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Generative AI for Silicon Design – Article 2 (Debug My Waveform)

Generative AI for Silicon Design – Article 2 (Debug My Waveform)
by Anshul Jain on 11-01-2023 at 10:00 am

Generative AI for Silicon Design Article 2

Generative AI has been making waves across various industries, and its potential continues to expand. Among its many applications, one particularly intriguing area is the capacity of GenAI to explain digital design waveforms and act as a co-pilot for hardware engineers in the debugging process. In this article, we will explore the fascinating possibilities that this technology brings to the table and its impact on the field of silicon development.

Experiment 2: Explaining Design Waveforms

This first experiment showcases the ability of Generative AI to recognise patterns and trends in data and revolutionise the way we understand and interact with waveforms. In this experiment, Google’s Generative AI Model – BARD was used to generate an explanation of write transfers in a system complying to AMBA APB protocol by looking at a sample waveform (sourced from https://documentation-service.arm.com)

Write transfer with wait states

Generated Explanation (tweaked to make its language inclusive)

Disclaimer: This explanation is not reviewed for accuracy

The waveform in the image shows the following signals:

TCLK: The APB3 clock signal.
PADDR: The APB3 address bus.
PWRITE: The APB3 write signal.
PSEL: The APB3 chip select signal.
PENABLE: The APB3 enable signal.
PWDATA: The APB3 write data bus.
PREADY: The APB3 ready signal.
Data 1: The data being written to the APB3 completer device.

The waveform shows the following behavior:

At time T1, the PWRITE signal goes high and the PADDR bus is driven with the address of the APB3 completer device to be written to.

At time T2, the PSEL signal goes high. This indicates that the APB3 initiator is ready to transfer data to the completer device.

At time T3, the PENABLE signal goes high. This indicates that the APB3 initiator is ready to drive the PWDATA bus.

At time T4, the PREADY signal goes high. This indicates that the APB3 completer device is ready to receive the data on the PWDATA bus.

At time T5, the PWRITE signal goes low. This indicates that the APB3 initiator has finished transferring data to the completer device.

The PSEL and PENABLE signals remain high until the APB3 completer device has finished processing the data.

What Does Future Look Like – GenAI Powered Debugger Copilot

One of the most exciting applications of generative AI is the potential it holds to be a co-pilot for developers during the debugging process. Waveforms are the lifeblood of complex systems in hardware design. A debugger copilot, powered by generative AI, can dissect waveforms, identify anomalies, and correlate patterns, making it an invaluable tool for engineers seeking to comprehend complex design behavior.

Challenges in Developing a Debugger Copilot

While the prospects of a debugger copilot powered by generative AI are enticing, there are challenges that need to be addressed. The accuracy and reliability of the AI’s explanations are paramount. We must ensure that the AI’s insights are trustworthy and not just algorithmically generated responses. Moreover, privacy and data security concerns are significant. Handling sensitive information in the debugging process requires a robust framework to protect data integrity.

Conclusion

The journey of generative AI into the realm of explaining waveforms and acting as a debugger copilot is an exciting one. This technology has the potential to transform the way we develop and debug software, saving time, reducing costs, and increasing accuracy. As engineers continue to explore its possibilities, the future of debugging looks promising.

Also Read:

Generative AI for Silicon Design – Article 1 (Code My FSM)


WEBINAR: How to Achieve 95%+ Accurate Power Measurement During Architecture Exploration

WEBINAR: How to Achieve 95%+ Accurate Power Measurement During Architecture Exploration
by Daniel Nenni on 11-01-2023 at 6:00 am

AVFS IP SOC

Today’s power modeling solutions are trained at measuring power using the micro-events captured from detailed RTL simulation or studying the electromagnetic radiation from IR drop and side channel attacks. These solutions are fantastic for debugging and verification of the implementation. There are both open source and commercial products for power modeling.  For example, Synopsys PrimeTime can provide the percentage of activity in a stage for each device while Cadence Joules can debug the power intent, and Ansys Totem can help with the transistor-level power integrity and reliability analysis.  There is an open-source power modelling add-on to SystemC. All of these are static solutions that take the simulation, process it and generate reports.  Alternately they work in conjunction with a debugger.

As the power requirements get more stringent and complex, designers need to predict the power consumption, impact of power intent and savings from power management units, during architecture exploration.  System designers and integrators want the power consumption metrics in the datasheet for the entire activity range, not just one or two scenarios.  The marketing team must be able to quickly generate power metrics for the requested scenarios. Thermal team requires heat and temperature data to plan for the cooling, chassis design and board layout.  The system integrators need guidelines on the battery lifecycle and peak power to plan for the supply and capacitance.  Thus, a good modelling solution must support power generation, storage, analog and digital consumption and power management. The IP or semiconductor vendor must have the ability share a dynamic model that quickly simulate scenarios. The accuracy of the power measurements at the architecture exploration must be within 10% of the value at RTL or board-level.

Power exploration starts by examining the tangible hardware and software choices that significantly affect SoC power consumption. These include:

  • Use cases
  • Architectural details (number of cores, choice of accelerators)
  • Power-saving features (DVFS, clock gating, power gating)
  • Firmware/software algorithms
  • Operating frequency and voltage modes
  • Process technology aspects that impact power

Modern SOCs employ multiple power management strategies either at individual IP level or full SOC level. One such strategy is adaptive voltage and frequency scaling (AVFS). In AVFS, a closed-loop feedback system is implemented between the voltage scaling power supply and delay-sensing performance monitor on the SoC. The on-chip performance monitor not only sees the actual voltage delivered on-chip but also understands whether the silicon is slow, typical or fast, and the effect of the temperature of the surrounding silicon. It can also track the utilization parameters to decide the choice of operating points.

The figure below represents an example of this feedback system between power manager and performance monitor on a chip.

System-level modelling solutions such as VisualSim Power Modeler 2.0 can be used to model the effect of power management strategies on the system performance and hence decide on a power-performance trade-off in early system design phases.

In the intricate realm of System-on-Chip (SoC) design, optimizing power is paramount. VisualSim Power Modeling 2.0 is a dynamic power exploration, optimization and measurement of the Intellectual Property, Semiconductor Device, embedded system, chassis or Data Center.  VisualSim enables system-level SoC power measurement even before delving into the intricacies of Register Transfer Level (RTL) development. Using this solution, designers and Power Architect can study ways to reduce power consumption, measure power consumed for a software application, impact of hardware configurations, adding of new hardware or change in the interconnect and new workloads/ use-cases. As the Power modeling toolkit is common from IP vendors to the system deployment, it is possible for suppliers and the system integrators to share encrypted power information along with the model.

VisualSim System-Level Power Modeling is used during the specification phase and before development.  Thus, it is possible to optimize the architecture to achieve Power-Performance-Trade off before development and also reuse the model for downstream debugging.

The built-AI engine continuously monitors the power activity to identify failures and identifies the cause of the failure.

See Webinar Replays Here
Also Read:

System Simulation, Architecture Exploration, Power Management, Performance Analysis

Mirabilis Invites System Architects at DAC 2023 in San Francisco

Mapping SysML to Hardware Architecture


The Significance of Point Spread Functions with Stochastic Behavior in Electron-Beam Lithography

The Significance of Point Spread Functions with Stochastic Behavior in Electron-Beam Lithography
by Fred Chen on 10-31-2023 at 10:00 am

Electron Beam Lithography

Electron beam lithography is commercially used to directly write submicron patterns onto advanced node masks. With the advent of EUV masks and nanometer-scale NIL (nanoimprint lithography), multi-beam writers are now being used, compensating the ultralow throughput of a single high-resolution electron beam with the use of over 100,000 beams [1-2]. Unlike optical or EUV scanners, the resolution is not determined by the numerical aperture (NA) of the system. Instead, it starts with how small the electron beam is focused, followed by how the electrons are subsequently scattered and release more electrons which are subsequently scattered.

Commonly, Gaussian functions are used to model the electron beam and scattering profiles. However, a single Gaussian function is not sufficient to build the effective point spread function. This is because the backscattered electrons travel far beyond the range of the immediately scattered electrons. At least two Gaussian functions (and generally more) are needed for an accurate profile. Some published results from the literature [3-4], in fact, indicate exponential functions as more appropriate for fitting the energy deposited by a high-energy electron beam. Compared to a Gaussian function, an exponential function has a sharper, narrower peak, a sharper drop-off, and a more extended tail.

Figure 1. Exponential functions more realistically describe the combination of a narrow beam with extended backscattering.

The narrow peak and sharp drop-off are consistent with the highest energy electrons (>>10 keV) not deviating far laterally from the entry point, while the extended tail comes from all the secondary electrons (many generations, no doubt) from electrons which are backscattered from the substrate.

The resolution limit from this point spread function can be studied (as in the optical cases) by considering the space between two exposed points. As may be expected, the shot noise from the electron dose plays a critical role (Figure 2).

Figure 2. Reducing the dose to 16% of the nominal value increases the impact from shot noise visibly. The two exposed spots here are separated by 40 nm. The number of Poisson events is considered proportional to the exponential deposited energy profile.

What also should not be a surprise is the impact of blur. Here blur comes from a wider range of electron energies (many keVs) than expected from EUV lithography (only up to ~92 eV).

Figure 3. Increasing blur reduces the peak-valley dose difference. Since the peak dose here is fixed, the valley dose is actually increasing with blur. As in Figure 2, the two exposed spots here are separated by 40 nm, and the number of Poisson events is considered proportional to the exponential deposited energy profile.

From Figure 3, we note two trends. First, the peak-valley dose difference diminished with increasing blur. Second, while the peak dose is fixed, the valley dose is increasing with increasing blur. In terms of the impact on stochastic dose variations, these two trends counter each other. The first trend increases sensitivity to fluctuations, but the second trend reduces the amplitude of such fluctuations in accordance with Poisson statistics. Consequently, the CD variation due to these fluctuations is comparable among the three cases (Figure 4).

Figure 4. CD variation for 20 points repeatability run, for the cases shown in Figure 3. The amount of variation is comparable among the three cases.

The 3 sigma uniformity is on the order of 3-4 nm (~15-20%) for the three cases examined. Obviously, the dose needs to be increased to reduce this to smaller values. However, this will proportionally increase write time if beam number is not increased; a doubling is considered unacceptable [2]. Larger CDs (>20 nm) will not be impacted as significantly [5], as the peak-valley difference is increased and more point spread functions are overlapped together in writing the spots [1,6]. However, for nanoimprint masks and High-NA EUV masks with subresolution assist features (SRAFs), the stochastic variations cannot be ignored.

References

[1] M. Tomandl et al., Proc. SPIE 12802, 1280204 (2023).

[2] C. Klein et al., Proc. SPIE PC12497, PC1249707 (2023).

[3] V. R. Manfrinato et al., Nano. Lett. 14, 4406 (2014).

[4] V. R. Manfrinato et al., Nano. Lett. 13, 1555 (2013).

[5] K. Ichimura et al., Proc. SPIE 12293, 122930Q (2022).

[6] K. Ichimura et al., Proc. SPIE 10584, 105840P (2018).

This article first appeared on LinkedIn Pulse: The Significance of Point Spread Functions with Stochastic Behavior in Electron-Beam Lithography

Also Read:

KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good

ASML- Longer Deeper Downcycle finally hits lithography – Flat 2024 – Weak Memory – Bottom?

ASML- Absolutely Solid Monopoly in Lithography- Ignoring hysteria & stupidity


DVCon Europe is Coming Soon. Sign Up Now

DVCon Europe is Coming Soon. Sign Up Now
by Bernard Murphy on 10-31-2023 at 6:00 am

logo accellera min

I’m a fan of DVCon, a fan of Accellera and a fan of Munich, hosting DVCon Europe once again. This year’s event runs from November 14th through 15th (with some events on the 16th) at the Holiday Inn Munich in the City Center. Phillippe Notton (CEO, SiPearl) will deliver a keynote on “Energy Efficient High-Performance Computing in the Heart of Europe”, and Michaela Blott (Sr. Fellow at AMD Research) will deliver a second keynote on “Pervasive and Sustainable AI with Adaptive Computing”. Add to that a medley of Accellera updates and EDA, semiconductor, and EDA+semiconductor talks on a variety of topics. I’ll briefly summarize Accellera-related topics below, remembering that, as is normal with standards, detail is hard to come by until officially released. Remember to REGISTER.

Functional safety working group update

This working group is chaired by Alessandra Nardi, a well-respected authority in the safety domain. The group aims to standardize methods to capture and propagate safety intent from system (a car for example) down through software, SoC and IP design, ensuring ability to exchange data and to support traceability between multiple levels of total system design. This working group will release a white paper soon which they will discuss in the session.

Workshops on UVM-AMS and CDC/RDC

These are areas I am watching closely. In AMS, Accellera is working on both mixed signal modeling and UVM-AMS; in this event they will elaborate on the latter. This technical workshop will walk the audience through a worked example to illustrate key pieces of this approach and give a preview of how this standard will expand the ecosystem for AMS verification to allow vendors and users to create and share compatible verification components and use them in existing UVM environments. Well worth attending, I think.

The CDC/RDC (reset domain crossing) session starts with an intro to the basics on domain crossings. The second half will be another must-see for anyone working with IP verified against one CDC/RDC tool which must be verified at the system level using a different CDC/RDC tool. A demo will highlight different steps of the CDC verification flow. A small and illustrative RTL test case with at least two EDA verification tools will be used to raise awareness about the importance of a new standard to make CDC models portable and reusable between different tools.

IP-XACT and SystemC

IP-XACT has been around for a while and is well-accepted as a standardized format for IP meta data relevant to integration, but how widely is it used as an integration platform? The IP-XACT discussion comes in two parts, starting with a tutorial on the basics of the standard including aspects relevant to integration and the hardware/software interface. The second part addresses industrial practices from EDA vendors, IP providers, and IP integrators: Agnisys, Arteris, Infineon, and Intel. That I think should be very interesting – I’m always eager to hear more about IP-XACT integration practices in production.

There is also a SystemC evolution day planned to review upcoming standard advances and for experts in the field to network and exchange ideas.

AI panel (because AI)

You can’t have a conference these days without an AI topic. Accellera chair Lu Dai features as a panelist on this panel, titled “All AI All the Time”. They will discuss how AI can best be applied in verification objectives. I’m sure discussion will be fairly free ranging 😊

REGISTER before you forget!


S2C’s FPGA Prototyping Accelerates the Iteration of XiangShan RISC-V Processor

S2C’s FPGA Prototyping Accelerates the Iteration of XiangShan RISC-V Processor
by Daniel Nenni on 10-30-2023 at 10:00 am

Pic1

S2C announced that the Beijing Institute of Open Source Chip (BOSC) adopted its Prodigy S7-19P Logic System, a VU19P-based FPGA prototyping solution, in the development of the “XiangShan” RISC-V processor. S7-19P not only accelerates the iterations of processor development but also simplifies other companies to realize XiangShan-based SoCs.

RISC-V, an open instruction set architecture, has increasingly become the focus of global processor development. Among them, “XiangShan” is a high-performance open-source RISC-V processor core and is considered an international leading representative of the RISC-V industry. Since the launch of its first generation, “XiangShan” has received over 2,500 stars and 277 forks on GitHub, making it one of the most followed open-source hardware projects internationally. To date, “XiangShan” has launched two generations, with the third generation under development. Industry-leading companies are adopting “XiangShan” and conducting further development for various applications and expanding the RISC-V ecosystem.

In the adoption of the “XiangShan” project, the key role of the Prodigy S7-19P Logic System is allowing software development and profiling in high-performance FPGA prototyping. This allows the software and hardware engineers of “XiangShan” to work in parallel, significantly shortening the development process. A BOSC representative added, “Due to the diversity of RISC-V, our clients need to survey different RISC-V cores to find the right one matching their applications. S2C’s FPGA prototyping enables us to showcase processor performance through the SPEC benchmark. It is also a must-have tool for I/O verification and BSP driver development. S2C’s solution covers the entire cycle from hardware design to software integration and client test drivers, making it easier for our clients to choose the most suitable solution and proliferation of the ‘XiangShan’ core.”

SPEC Benchmark:
SPEC benchmarking can verify whether the expected performance is achieved. By leveraging S2C’s Prodigy, the “XiangShan” team can conduct the performance evaluation by running Linux with a graphical interface. This provides the team with valuable feedback for more effective optimization.

I/O Verification:
S2C’s Prodigy provides an actual environment for testing and verifying all input/output communication channels in XiangShan. FPGA prototyping is used to ensure seamless integration and communication with other hardware components like memory, storage, and other interfaces. The “XiangShan” team has adopted various S2C’s daughter cards and interfaces, including flash, GMAC, and PCIe, and the overall system operates at 50MHz.

BSP Driver Development:
BSP (Board Support Package) driver development ensures smooth interaction between software and hardware. With FPGA prototyping, developers can develop and test the BSP on actual hardware, ensuring hardware-software co-development. This parallel approach thereby improves development efficiency and accuracy. Once the “XiangShan” hardware design is ported to S7-19P, the BOSC software team immediately embarks on BSP driver development. This method allows the software team to gain a deeper understanding of hardware features and limitations, ensuring optimized hardware design for “XiangShan” before the final tape-out and accelerating software development.

“‘XiangShan’ is a leading high-performance RISC-V processor core,” another BOSC representative stated, “S2C’s FPGA prototyping laid a solid foundation for the XiangShan project. We chose S2C because of their outstanding technology and services. They have injected great momentum into our project.”

Mr. Ying Chen, VP of Sales & Marketing at S2C, also commented, “We are glad that our Prodigy FPGA prototyping solutions accelerate the XiangShan project and meet a wide range of target market needs. In the future, we will work with more partners to expand the RISC-V community for the prosperity of the RISC-V ecosystem.”

About Beijing Institute of Open Source Chip
RISC-V has developed rapidly in recent years and become the focus of international scientific and technological competition. To improve China’s IC design level and build a technology platform connected with the international open source community, Beijing City and the Chinese Academy of Sciences have prioritized development in RISC-V, and organized a number of leading domestic enterprises and top scientific research institutes to establish the BOSC on December 6, 2021. The institute gathers the consensus of industrial development with open source and acceptance, stimulates application traction potential through collaborative innovation, and strives to promote integrating the RISC-V innovation chain and industrial chain, as well as accelerate industrialization in scientific and technological innovation achievements, and the creation of the world’s leading industrial ecosystem of RISC-V.

About S2C
S2C is a leading global supplier of FPGA prototyping solutions for today’s innovative SoC and ASIC designs, now with the second largest share of the global prototyping market. S2C has been successfully delivering rapid SoC prototyping solutions since 2003. With over 600 customers, including 6 of the world’s top 10 semiconductor companies, our world-class engineering team and customer-centric sales team are experts at addressing our customer’s SoC and ASIC verification needs. S2C has offices and sales representatives in the US, Europe, mainland China, Hong Kong, Korea, and Japan. For more information, please visit: www.s2cinc.com and more details about vu440, vu13p, vu19p board, vu9p FPGA, etc.

Also Read:

ViShare’s Rapid Market Entry with FPGA-Based Prototyping Solution from S2C

Systematic RISC-V architecture analysis and optimization

Sirius Wireless Partners with S2C on Wi-Fi6/BT RF IP Verification System for Finer Chip Design


Developing Effective Mixed Signal Models. Innovation in Verification

Developing Effective Mixed Signal Models. Innovation in Verification
by Bernard Murphy on 10-30-2023 at 6:00 am

Innovation New

Mixed-signal modeling is becoming more important as interaction between digital and analog circuitry become more closely intertwined. This level of modeling depends critically on sufficiently accurate yet fast behavioral models for analog components. Paul Cunningham (Senior VP/GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome.

The Innovation

This month’s pick is Fast Validation of Mixed-Signal SoCs. The paper was presented in the 2021 Journal of the Solid-State Circuits Society. The authors are from Stanford, Seoul National University and Scientific Analog.

A recent SemiWiki blog on mixed signal captured enormous interest, suggesting this is an area worth further study. A critical step to realize effective mixed signal verification is to develop accurate mixed-level behavioral models for analog functions which are suitable for event-driven simulation, and even synthesizable models for deployment in hardware emulation. The paper describes a template-based approach to generating models and two methods to interpolate analog behavior to event-based connections: oversampling and event-driven modeling with feature vectors (real number models).

The authors demonstrate application to a high-speed link simulation and emulation with impressive results. Comparison between Spice and Verilog simulation on the ADC shows close correspondence in results, running orders of magnitude faster. Emulation-based modeling adds yet more orders of magnitude to that speed.

Paul’s view

Big context-swap this month into the world of analog verification and its “mixed-signal” intersection with digital verification. This paper is an invited paper in a prestigious journal which beautifully summarizes state-of-the-art to build abstracted models of analog circuits that can keep up with digital simulation, even on an emulator, and do so with amazingly good accuracy.

In the analog world everything is smooth and usually oscillating, with intended input-output behavior often described by first transforming input/output waveforms into the frequency domain. The gold standard for analog simulation is Spice, iteratively solving device-level differential equations for voltages at all points in a circuit within guaranteed error tolerances. Compared to digital simulation, Spice is thousands of times slower.

The typical approach to creating fast abstract analog models is to do discrete time sampling of the input waveform and then generate the appropriate discrete time sampled output waveform using some DSP-like logic (e.g. discrete-time filters). Signal values between these discrete time points can be generated if needed using linear or spline-based interpolation.

The authors present a complete open-source framework with an elegant model generation language and compiler to generate both simulatable and emulatable models from this language. They use an adaptive time-step sampling method with spline-based interpolation and work through a credible case study using their framework on a 16nm high speed SERDES link PHY. Going from Spice to digital CPU-based simulation with their abstracted models achieves a 13,000x speed-up. Putting the models on an FPGA gave another 300x speed-up. Nice.

Raúl’s view

The validation of mixed-signal SoCs is a challenge, among other things because running sufficient test vectors to validate the digital parts – typically with an event driven simulator or on an emulator – results in prohibitive times to simulate the analog part with a circuit simulator. A solution is the creation of analog behavioral models. This month’s paper reviews several approaches to create these models and presents what the authors believe to be the first complete, open-source framework for AMS emulation. This is an invited paper to the IEEE open journal of the Solid-State Circuits Society, and as such large passages read like a tutorial on analog design and validation. It is quite different to what we have done before in this blog; the reader needs some analog know-how to be able to fully benefit (e.g., Laplace domain, z-transform, PLL, phase interpolator, Nyquist rates, jitter, etc.).

Functional models of analog circuits receive inputs and generate outputs at discrete times. Waveforms can be modelled using piecewise constant or piecewise linear functions, using spline points (the approach used in this paper) or sums of complex exponential functions. Time is modelled as discrete-time (sampled or oversampled) or as piecewise linear modeling (used here). The actual models of circuits are assembled from a library of templates. The authors put all this together in a system consisting of: 1) A Python tool for generating synthesizable AMS models providing a set of functions that allows users to describe AMS blocks as differential equations, netlists, transfer functions, or switched systems, … in either fixed or floating point, and 2) A simulator-like abstraction of FPGA boards.. which provides emulation infrastructure that manages the emulation timestep, emulation clock speed, and test interfaces and generates the FPGA emulation bitstream with the help of EDA tools.

The trick is not using circuit simulation but rather replacing circuit models by functional models. For a high-speed link receiver called DragonPHY the speedup of a Verilog versus a Spice simulation is 12,800x, providing sufficient accuracy. But even this speedup is not enough to simulate the clock recovery and channel equalization loops, to test bit error rates (BER), with feedback loops which may take 100,000s of cycles to settle. Modifying the models so they are synthesizable and can be incorporated into emulation provides further 5000x speedup, sufficient to compute BER within 7.5%. Impressive!

Also Read:

Assertion Synthesis Through LLM. Innovation in Verification

Cadence Tensilica Spins Next Upgrade to LX Architecture

Inference Efficiency in Performance, Power, Area, Scalability


KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good

KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good
by Robert Maire on 10-29-2023 at 10:00 am

KLAC Tencor
  • KLA has an OK quarter in an ugly market- bouncing along bottom
  • Like Lam & ASML, China was huge at 43% represents more risk
  • 2/3 Foundry/logic, 1/3 memory – Process tools were weak
  • No change, stable , no visibility on recovery
Quarter and guide were good in continued ugly industry

As expected KLAC reported earnings at the high end coming in at $2.4B in revenues and $5.41 in EPS. Guidance was also positive at $2.45B+-$125M and EPS of $5.86+-$0.60.

Given that KLA usually runs with a significant multi quarter backlog they should always be able to “dial in” their quarterly numbers to hit the target they want.

While we are down from last year we still have a slow upward cadence despite the industry “bouncing along the bottom”

At 43% of revenues, China becomes a bigger risk & savior at same time

Lam saw China at 48% of business and ASML saw China at 46%, KLA cam in third with China at 43% of business. Not as bad as Lam but at elevated levels that raise our concern about exposure risk to China. We remain surprised that China hasn’t been more negatively impacted.

It also remains clear that China is obviously buying anything that isn’t nailed down and perhaps things that are nailed down.

While most of the China exposure may be for legacy nodes we still think this represents a risk although less of a risk than leading edge which has already been cut back.

Like Lam, without China’s money, business would have been very ugly which is not very heartening.

Process tools suffering

It comes as no surprise that the process tool side of KLA is weaker than process control, the historical wheelhouse of the company. We expect that this portion of business will likely lag in any sort of recovery when it does eventually happen.

The $3.4B acquisition of Orbotech 5 years ago has not exactly been a “barn burner” for KLA.

No talk or idea about timing of a recovery

As we heard with both ASML & Lam there is essentially no clue as to when there will be a recovery in the industry. Things will likely be lumpy and bumpy along the bottom with some sectors being stronger or weaker on a quarter by quarter basis with no clear trend that we can define out of the numbers.

Delays in major projects continue to be one of the biggest drags on business. Its clear that TSMC, Intel, Samsung, Micron and others are delaying new construction and major new projects. We haven’t heard much about any change in that momentum or lack thereof.

We remain concern about reticle inspection

As we mentioned in our recent report from the SPIE photomask show, there has been no news about a new leading edge actinic reticle inspection tool coming from KLA. The balance between KLA’s wafer inspection and reticle inspection used to be a bit more even handed.

As KLA has lost dominance in reticle inspection, wafer inspection is almost twice the revenue of reticle inspection. We don’t see this correcting or rebalancing back to more even levels any time soon.

It remains one of the few key weak points in an otherwise dominant story.

The Stock

We were not blown away by the results and the industry still sucks. Risks with China are higher than ever.

There have not been any significant new technology nodes announced by KLA and customers , with the exception of China, are spending very slowly at sustenance levels.

KLA also continues to live off of a very long backlog built while times were good that are helping it get through the winter but we are concerned about how long that backlog lasts.

Overall our view remains not very positive…..its better than it could have been but far from compelling…..

We are not motivated to take a new position and would continue to lighten up if there was an uptick as we see no new reason to own the shares on the horizon.

KLA remains one of the best run companies, with great financial results but the industry still sucks….its just that simple. You can be the greatest in the world but if industry conditions are weak, its hard to outperform in a meaningful way.

We think investors are figuring out this is going to be a longer, colder winter in the semiconductor industry than we have seen in a long while…..

Also Read:

LRCX- QTR OK but outlook mixed- At half of revs, China is huge risk- Memory poor

ASML- Longer Deeper Downcycle finally hits lithography – Flat 2024 – Weak Memory – Bottom?

ASML- Absolutely Solid Monopoly in Lithography- Ignoring hysteria & stupidity


Podcast EP190: The Growth and Impact of RISC-V and a Peek at the Upcoming RISC-V Summit with Calista Redmond

Podcast EP190: The Growth and Impact of RISC-V and a Peek at the Upcoming RISC-V Summit with Calista Redmond
by Daniel Nenni on 10-27-2023 at 10:00 am

Dan is joined by Calista Redmond, CEO of RISC-V International. Prior to RISC-V International, Calista held a variety of roles at IBM, including vice president of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement across the industry.

Calista outlines the growth RISC-V has experienced over the past few years. She discusses benefits such as design and business flexibility that this global open standard has delivered. Calista reviews the markets that are moving to RISC-V, both today and going forward. She also discusses future development at RISC-V International in areas such as training, development on-ramps, compatibility, and certification.

Calista also provides a preview of the upcoming RISC-V Summit, to be held Nov.7 – 8 in Santa Clara, CA. She touches on product introductions and other announcements, keynotes, and in-depth demonstrations among other topics.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


CEO Interview: Venkata Simhadri of MosChip

CEO Interview: Venkata Simhadri of MosChip
by Daniel Nenni on 10-27-2023 at 6:00 am

Venkata Simhadri

Mr. Venkata Sudhakar Simhadri is a serial entrepreneur with a proven track-record in the semiconductor industry. He was the Founder, President & CEO of Gigacom Semiconductor LLC & Founder / Director of Gigacom India (Both the Companies acquired by MosChip) and the driving force behind establishing IP licensing and design services business with leading semiconductor companies.

Earlier to Gigacom, Venkata was the Founder, President & CEO of Time-to-Market (TTM) from 1998 till its acquisition by Cyient in 2008 and was the head of its Hi-tech Business Unit till 2012. Venkata has 30+ years of experience, primarily working in the USA and India region.

Mr. Venkata is currently the MD & CEO of MosChip Technologies Limited, Chairman of IESA Semicondutor Manufacturing CIG (Core Interest Group),Vice-Chairman of the IESA Hyderabad Chapter, the brains behind the IESA AI Summit started in 2021, and was the General Chair for the recent blockbuster, VLSI Design & Embedded Systems Conference 2023.

Tell us about your company?
MosChip Technologies is a publicly traded (BSE | 532407↗) semiconductor and Embedded system design services company headquartered in Hyderabad, India, with 1300+ engineers located in Silicon Valley-USA, Hyderabad, Bengaluru, Ahmedabad and Pune. MosChip provides turn-key digital and mixed-signal ASICs, design services, SerDes IP, and embedded system design solutions. Over the past 2 decades, MosChip has developed and shipped millions of connectivity ICs. For more information, visit moschip.com

What problems are you solving?
MosChip is a semiconductor design and solutions company that offers a wide range of products, services, and IP (Intellectual Property) portfolio to cater to various industries. The problems that MosChip is solving across industries include:

Semiconductor Design Challenges: Semiconductor industry has been growing rapidly for the last few decades with the demand in emerging markets like automotive, AI, IOT and etc. As a result, there has been a huge scarcity for experienced chip design engineers. MosChip has been focused on training and creating chip design talent and providing design services to the top semiconductor companies in the world.

Embedded System Development: MosChip has twenty plus years of track record in Embedded product design and has built many products ( both hardware/ software ) for defense, communications, IOT applications. MosChip has been helping customers to build proto-types, validation and releasing the products to markets.

IP Portfolio: Their IP portfolio includes pre-designed and verified intellectual property blocks, which can save time and resources for companies looking to integrate proven technology into their products. This can be especially useful for speeding up product development cycles.

Industry-Specific ASIC Platforms/Solutions: MosChip has been investing in RISC-V based platforms for IOT, Industrial and Automotive applications that includes both Analog/ Mixed-signal and digital building blocks. Leveraging the platform, MosChip can provide quick turn-around for building custom silicon ( turn-key ASICs ) for customers looking for optimizing their products.

In summary, MosChip addresses a wide range of challenges across industries by offering semiconductor design services, a diverse IP portfolio, Embedded system design services. These services aim to help companies innovate, improve product quality, reduce development time &cost, and stay competitive in their respective markets.

What application areas are your strongest?
Our strongest application areas include Consumer Electronics, Networking, Industrial Automation, automotive electronics, smart cities, Government, and healthcare. In these domains, MosChip has a proven track record of delivering customized semiconductor and embedded solutions that enhance performance, reliability, and efficiency.

What does the competitive landscape look like and what are your collaborations across various sectors?
The competitive landscape in our industry is spread across the world and some of the Indian IT service companies offering similar design services. However, our collaborations with the leading fabs ( MosChip is TSMC’s DCA partner ), EDA Companies like Cadence, Synopsys and Siemens and IP companies give us competitive edge. Most importantly, MosChip’s dedicated focus and Semiconductor industry and the 20+ years of track-record gives us the competitive edge.

What new features/technology are you working on?
We have been investing on technologies such as Artificial Intelligence (AI) and Machine Learning (ML) to enhance our semiconductor solutions. Additionally, we are expanding our capabilities in edge computing and edge applications to provide clients with more comprehensive and efficient solutions.

MosChip is also working on VIDYUT, which is a cutting-edge, fully-integrated polyphase Energy Meter IC designed specifically for Energy Meter OEMs. The platform we are building for this IC using RISC-V has the potential address many different applications.

How do customers normally engage with your company?
As mentioned, MosChip is one publicly-traded companies on Bombay Stock Exchange (BSE) in the Semiconductor companies of India which gives us a basic exposure to the customers. Apart from this, Customers discover us through our personal business network and via our digital presence (on LinkedIn | Twitter | Instagram | Facebook | YouTube | Koo | website). MosChip is also an active member of multiple orgnizations like IESA and My self being the Chairman of the Semiconductor Manufacturing Core Interest Group (CIG) of IESA gives us a great visibility. We are also been the active participants in the Semicon India Conferences and other events relevant to Embedded Systems, AI/ML, etc.

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Keynote Speakers Announced for IDEAS 2023 Digital Forum

Keynote Speakers Announced for IDEAS 2023 Digital Forum
by Daniel Nenni on 10-26-2023 at 10:00 am

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As we all know, hearing directly from the people who actually use EDA tools, people who are solving real world problems with the latest technologies are the best source of information. Thus EDA User group meetings are always first on my event list every year which brings us to Ansys Ideas.

Ansys User Group Meeting Features Technical Presentations from World’s Leading Semiconductor, Electronic, and Photonic Companies

Join Ansys on November 30, 2023 for the IDEAS 2023 Digital Forum. With almost 30 technical presentations, keynote speakers, and panel discussions from some of the world’s leading electronic and semiconductor design companies, IDEAS is one of the foremost technical showcases for the latest trends in semiconductors, electronics, and photonics.

IDEAS is Ansys’ annual user group meeting for our semiconductors, electronics, and photonics customers and partners. This free, virtual event  brings together more than 1,000 professional attendees from around the world and serves as a global platform to explore limitless possibilities in the field of electronics industry. This digital conference provides case studies for artificial intelligence/machine learning (AI/ML), high-performance computing (HPC), telecommunications, low-power design, signoff voltage/timing analysis, and electromagnetic modeling.

All presentations are delivered by industrial production engineers actively working on some of the world’s leading electronic design projects. Participants can delve into these insightful sessions and visualize intricate concepts, gaining a deep understanding of latest advancements in electronics and semiconductor industry. By joining the day of, you will have a unique opportunity to interact directly with presenters who will be available to answer questions from the audience.

In addition to Ansys customers, IDEAS also hosts contributions from our electronics design partners, including major EDA design tool suppliers. Ansys is committed to supporting open and extensible design platforms that enable designers to create customized solutions using the best technology from across the industry.

IDEAS 2022 featured technical speakers were: Nvidia, Qualcomm, AMD, Intel, Samsung, Meta, MediaTek, NXP, and more.

IDEAS 2023 will kick off with three executive keynote presentations.

Prith Banerjee, chief technology officer of Ansys, will give his perspective on the major trends and developments in electronic design today. Lalitha Immaneni, vice president of architecture, design, and technology solutions at Intel, will present her executive keynote of the latest semiconductor and packaging technologies from Intel. Murat Becer, vice president  of engineering for semiconductor products at Ansys, will deliver a technology keynote announcing the latest technology breakthroughs by Ansys.

Following the keynote speakers are multiple technical tracks with topics including:

  • Power integrity analysis and signoff.
  • 3DIC and thermal analysis.
  • AI/ML for multiphysics convergence.
  • Early RTL power analysis, electromagnetic simulation, and modeling.
  • Photonic design.

The final agenda will be available on the registration page in the coming weeks. Register now to reserve your seat and add IDEAS 2023 to your calendar.

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Chiplet Q&A with John Lee of Ansys