Alchip is Paving the Way to Future 3D Design Innovation

Alchip is Paving the Way to Future 3D Design Innovation
by Mike Gianfagna on 11-19-2024 at 6:00 am

Alchip is Paving the Way to Future 3D Design Innovation

At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More


Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More


TSMC OIP Ecosystem Forum Preview 2024

TSMC OIP Ecosystem Forum Preview 2024
by Daniel Nenni on 09-19-2024 at 10:00 am

TSMC OIP 2024

The 2024 live conferences have been well attended thus far and there are many more to come. The next big event in Silicon Valley is the TSMC Global OIP Ecosystem Forum on September 25th at the Santa Clara Convention Center. I expect a big crowd filled with both customers and partners.

This is the 16th year of OIP and it has been an honor… Read More


Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Siemens Provides a Complete 3D IC Solution with Innovator3D IC
by Mike Gianfagna on 06-27-2024 at 6:00 am

Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More


New EDA Tool for 3D Thermal Analysis

New EDA Tool for 3D Thermal Analysis
by Daniel Payne on 06-26-2024 at 10:00 am

3D IC cross section min

An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More


TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design

TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
by Mike Gianfagna on 06-10-2024 at 6:00 am

TSMC Advanced Packaging Overcomes the Complexities of Multi Die Design

The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More


3DIC Verification Methodologies for Advanced Semiconductor ICs

3DIC Verification Methodologies for Advanced Semiconductor ICs
by Kalar Rajendiran on 06-06-2024 at 10:00 am

3DIC Flow Challenges

At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.

3DIC Challenges

Despite the numerous advantages of 3DIC technology, its… Read More


Synopsys Accelerates Innovation on TSMC Advanced Processes

Synopsys Accelerates Innovation on TSMC Advanced Processes
by Mike Gianfagna on 05-15-2024 at 10:00 am

Synopsys Accelerates Innovation on TSMC Advanced Processes

We all know that making advanced semiconductors is a team sport. TSMC can innovate the best processes, but without the right design flows, communication schemes and verified IP it becomes difficult to access those processes. Synopsys recently announced some details on this topic. It covers a lot of ground. The graphic at the top… Read More


Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification
by Mike Gianfagna on 05-13-2024 at 6:00 am

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification

2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More


How MZ Technologies is Making Multi-Die Design a Reality

How MZ Technologies is Making Multi-Die Design a Reality
by Mike Gianfagna on 03-04-2024 at 6:00 am

How MZ Technologies is Making Multi Die Design a Reality

The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More