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A Brief History of CLKDA: Every Picosecond Counts Below 28nm

A Brief History of CLKDA: Every Picosecond Counts Below 28nm
by Paul McLellan on 02-25-2015 at 7:00 am

One thing to point out is that the CLK of CLKDA are the initials of the founders, they are not focused on clocks! I’m sure you can guess what DA stands for, although it is also the last two letters of the fourth founder’s name.

They have been in existence since 2005, backed by Atlas Ventures and Morgenthaler. They are headquartered in Littleton, MA just outside Boston. The CEO is Isadore Katz.

In the early days they did some other stuff (STA) but they have since pivoted and now CLKDA is the market and technology leader in timing variance analysis. FX is the first transistor model and simulator specifically engineered for digital variance and delay analysis. FX is in production at the most advanced IC geometries at 20nm, 16nm and 14nm, with all of the leading foundries. CLKDA drove the creation of Liberty Variance Format (LVF), the open standard for modeling timing variance.

Starting at 40nm, manufacturing variance became a serious issue that had to be addressed during timing sign-off. Traditional manufacturing corners were no longer sufficient. If designers ignored manufacturing variance, yield would suffer when it bit them. But over-compensating didn’t work either: the center of the distribution of timing (typical) moved from the previous node, but excessive pessimism meant that worst case was almost unchanged, making timing closure next to impossible, and wasting power. To make things worse, the tails were also getting longer.

CLKDA brought together a team of EDA and semiconductor veterans with expertise in timing, circuit design, and simulation, as well as applied mathematics and distributed computing. The result was a very efficient, fully distributed static timing framework combined with a radical new circuit simulator and model called FX—the first transistor level model specifically designed for timing delay and variance. What makes FX special is its ability to model timing variance without using sampling—variance is solved mathematically. FX can literally be tens of thousand of times faster than MC SPICE, and stay within 2% of SPICE results.

CLKDA began development of FX in collaboration with TSMC in 2008. The first targeted application was the efficient generation of stage-based on-chip variation tables (SBOCV aka AOCV) for use during sign-off timing. Generating these tables consumed literally months of Monte Carlo SPICE simulations, and a much better solution was required.

The result was AOCV FX. Introduced at DAC 2010, and included in TSMC Reference Flow 11, AOCV FX was the first commercial solution for generating SBOCV and AOCV tables. Using the FX model, AOCV FX is thousands of times faster than using Monte Carlo SPICE for generating derate tables with the same compute resources. AOCV FX made SBOCV and AOCV table generation a practical reality.

Since 2010, FX has evolved into family of products that address high accuracy timing and variance. Each of the FX Applications solves mission critical problems for chip frequency, yield, and time to market. They complement existing sign-off flows by adding variance information (e.g. derates) or addressing critical gaps in the flow (critical path timing waivers).

In 2013, Variance FX was introduced to extend CLKDA’s derate analysis. In addition to AOCV, Variance FX supports POCV, SOCV, and Liberty Variance Format. It generates delay and slew variance information, as well as variance models for timing constraints (set up and hold uncertainty). Macro FX was introduced in 2014. Macro FX extends Variance FX for complex functions such as flop trays, retention flops and other large custom cells.

Path FX was introduced along with AOCV FX. Path FX delivers Monte Carlo SPICE accurate timing with the ease of use and performance of a general purpose, static timing analyzer. Path FX can run tens of thousands of paths in minutes with MC SPICE accuracy. In 2013, Clock FX was introduced to address the specific requirements of high analysis clock trees.

CLKDA is extending its product capabilities to address any part of an SoC where digital circuitry could fail due to variance; at the cell, path or full chip level. So if you are designing a chip (or some IP) in an advanced node then you need to worry about variance and preemptively address it.

CLKDA’s website is here.


Samsung 14nm IS in Production!

Samsung 14nm IS in Production!
by Daniel Nenni on 02-24-2015 at 10:00 pm

There is quite a debate raging on whether Samsung Foundry is truly in production at 14nm. The word amongst the fabless semiconductor ecosystem is yes and this comes from two very large fabless companies that are reportedly using Samsung for 14nm and have even started looking at Samsung 10nm. Of course you can Google for stories by the foreign press about this and find just about whatever you need to support either side of this argument which is what many people have done. The fact of the matter is that the fabless semiconductor ecosystem is a very close knit industry so there are no secrets.

Really, all you have to do is attend some of the many conferences we have every year and talk to the people who actually do the work. SPIE and ISSCC are both this week. CDNLive is coming up as well as SNUG and User2User which are filled with semiconductor professionals from Silicon Valley and let’s face it Silicon Valley is where most of the fabless semiconductor magic happens, absolutely.

Still there seems to be some confusion about which process the upcoming Apple products will use. Again, the iPhone will have Samsung 14nm based ULP SoCs and the iPad will have TSMC 16FF+ based SoCs which represents about a 70/30 wafer split in favor of the iPhone of course.

Speaking of SoCs, in the SemiWiki SoC Forumthere is a thread about the latest Intel 14nm Cherry Trail SoC benchmarked against the 20nm Apple A8x, the 20nm SnapDragon, and the 14nm Exynos. Not a pretty picture which begs the question: Is it the design or the process? You gotta love open forums for a constant flow of raw information, crowdsourcing at its finest! Just pick a SemiWiki forum of interest and subscribe to it, simple as that.

Another data point about Samsung being in production at 14nm is a mailer I just received. (Yes, I’m on just about every mailing list imaginable!):

Collaborating with its top-tier design enablement and IP partners, Samsung has been
working steadily to ensure that its first FinFET node offers industry-leading power/
performance/area.

With 14nm FinFET fully qualified, Samsung Foundry has begun production at our manufacturing facilities in Korea and the U.S. Customers looking to start a 14nm FinFET design also have access to Samsung Foundry’s regional design teams to ensure the chip design is optimized for first time silicon success.

Check out the latest 14nm news from Samsung foundry business

Samsung Foundry Website

Samsung Foundry Blog

Samsung 14nm FinFET Datasheet

Follow Samsung Foundry

Samsung Foundry
Advanced process technologies, manufacturing expertise, and first-class services
Learn why Samsung Foundry is a critical resource for competitive fabless and integrated device manufacturer semiconductor companies. Samsung Foundry offers deep expertise in advanced process and design technologies as well as an excellent track record in high-volume manufacturing. We offer a full range of foundry capabilities from design engagements to turnkey projects, with a focus on leading-edge process technologies from 90nm to 32/28nm on 300mm wafers and beyond.

Benefit from Samsung’s optimized foundry solutions
By outsourcing some or all of the design and manufacturing details to Samsung, you can be confident of maintaining the highest possible product quality while saving time and cost. Samsung Foundry provides a full range of solutions including advanced process technology, design services, design intellectual property (IP), and manufacturing facilities. Customer support is available at every step, from the initial engagement to volume manufacturing. And customer IP is stringently protected.


ASML ASyMptotic progress- When will we get to EUV?

ASML ASyMptotic progress- When will we get to EUV?
by Robert Maire on 02-24-2015 at 5:30 pm

  • ASML making progress – but is it fast enough?
  • ASML has missed 10nm , can it catch 7nm? An economic question
  • Day one at SPIE- Better tone than last year but still cautious

1000 simulated wafers versus 700 simulated
At the opening of the SPIE conference ASML announced that TSMC had reached 1000 wafers a day “exposed” (not printed or produced) by TSMC.

This is significant in two ways; though still just a simulation and not a real test of real wafer production it is a higher theoretical number than the test numbers “leaked” out by IBM over 6 months ago. The second and perhaps more important is that the test was run by a real contender in the semiconductor arms race, TSMC who last year embarrassed ASML at SPIE by announcing that the tool had shot itself in the foot. This would seem to imply that TSMC is more supportive which is also evidenced by their continued purchases of tools.

Is progress fast enough? Zeno’s paradox…

Though progress is clearly being made , we remain concerned that the amount of money and effort being put into EUV is producing fewer and smaller gains as we try to get closer to a “production” system. It would appear much like Zeno’s paradox or an asymptotic curve that incremental progress is slowing as we get closer to the goal.

The announcement of 90 watts of power is certainly better than the 75 watts previously discussed but it would have been a lot better to be talking about a doubling to 150 watts especially as we live in a binary world of Moore’s law.

Catching a moving Moore’s law train … That already left the 10nm station
The reason for our concern about progress rates is that the industry and Moore’s law is not waiting around for EUV to catch up. From discussions with a number of people at the show its clear that 10nm is long gone (as has been known by those in the industry) but the new question is how much, if any, of 7nm can ASML catch. Whereas there never seemed much very serious talk of ASML making 10nm (except by ASML) there is a lot of speculation about a 7nm intercept.

Economics enters the picture
Everything always comes down to the final arbiter of money. This year at SPIE there is clearly more talk about the cost of EUV versus multi-patterning. There was a good presentation of the cost of HiNA (high numerical aperture ) EUV versus multi-patterning.

We have suggested in the past that there should be an economic crossover point from multi-patterning where the EUV production decision becomes clear but it sounds as if that line is blurring a bit. Part of the reason is that the delay in EUV has caused other complications that may confuse the simple economic choice for EUV. One example is the need for multi-patterning in EUV anyway by the time it gets to HVM, thereby taking away one of the positive attributes . However its still hard to see how multi-patterning can win in the long run as we hear talk about quad and “oct” patterning as if they were viable alternatives forever.

It would be wrong to underestimate the semiconductor industry’s aversion to change…..and the industry has gotten very comfortable with multi-patterning.

No Breakthroughs or new news…

There does not appear to be any new news or break through moments so far at SPIE with ASML’s announcement being a ho hum confirmation of the slow pace rather than a positive surprise.

Alternatives not ready
DSA (directed self assembly) , NIL (nano imprint lithography) and direct write E beam lithography are still works in progress further behind than EUV but also not showered in money as EUV has been.

Canon appears to be furthest along with using NIL at Toshiba for NAND production and we wouldn’t be surprised to see it in limited use at some point. The talk of alternative technologies at the show has quieted as discontent with EUV has abated a bit.

Infrastructure not ready
The “ecosystem” for EUV is further behind than EUV itself and will clearly limit the introduction of EUV whenever it really becomes available. This is not new news as we have been talking about it for a long time and the problem has not changed nor have there been any changes in the significant participants, such as KLAC. This remains a major bottleneck for EUV’s progress to HVM.

No stock impact
As there isn’t anything incrementally positive to find at SPIE so far, we see no reason for any significant change in stock valuation. EUV remains a work in progress without a clear insertion point and alternatives have their issues as well.

We do continue to believe that both Lam and AMAT will have a long positive run in etch and dep to support multi-patterning which will clearly be around for quite a while.

Robert Maire
Semiconductor Advisors LLC


High Level Synthesis Gets Stronger

High Level Synthesis Gets Stronger
by Daniel Payne on 02-24-2015 at 1:00 pm

High Level Synthesis (HLS) tools have been around for at least two decades now, and you may recall that about one year ago Cadence acquired Forte. The whole promise of HLS is to provide more design and verification productivity by raising the design abstraction from RTL code up to SystemC, C or C++ code. With any acquisition it is natural to ask a few questions, like:

  • Which EDA tool will live, and which will die?
  • What is the new product roadmap?
  • What happens to all of my legacy design work, will it be supported?

I spoke with David Pursley of Cadence on Monday to get an update on what they’ve been doing for the past 12 months in HLS. The really good news is that they’ve combined the best features of the Forte Cynthesizer tool with the Cadence C-to-Silicon Compiler tool, and named it Stratus HLS.

Related – Cadence Acquires Forte

This means that any customer already using Cynthesizer or C-to-Silicon Compiler can continue using their favorite HLS tool, or upgrade to the Stratus HLS tool to get the best of both tools. The Stratus HLS learning curve for existing users will be quite brief. The overall design flow stays the same where you can perform functional simulation with Incisive, formal analysis with JasperGold, HLS with Stratus, and logic synthesis with Encounter RTL Compiler:

Zooming in a bit into the HLS flow there is the familiar input languages (SystemC, C, C++) and RTL output:

Users of Stratus HLS manage the big picture items:

  • Function
  • Architecture
  • Constraints

Automation from Stratus then boosts productivity by managing:

  • Schedule of operations
  • FSM encoding
  • Area reduction
  • Timing
  • ECO
  • Clock gating
  • Pipeline registers
  • Consisten RTL style
  • Sharing datapath components

You can start to think about using this type of HLS on your next SoC design including both control and datapath logic, instead of constraining HLS to only DSP blocks. The interface IP and floating-point IP give you a re-use head start with synthesizable optimized SystemC building block.


Graphical analysis with links to source code

Blu Wireless Technology is an early user of Stratus HLS and they designed a multi-gigabit modem and have an early working prototype thanks to the automation provided even while the specifications were changing.

Related – White Paper about Blu Wireless

HLS has just become stronger as Cadence offers up the Stratus HLS tool as a combination of Forte Cynthesizer and Cadence C-to-Silicon Compiler tools. The HLS market continues to grow because users can measure their productivity improvements, QOR and benefits from high-level IP re-use.

Related – SystemC HLS Methodology


eSilicon Just Taped-out a SonicsGN-based SoC. And It’s Not a Secret

eSilicon Just Taped-out a SonicsGN-based SoC. And It’s Not a Secret
by Paul McLellan on 02-24-2015 at 7:00 am

I slipped into the shadows at the back of the bar in the Tenderloin. Mid-afternoon on a weekday, almost nobody in there.

“So you’re with the NSA?” I asked.

“I can’t confirm that,” the man said.

“The Network Stealing Agency.”

“That’s not what it stands for,” he said indignantly. “It’s the National Security Agency. We ensure…well, that nothing bad happens.”

“And what have you stopped?”

“I’m not cleared to that level. But I’m assured something, so I’m sure it would have been bad. Anyway, I hear you have found out something about a network. We are always interested in networks.”

“Indeed. Apparently Sonics have been used as the NoC on a big SoC that eSilicon have been doing for a customer. They just taped-out.”

“Knock?”

“No, not knock. NoC. Network-on-Chip. They used SonicsGN. It is their most advanced NoC.”

“How did you find this out? Did Edward Snowden leak it to you?”

“They put out a press release this morning.”

“Cunning. Hiding their secrets in plain sight. Like that Edgar Allen Poe story.”

“I don’t think they want it to be secret. You mean you didn’t know this already? You could’ve just read the news-wire.”

“That’s not our style. We like to be more indirect. We break into the company that makes the simcards for mobiles and steal the encryption keys for all the phones. Then we listen to all the calls. Then we run them through speech-to-text. Analyze for keywords. Run them through our million-server cloud farm datacenters. We know if anything important is going to happen pretty quickly. Maybe just a week later. I bet these Sonics and eSilicon people have been talking.”

“I’m sure they have. And the customer. There has to be a customer. eSilicon doesn’t make chips for themselves. They are a fabless ASIC company.”

“So it is a secret who the customer is. Secrets are our business. I bet we could find out who it is.”

“You will have the answer in a few months?”

“Maybe quicker. So why did these guys pick Sonics? It seems like it might be a big deal.”


“It was very high performance, 500GB/sec. They needed lots of flexibility. The schedule was aggressive so they wanted confidence that place and route would be straightforward and that timing closure would be fast.”

“Is it a big chip?”

“Yes, but much smaller than it could have been. With SonicsGN they didn’t waste all the area that hand-created interconnect based on buses would need.”

“So this network-on-chip thing. It’s all state-of-the-art multimode fiberoptic?”

“No, chips don’t work like that. It’s all copper.”

“Copper! Like in the olden days. Very retro. Are these guys all hipsters?”

“Right. All self-respecting IC designers wear scarves and hats, and ride fixies.”

“Really,” he said. “I didn’t know that. Do they all drink PBR?”

I sighed. “And some process technologies don’t just have copper. They even have air gaps to increase performance.”

“Air gaps. That’s something I know about. When an organization doesn’t have external connections to the Internet. We need to use cunning to get across an air gap, like with compromised thumb drives. Or turning their cell-phone microphones on and listening to their typing.”

“Is that really a thing?”

“I couldn’t possibly say. So how do I find out more about these NoCs?”

“There is an introductory webinar you can watch. NoC 101. The chief technology officer of Sonics presents it.”

“An officer? Like a 4-star general?”

“Not exactly. Are you interested in power?”

“Of course. We are the government. Oops, slip of the tongue. I mean we ‘work for’ the government. But yes, we are interested in power. The more the better.”

“That’s not how chips work. We like less power.”

“Less power. Who ever got anywhere with less power? Don’t you guys read Machiavelli?”

“Otherwise the chips get too hot. There is another webinar about that. NoC 102. That officer guy presents that one too. You can learn things like how the NoC can automatically power up and down blocks without the control processor being powered-up.”

“So how do I find these secret webinar thingies?”

“They are not secret. They are on the Sonics website. Just go to sonicsinc.com/resources/webinars.”

“Wow. So simple. I’ll get some supercomputers downloading and analyzing them immediately.”

“You could be watching in seconds on your phone.”

“They don’t let us have our own phones. Too big a security risk. We may not be the only people to steal all the simcard keys.”

“I need to go,” I said. “I have a piece to write.”

“So where do you publish?”

“SemiWiki. We follow the industry so you don’t have to.”

The Sonics press-release is here.


Advantages when Designing with FD-SOI

Advantages when Designing with FD-SOI
by Daniel Nenni on 02-23-2015 at 7:00 pm

In total we have blogged 41 times about FD-SOI on SemiWiki which has drawn an audience of 202,960 thus far. Of that traffic 31.68% came directly to SemiWiki (Newsletter), 30.13% came from search, 26.17% from social media (LinkedIn, FaceBook, Twitter, Google+, Reddit, etc…), and 11.99% came from other referring sites. The most interesting number here is “search” which means more than 60,000 visits were from people searching for FD-SOI related topics over the last two years. So, if there is a question in your mind as to when FD-SOI will come to the mainstream semiconductor market the answer is very soon, absolutely.

Speaking of FD-SOI, there is a workshop this week during the ISSCC conference in San Francisco sponsored by STMicroelectronics. The theme of ISSCC this year is SILICON SYSTEMS — SMALL CHIPS for BIG DATA which fits nicely with FD-SOI because big data will require small ULTRA POWER EFFICIENT chips.

Please notice that at 11:20am I will be moderating a panel on “Advantages and Opportunities when Designing with FD-SOI.” I’m working on questions for the panelists so please let me know in the comments section if you have any. Lunch will be offered to all the attendants. Registration is mandatory, free and open to everyone. I hope to see you there: SOI Consortium FD-SOI and RF-SOI Forum

Friday, February 27[SUP]th[/SUP], 2015 in San Francisco, USA

Leading companies are joining the SOI Industry Consortium to organize a forum covering planar FD-SOI as well as RF-SOI technologies. The full day workshop will be held in San Francisco (Palace Hotel) on Friday February 27[SUP]th[/SUP] 2015, the same week of ISSCC. A broad range of technology and design leaders from across the industry such as Cadence, Ciena, GlobalFoundries, IBM, IMEC, Samsung, STMicroelectronics, Synopsys, VeriSilicon will present compelling solutions about FD-SOI and RF-SOI technologies, including competitive comparisons and product results.

The day will be articulated as following:
[TABLE] style=”width: 100.0%”
|-
| style=”width: 47px” | 8.00am
| Registration
|-
| style=”width: 47px” | 8.30am
| Welcome Speech – SOI Consortium introduction
|-
| 8.40am
| FD-SOI Workshop – FD-SOI Foundry Offer

  • FD-SOI advantages for applications and ecosystem (by Philippe Magarshack, STMicroelectronics)
  • 28FD-SOI: Cost effective low power solution for long lived 28nm (by Kelvin Low, Samsung SSI)
  • [Title TBA] (by Jamie Schaeffer, GlobalFoundries)

|-
| 9.40am
| FD-SOI Workshop – FD-SOI IP Offer

  • Synopsys FD-SOI IP Solutions (by Mike McAweeney, Synopsys)
  • FD-SOI: Ecosystem and IP Design (by Amir Bar-Niv, Cadence)

|-
| 10.20am
| Break
|-
| 10.35am
| FD-SOI Workshop – FD-SOI Design Experience

  • [Title TBA] (by Naim Ben-Hamida, Ciena)
  • 28nm FD-SOI Design/IP Infrastructure (by Shirley Jin, Verisilicon)

|-
| 11.20am
| FD-SOI Workshop – Panel Discussion

  • Advantages and Opportunities when Designing with FD-SOI (Moderator: Dan Nenni, SemiWiki)

|-
| 12.30pm
| FD-SOI Workshop – Innovation

  • Driving Profitable Innovation and Rapidly Growing Ecosystems with a Semiconductor Start-up Incubator (by Mike Noonen, Silicon Catalyst)

|-
| 12.50pm
| Morning Conclusion
|-
| 1.00pm
| Lunch
|-
| 2.30pm
| More than Moore Workshop

  • RFSOI: Redefining mobility and more in the front-end (by Mark Ireland, IBM Systems & Technology Group)
  • Towards a Highly-Integrated Front-End Module in RF-SOI using Electrical-Balance Duplexers (by Barend Van Liempd, IMEC / VUB)
  • RF SOI: from Material to ICs – an Innovative Characterization Approach (by Mostafa Emam, Incize)
  • ST H9SOI_FEM: 0.13µm RF-SOI Technology for Front End Module Integration (by Laura Formenti, ST Microelectronics)

|-
| 4:30pm
| Afternoon Conclusions and coming events announcements
|-
| 5:00pm
| Social Event: Cheese & Wine
|-

Hotel location:
Palace Hotel
2 New Montgomery Street, San Francisco, California, 94105 (USA)


CEVA Showcasing Image Processor at MWC Barcelona

CEVA Showcasing Image Processor at MWC Barcelona
by Majeed Ahmad on 02-23-2015 at 1:00 pm

Cameras are becoming ubiquitous thanks to a new wave of applications that span GoPro for sports, smart glass for the Internet eyewear, ADAS for car safety, and more. However, while these cameras boast an increasing amount of megapixels to enhance the quality of vision, what they increasingly need is more processing power to analyze what they see.

That’s because these smart cameras are meant to collect a lot of data and perform complex analysis tasks related to motion detection, object detection, gesture recognition, augmented reality, etc. The solution to the processing needs that come with using advanced software algorithms, according to CEVA Inc., is offloading the device’s main CPU and GPU for processing tasks tied to performance-intensive imaging and computer vision applications.

CEVA is showcasing its MM3101 computer vision and image processing platform at the Mobile World Congress (MWC) in Barcelona next week. The CEVA-MM3101 processor core can be used in system-on-chip (SoC) platforms to offload application processors in mobile devices, wearable electronics, connected cars, surveillance applications and home entertainment systems.

CEVA managers claim that the MM3101 platform is ideally suited for the extreme computational needs in sophisticated computer vision applications for its ability to offload the performance-intensive imaging tasks from the CPUs and GPUs to the DSP. That, in turn, dramatically reduces the power consumption of the overall system, a key value proposition in embedded vision functions like gesture recognition, emotion detection and augmented reality.


An outline of applications supported by CEVA-MM3101

The MM3101 IP platform accelerates imaging and vision applications through software libraries, software tools and ability to offload the CPU through a dedicated framework. CEVA also allows algorithm developers to leverage the MM3101’s programmable architecture to implement their own proprietary software, so they can address unique use cases and differentiate their products.

Android Use Case

According to CEVA, its MM3101 image processor can be easily integrated into an SoC by using the simple interface between the host CPU and the CEVA-MM3101. Here, it presents the Android Multimedia Framework (AMF) as a use case. The AMF feature—which allows Android programmers to access a CEVA DSP core through the application processor on an Android device—can simplify the implementation of vision and imaging apps on Android devices.

The AMF feature allows SoC designers to leverage the performance of the vector DSP directly from the Android environment, offloading the CPU and abstracting any programming and system complexities for software developers. CEVA claims that, while implementing MM3101 image processing core on an Android device, the use of AMF will consume a fraction of power required to run these tasks on a CPU. And that MM3101 can reduce the power consumption by a factor of 50x.

CEVA also presents facial recognition expert nViso as a testament; leveraging the AMF abstraction layers, nViso was able to port its emotion detection algorithms onto the CEVA-MM3101 platform within a week. The CEVA-MM3101 platform has enabled an emotion detection application for nViso that uses 3D facial imaging technology to interpret human emotions and reactions to stimuli. It does this by tracking hundreds of micro-expressions and face movements to gain a more accurate and real-time understanding of the user’s emotions.


CEVA Android Multimedia Framework

CEVA’s Application Developer Kit (ADK) combines a library of computer vision algorithms with a framework for connecting to the DSP platform through the CPU. That lets application developers write C programs on the CPU that call functions on the DSP. The library contains algorithms needed in the vision applications like gesture recognition, facial tracking, and object detection.

Anatomy of Image Processor

In the CEVA-MM3101 computer vision and computational photography platform, the driving force is the vector processing (VP) engine, which performs filtering and the vector-type operations required for pixel processing. It’s based on a dedicated pixel-processing VLIW/SIMD architecture with 10-stage pipeline and contains seven different units that can work in parallel to enable flexible combination for different types of instructions.

The programmable engine can handle 32-byte operations in a single cycle and contains special instructions that can be configured to create proprietary filters for video and imaging processing. Another key feature is the decrease in data bandwidth transfer from the DDR to the core and vice versa. Here, CEVA uses unique patents for data folding and processing on-the-fly to enhance internal memory structure.


CEVA-MM3101 image processor architecture

The vector processing engine can handle large amounts of data for burst-mode image pipeline requirements as well as HD video encoding and decoding without hurting the overall performance. Moreover, it offers optimized kernels for pre- and post-image processing to ensure that CEVA customers, partners and third-party developers can conveniently develop their own apps.

At the MWC in Barcelona next week, CEVA will showcase the updates on its MM3101 image processing platform, as well as the latest versions of its CEVA-TeakLite-4 for smartphones, CEVA-XC4500 catering to LTE wireless infrastructure applications and CEVA-Bluetooth. The company will demonstrate the latest developments in its DSP cores and IP connectivity platforms at the stand 6A50 in Hall 6.

A brief profile of CEVA- MM3101 image processing platform can be seen here.

Image credit: CEVA Inc.

Majeed Ahmad is author of books Age of Mobile Data: The Wireless Journey To All Data 4G Networksand Essential 4G Guide: Learn 4G Wireless In One Day.


GlobalFoundries 2014: a Year of Change

GlobalFoundries 2014: a Year of Change
by Paul McLellan on 02-23-2015 at 7:00 am

GlobalFoundries at the end of 2014 is a very different company from what it was a the beginning of the year.

At the start of 2014, GF was a company with:

  • a CEO in Ajit Manocha who was reputed to be just a safe pair of hands while the company found a new CEO
  • several 200mm fabs in Singapore (the old Chartered fabs) running mature processes, and one small 300mm one
  • a 300mm fab (fab 1) in Dresden, Germany not capable of running leading edge processes
  • a fab (fab 8) under construction in Malta, NY for 20nm, 14nm and beyond scheduled to begin volume production late in the year

They were very late to 28nm, essentially conceding the entire market to TSMC during the first couple of years when the bulk of the money is made. Since everyone agrees that 28nm will be a long-lived process, late is a lot better than never, and the process now seems to be shipping in volume. However, rumors were that their 14nm process development was not going well and was, like 28nm, likely to be late assuming the process eventually yielded acceptably.

Then 2014 started and everything changed.

In January GF appointed a new CEO, Sanjay Jha. His background was at Qualcomm (where he rose to be COO) and Motorola in the mobile business, which since it is the largest semiconductor market ever seen could turn out to be an asset.

Fab 7 in Singapore was upgraded by merging it with the neighboring fab and upgrading everything to 300mm. This is still used for running non-leading-edge processes such as BCD and analog. However, with high-capacity 300mm the economics are much improved, especially for process steps that operate across the whole wafer at once (as opposed to lithography patterning which proceeds a die at a time). Other foundries have also been upgrading their non-leading edge fabs and processes since there is gold in them thar hills.

Next in April, GF announced that they were licensing Samsung’s 14nm FinFET process and would be a true second source in the sense that companies (in particular one whose name is a fruit) could go to either or both of companies for production.

In October at ARM Techcon I attended a panel session where Kelvin Loh of Samsung and Shubhankar Basu of GF presented and the technology transfer seemed to be on-track. Since then there have been rumors about Samsung slipping ramp-to-volume for 14nm but, if anything, that should just make the transfer easier giving it an extra few months to run test wafers.

Then in September and even more significant deal was announced. GF will acquire IBM’s semiconductor division for a sum of…-$1.5B. That’s right, IBM will pay GF billions of dollars to take it off their hands. GF reckons that they can run the business profitably even though IBM could not since foundry is their business and they can run other product in the fabs in a way that IBM was not flexible enough to do. Plus they have IBM as a captive customer for a minimum of 10 years.

The IBM deal comes with two fabs. The old non-leading edge 200mm fab in Burlington, VT running BiCMOS, RF and all sorts of other esoteric stuff; and the leading-edge 300mm one in East Fishkill, NY. It also comes with a lot of people. With IBM having a huge layoff there are also rumors that a lot of extra people got stuffed into the major deals just before the layoff, namely the sale of the low-end server division to Lenovo and the semiconductor division to GF. It remains to see if the economics work.

So at the end of 2014 GlobalFoundries had:

  • a new CEO, who (according to people I’ve talked to) has done a good job of making the company much more focused
  • upgraded fab 7 in Singapore to 300mm with a capacity of 50,000 wafers per month (wpm)
  • the old AMD fab 1 in Dresden with a capacity of 80,000 wpm
  • fab 8 in upstate New York with a peak capacity of 60,000 wpm
  • a 14nm process from Samsung
  • IBM’s semiconductor business and a huge capacity in R&D (of course technically the deal hasn’t closed yet so this statement is really jumping the gun)
  • SOI capacity, although I don’t really know if this is of any interested beyond IBM’s server business which is dependent on it
  • a 300mm fab in East Fishkill although with a capacity of only 14,000 wpm
  • a 200mm fab in Essex Junction VT with a wide portfolio of specialized processes (capacity of about 40,000 200mm wpm)

Quite a transformation in 12 months!


Synchronizer Optimization 101

Synchronizer Optimization 101
by Daniel Nenni on 02-22-2015 at 9:00 pm

A webinar presented Last week introduced two free aids to evaluating synchronizer Mean Time Between Failures (MTBF). The first, MetaACE LTD, is used to characterize the intrinsic parameters needed to calculate MTBF (tau and Tw). This limited version of MetaACE supports up to 250 circuit nodes, which is enough for a typical C-only-extracted synchronizer netlist. You will need the transistor model supplied by your foundry, in addition, but that is all that is required to get an approximate value for the MTBF at any process corner, value of supply voltage or junction temperature.

To calculate the MTBF of a synchronizer based on a fully extracted netlist will require the professional version ofMetaACE. This tool is typically used before tapeout, but the limited version is useful at an earlier point in the design cycle to compare different synchronizer designs. It can also be used to optimize a design for synchronizer service where clock-to-Q can be allowed to increase in order to minimize metastability resolving-time.

Another aid introduced during the webinar was A Public Synchronizer design that can serve as a benchmark to compare with a standard-cell flip-flop you may be planning to use. This Public Synchronizer is a straightforward master-slave circuit that includes a scan circuit for good testability. However, the layout of its regenerating transistors has been optimized for synchronizer service.

If you are contemplating solving a clock-domain-crossing issue with a synchronizer, it might be a good idea to take a look at the Blendics webinar to see if these free aids to design might be useful to you.

A UNIQUE APPROACH
In essence, we have focused our solution on how IP-Cores and other components communicate. Traditionally, IC components communicate synchronously via a global clock that controls each and every individual component and forces them to talk to each other in lock-step. So, we asked the question, how can we find a better way to support more robust communication requirements while not asking design teams to throw out existing IP or having to learn new approaches to designing IP?

OUR ANSWER
a globally asynchronous design methodology where we break the IC design into small independently operating IP-Cores and then re-connect each of the cores to each other, allowing each to communicate on its own timescale.

THE “AHA” MOMENT
It was 2004, and three of our founders were attending an international symposium they organized on Clockless Computing (Coordinating Billions of Transistors), at Washington University in St. Louis, Missouri. In the program, leaders in asynchronous computing reviewed future design challenges imposed on IC densities according to Moore’s Law.
We saw that work on asynchronous computing done decades earlier toward the goal of arbitrarily-large, discrete-component computer systems would be relevant again, this time at the microscopic scale. These older clockless techniques could be blended with modern clocked methods to solve the anticipated complexity and reliability challenges and thereby achieve continued Moore’s Law scalability. Bingo! we said to ourselves.

THE FORMATION OF BLENDICS

So, after much discussion and excitement, we determined that we could make a real difference. We brought together an astonishing group of mega-talented people who have each had a significant hand in some of the world’s most impactful technological innovations over the last 50 years, and in 2007, launched Blendics.

Our name “Blendics” can be deconstructed as: Blended Integrated Circuit Systems.


Product Review: Google Chromecast

Product Review: Google Chromecast
by Daniel Payne on 02-22-2015 at 1:00 pm

Our household members own both Apple and Android devices, so we wanted a way to share our photos or videos on the Samsung TV. The device we ended up buying is called Chromecast from Google, and it’s a small media streaming device that plugs into an HDMI port on our TV. We’ve had Chromecast for about six weeks now.


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