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I have asked TSMC on several occasions if they will package non TSMC logic die with TSMC die and they have said no. Same thing for chiplets. It is a hard stance since Intel will accept other foundry die and are packaging Intel and TSMC die already but I understand since they are currently...
TSMC, the world’s leading semiconductor manufacturer, has announced that its advanced packaging capacity is fully booked for the next two years. This development comes as Nvidia, AMD, and Guanghuida secure TSMC’s cutting-edge packaging technologies for their high-performance computing (HPC)...
Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) seeking proposals from eligible applicants for activities to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. Digital twins are virtual models...
Intel fab under construction in Ireland, via Intel Ireland
For the last several decades, one avenue of technological progress has towered over nearly everything else: semiconductors. Semiconductors are materials that can have their conductivity varied by many orders of magnitude, which makes it...
Well deserved and it is only up from here. TSMC N3 and N2 will be very dominant nodes. AI is really pushing the leading edge wafers for power and performance and that is TSMC, absolutely.
I don't understand SMICs lack of growth since they have a captured market. My guess is that other China...
My concern is the Rapidus design ecosystem. Companies with internal tools and IP can port them over to a one-off IBM process but the general fabless and system company population cannot. Expect a lot of ecosystem announcements but actually getting the IP ported and supported is a challenge.
Credit: DIGITIMES
Counterpoint released the global foundry market share ranking for the fourth quarter of 2023, showing that TSMC maintained its leadership status with a 61% market share driven by strong demand from AI and the restocking of smartphones.
TSMC 5nm capacity utilization reached...
Open AI’s CEO says we won’t need new hardware or lots more training data to get there.
AP PHOTO/JON GAMBRELL, FILE
A number of moments from my brief sit-down with Sam Altman brought the OpenAI CEO’s worldview into clearer focus. The first was when he pointed to my iPhone SE (the one with the...
The Rapidus fab in northern Japan will have a blanket of grass over the top and use very little water and artificial light and rely on 100% renewable energy. It will be ready for production of 2nm process node chips in early 2027, according to an executive. (Rapidus)
Rapidus remains on track to...
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China has been buying the majority of the new and used 200mm semiconductor equipment for the last few years. China has been prepping for this, absolutely.
May 03, 2024 09:00 AM Eastern Daylight Time
TAIPEI, Taiwan--(BUSINESS WIRE)--NVIDIA’s next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA’s own Grace Arm CPU in models such as the GB200, represents a significant development. TrendForce points out that the GB200 and...
Photo illustration of Apple M4 chip colorfully springing to life from the control board of a MacBook Pro.
Rumors about Apple's M4 chip are all the rage right now, with the latest claiming that we might see the M4 chip debut in the new iPad Pro at Apple's "Let Loose" event on May 7. That rumor...
Had Intel 10/7 come out when TSMC N7 and Samsung 7nm (non EUV), Intel would have done very well. But Intel had organizational issues and a serious lack of leadership. If you want to blame someone blame the Intel board for hiring BK as CEO.
I think Intel's early HNA EUV R&D is great for the...
Had Anton actually attended or had any first hand knowledge he would know that TSMC has been in photonics for a while. They even said so in the presentations. Here is a report from last year:
Silicon Photonics Reshapes the Future; TSMC, ASE Ready to Seize Market Share
In the realm of photonic...
Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out)...
I thought we would talk about it in the forum this year. TSMC only allowed us a handful of slides which I posted. Honestly, there were no surprises. Just really good execution on the roadmap they presented last year. The only surprise for me was that CC Wei did not speak. He has multiple COO's...
Apple is intimately partnered with TSMC so they are steering the mobile processes. Apple is part of TSMC's risk aversion program so they get what they get.
Apple does get a new node version every year, one that no one else can use, that has not changed. Apple will get a new N3 version this...