Moores Lab(AI): Agentic AI and the New Era of Semiconductor DesignFor decades, chip design has been a delicate…Read More
Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®In a landmark presentation at the 2025 IEEE…Read More
From Prompts to Prompt Engineering to Knowing OurselvesI am on a voyage of discovery through…Read More
GaN Device Design and Optimization with TCADI’ve read articles about power electronics, RF systems…Read More
How the Father of FinFETs Helped Save Moore’s LawIn the early 2000s, Moore’s Law—the observation that…Read More
Cybersecurity is getting more critical every day. Thanks to sophisticated AI attacks, the need for hardware chip-level security is greater than ever. To fortify hardware against these types of attacks is not easy. There are three key attributes of a successful strategy: a well-designed root-of-trust, collaboration to ensure… Read More
Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More
By Mark Tawfik
Overview: Protecting ICs from costly ESD and latch-up failures
Electrostatic discharge (ESD) events cost the semiconductor industry an estimated $8 billion annually in lost productivity, warranty claims and product failures [1].
Ensuring the robust protection of integrated circuits (ICs) against various… Read More
The global semiconductor industry stands at a defining moment in its history. Having surpassed $600 billion in annual revenue, the path to a $1 trillion market is no longer a distant dream but an achievable milestone within the next decade. The annual 2025 Semi Industry Forum, organized by Silicon Catalyst, brings together the… Read More
The U.S. House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party released a bombshell report titled “Selling the Forges of the Future” on October 7, 2025, detailing how the People’s Republic of China is stockpiling semiconductor manufacturing equipment… Read More
– First SEMICON in Arizona was great- should make it permanent
– Congress finally wakes up to China issues long after cows are gone
– Memory cycle in support of AI could be huge but scary at same time
– AI demand seems bottomless- but may distort chip industry dynamics
Phoenix SEMICON was wonderful!
The crowds… Read More
Daniel is joined by Dr. Mark Burton, the General Chair for this year’s DVCon Europe. DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits.
Mark shares his long history of involvement in DVCon with Dan. He … Read More
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
Artificial intelligence (AI) is transforming every layer of computing, from hyperscale data centers training trillion-parameter models to battery-powered edge devices performing real-time inference. Hardware requirements are escalating on every front: compute density is increasing, power budgets are tightening, … Read More
RISC-V has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More
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Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools