, in my opinion, for the next version of the iPhone, Apple… Read More
ARM ♥ TSMC!
This week is the 10[SUP]th[/SUP] annual ARM Technical Conference in Silicon Valley. In regards to size, content, and relevance, I believe ARM TechCon is the #1 event for the fabless semiconductor ecosystem for sure. I attended keynotes, sessions, and walked the hallways on Wednesday and Thursday. I wish I could write about everything… Read More
ARM ♥ Xilinx!
The good news is that as a part of SemiWiki we get free media passes to all of the cool conferences. The bad news is that our inboxes get flooded with announcements. ARM TechCon is next week and my delete button is on overtime but it is interesting to see who is active in conferences and who is not. In this case Xilinx is very active and Altera… Read More
TSMC Delivers First FinFET ARM Based SoC!
Right on cue, TSMC announces 16nm FinFET production silicon. I believe this is the original version of FinFET versus 16FF+ which is due out in 1H 2015. I will confirm this next week at the TSMC OIP event in San Jose, absolutely. Either way this is excellent news for the fabless semiconductor ecosystem and I look forward to the first … Read More
The TSMC iPhone 6!
Fortunately Paul McLellan and I missed IDF. Paul was atop Mt. Kilimanjaro and I was in Taiwan signing books. After reviewing the materials and watching the videos we really didn’t miss much in regards to mobile so no regrets. The Apple event would have been fun even though I won’t be buying an iPhone6 or an iWatch and I will tell you why.… Read More
Is Number of Signoff Corners an Issue?
Semiconductor companies continue to use the traditional corner-based signoff approach that has been developed more than 40+ years ago and has since remained mainly unchanged as an industry paradigm. Initially it had 2 corners, namely Worst Case (WC) and Best Case (BC) with the maximum and minimum cell delay respectively. Note… Read More
Intel’s 35% Density Advantage Claim Explored
The previous blog I did on the density difference between Intel 14nm and TSMC 20nm caused quite a stir and many interesting comments which I would like to address. After writing thousands of blogs on a wide variety of topics I have found that playing the devil’s advocate stimulates the most productive conversations and in this case… Read More
The Packaging PDK Is the Missing Layer for Co-Packaged Optics