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DAC Keynotes: Mark Your Calendar

DAC Keynotes: Mark Your Calendar
by Paul McLellan on 04-03-2015 at 7:00 am

DAC starts in San Francisco on June 8th. The kickoff keynote at 9.20am that morning is by Brian Otis of Google. He is a director at Google[x]. According to Wikipedia:Google X, stylized as Google[x], is a semi-secret facility run by Google dedicated to making major technological advancements. It is located about a half mile from Google’s corporate headquarters, the Googleplex, in Mountain View.
Brian is also a Research Associate Professor at the not-so-secret University of Washington in Seattle. His keynote is titled Google Smart Lens: IC Design and Beyond. Google Smart Lens is a contact lens that also continuously monitors blood sugar levels for diabetics. Last July Novartis announced that they were partnering with Google to create a commercial product. One of the things that will change as wearable medical products become widespread is this type of continuous monitoring. Today we have very little information about our bodies when we are sick, and pretty much none when we are healthy.But this is DAC and so is about design. In Brian’s own words:I’ll share thoughts on the scarcity of power, extreme miniaturization, and end-to-end connected systems that span the design space from transistors to the cloud. Along the way, I’ll cover chip design techniques for body-worn systems and wireless sensors and present examples of constantly-connected devices for improving healthcare. These areas present tough unsolved problems at the interface between the IC and the outside world that cannot be solved by transistor technology scaling alone. Novel power sources, low power IC design techniques, microscale user interface technologies, and new system integration techniques will be a few of the enabling technologies for these emerging systems.
Tuesday’s keynote is also at 9.20am and is by Jeffrey Owens who is the CTO at Delphi Automotive. His talk is titled The Design of Innovation That Drives Tomorrow. When people think of high tech devices, the first things that come to mind are not cars, trucks and vans. Today’s vehicles possess more processing power than anything most consumers own or will purchase. A typical car is equipped with more than 50 computers designed to operate at automotive grade capabilities for an extended period of time. Electronics and design automation will play a critical role in shaping the future of automotive by providing design technology that helps save lives, protect the environment and provide a satisfying in-car experience for drivers and passengers alike.Keeping to the automotive theme, on Wednesday morning at 9am there will be a keynote panel Cyber Threats to Connected Cars: Staying Safe Requires More Than Following the Rules of the Road moderated by John McElroy of Blue Sky Productions. The first presenter is John Massimilla of General Motors who has the wonderful James Bond job title as Chief Product Cybersecurity Officer, Vehicle and Vehicle Services Cybersecurity. Next up, Craig Smith of OpenGarages.org a community driven vehicle research and exploration group.Then, on Thursday at 9.15am John Rodgers of University of Illinois at Urbana-Champaign will talk about Electronics for the Human Body. Biology is soft, curvilinear and adaptable; silicon technology is rigid, planar and immutable. Electronic systems that eliminate this profound mismatch in properties create opportunities for devices that can intimately integrate with the body, for diagnostic, therapeutic or surgical function with important, unique capabilities in biomedical research and clinical healthcare. But wait, there’s more.At 9am on Tuesday there is also a visionary talk from Vivek Singh who is an Intel fellow on Moore’s Law at 50: No End in Sight. You don’t need me to give you the background on Moore’s Law. Vivek’s talk will provide some examples of how complex problems have been overcome in recent technology nodes, including those from the field of Computational Lithography. Inverse Lithography and Source Mask Optimization are two such examples that have helped extend the life of 193 patterning. Such innovations, fed by a rich technology pipeline, give us confidence that Moore’s Law will continue.The DAC page with more details of the keynotes is here.


ANSYS Event to Highlight Cutting Edge Technology Development

ANSYS Event to Highlight Cutting Edge Technology Development
by Tom Simon on 04-02-2015 at 5:00 pm

If you follow technology news, it would be hard to deny that we live in exciting times. In some ways there is an unparalleled amount of big and cool technology development going on right now. We all have followed the rise of Tesla Motors. They took over a long vacant US big-auto plant in Fremont and are reinventing the US automobile industry. Tesla CEO Elon Musk is also the progenitor of Hyperloop, which promises to bring huge change to terrestrial transportation. Space launches by private companies are something we are hearing about with increasing regularity. Even wild ideas like the levitating skateboard from Back To The Future are starting to move toward reality.

This is not even mentioning the “Dick Tracy” watches that are heading our way. We all know that product design capability is rapidly accelerating. Quite honestly we are finally getting the things that we were promised in Tomorrow Land. Who remembers seeing the ‘video phone’ there at Disneyland in the early 70’s? At the core of all this there is the technology that supports the development of these products; and there are the visionaries that push and apply this technology.

ANSYS is a technology company that provides an amazingly wide array of software for designing things from on-chip inductors all the way up to spacecraft. They are hosting their 2015 Convergence Conference on April 21 2015 in Santa Clara. Not only do they have a good mix of talks based on applications of their design and analysis software, but they have assembled a fascinating line up of keynote speakers. First up is Josh Giegal with Hyperloop. Hyperloop is moving forward in 2016 with the construction of a 5 mile track along California’s I-5 in the Central Valley. Josh’s talk is about their simulation based development process for their complete system. The initial build of the 5 mile loop will not achieve the top speeds they ultimately are planning for, but will allow them to work out the finer points of the system, including passenger loading, etc.

Following Josh will be Thomas Markusic from Firefly Space Systems. (Any Joss Whedon fans out there?) He previously worked at Space-X, but started Firefly to build practical small-satellite launch systems. Thomas’ talk should be fascinating. He likes to talk about rockets as being systems that are highly out of equilibrium. Nature of course hates this, which is what makes rocket science so challenging.

The keynotes come back to earth with Mark Frohnmayer talking about his electric car startup Arcimoto. He is looking for efficient and practical design solutions to produce feasible consumer products. For instance he is opting to use lead acid batteries – proven low cost technology rather that lithium ion.

Finally what wiz-bang line up of new technology would be complete without a discussion on magnetic levitation? Greg Henderson, who founded Arc Pax, will talk about their magnetic hoverboard that is featured on Kickstarter. Quite a line up, and this is before we even get to the other talks by ANSYS and their customers covering numerous additional real world applications for their broad line of multiple physics products.

There will be four tracks in the afternoon: Fluid Mechanics & Multiphysics, Structural Mechanics, and two on Electronics. On SemiWiki.com we usually focus on electronics design, and this ANSYS-wide agenda has plenty of talks directly related to electronics. They include IC and PCB design and analysis talks by Emulex, Applied Micro Circuits, and of course several ANSYS speakers. The topics range from ESD, board and package co-design, signal integrity to electromagnetic design and analysis.

Interestingly the other two non-electronics tracks have some interesting fodder for designers of electronics based products. There is a talk on simulating a li-Ion battery solution. Another talk covers multiphysics simulations for wearable devices. Plus there are a lot more talks that look compelling. One that caught my eye was on the structural analysis of the new San Francisco Bay Bridge design.

All this and a free lunch! The ANSYS Convergence Conference looks like a great event to learn more about applications in, and adjacent to, electronics design. It will also offer excellent networking opportunities and hopefully create formal and informal conversations that could drive exciting new technological development.


SEMI Wafers to Wallstreet – New England Forum March 12, 2015

SEMI Wafers to Wallstreet – New England Forum March 12, 2015
by Scotten Jones on 04-02-2015 at 4:00 pm

On March 12 SEMI held a New England Forum breakfast event entitled “Wafers to Wallstreet” with four speakers. The main focus of the discussion was on the “Internet of Things” and the following are my impression from the talks in a bullet point format.

Device Scaling and Performance in the Era of IoT – Gary Rosen, Applied Materials

  • New devices and technologies are required for IoT.
  • Ion implant has a growing role in precision materials engineering.
  • Even though IoT devices may be simple, the servers in the background that support IoT will need a lot of processing power.
  • Traditional ion implant has been focused on doping, emerging ion implant applications are in precision materials engineering – using ion implant to change materials properties.
  • Companies create baseline flows and then add ion implants to meet their performance targets.
  • Hot implant is ion implantation at high temperatures (how high wasn’t disclosed) to maintain the crystallinity of the area being implanted and to achieve high dopant activation.
  • Cold implant is ion implant at lower temperatures (once again the actual temperature was not disclosed) to increase damage for amrophization implants.
  • First generation FinFETs have approximately 3 doping implants for each material implant, for generation 2 it will be approximately one to one and for generation 3 FinFETs materials implants may outnumber dopant implants.

Semiconductors Everywhere – Mark Thirsk, Linx Consulting

  • Electronic systems show a high degree of correlation to worldwide GDP.
  • Electronic systems sales are growing as a percentage of GDP although they are still very small on a percentage basis (~3%).
  • Industrial and automotive are showing the best electronics growth at 15% and 9% CAGR respectively. Consumer, wireless and wired communications and data processing are all in the 0% to 3% growth range.
  • Smart phones and tablets are growing faster than PCs and in some cases replacing them.
  • The traditional markets for semiconductor are changing with the PC no longer as dominant.
  • Billion of sensors and actuators will be needed mainly made in older technology.

Semiconductors and Semiconductor Equipment – C.J. Muse, Evercore ISI

  • This is a demand driven semiconductor cycles, less volatility, more gradual, think it has legs to 2016 and beyond.
  • Semiconductors are becoming GDP plus growth – GDP +5%, thinks semis grow 6% for 2015 and 2016.
  • A lot more generalists are starting to invest in semis.
  • Free cash flow is becoming important; investors are interested in sustained cash flow.
  • Investors are recognizing the higher margins in analog.
  • He thinks there is room for semiconductor stocks to move higher.
  • Smart phones demolished GPS and cameras, think consumer has now bottomed out.
  • Automotive content is rising.
  • Thinks there will be more consolidation and m&a.
  • Growth will be slower but less cyclical.
  • Analog is moving into the top ten for market caps.
  • Lines are blurring between analog and digital, IoT will need both.
  • Thinks Broadcom and Qualcomm are going to need to add analog capability to service IoT applications.
  • Capital intensity is rising, 40% increase for 10nm over 14nm.
  • Etch and deposition is a key now, foundry and 3D NAND are growth areas.
  • Fabless guys are getting squeezed, talk about Apple and Huawei making their own chips.
  • Thinks China will be a player in 28nm and lagging edge technologies.

A Wall Street Perspective: How Process Complexity, IoT and China – Weston Twigg, Pacific Crest Securities

  • Thinks costs are increasing 20-30% per node versus historical 5-10%.
  • Seeing a lot less design starts.
  • Thinks timing between nodes may slow plus slower ramps, may see less companies make the change to new nodes, more reuse.
  • Value of local processors is declining, more power in the cloud.
  • Processor costs were hundreds of dollars and are now evolving to tens of dollars.
  • Samsung Xian is at 40k wpm of 3D NAND ramping to >= 100k wpm.
  • Demand is growing fastest in lagging technologies.
  • China investing heavily, may play well in lagging nodes.

Discussion

  • Mark – thinks the real value of IoT is when the data gets up to servers and you have the right kind of expert systems.
  • Security concerns could be a possible headwind for IoT.
  • IoT can add biometrics for enhanced security.
  • New fab construction slowing, a lot of repurposing of 200mm fabs, some 300mm fabs on older nodes in China.
  • C.J. – could there be a shortage of 200mm equipment. Will companies make the investments given the new focus on cash flow. TI analog only at 50% capacity, other analog around 80%.
  • C.J. – 28nm was a 2 year ramp, 16/14nm will be a 3 year ramp. Thinks 10nm is a key node because it will be a full shrink.
  • Mark – tier one guys are going down the roadmap but guys like NXP and ST are using older technologies and their fabs are ageing and spare parts are hard to find. Will they go to 300mm and is there a market for less capable 300mm equipment.
  • C.J. – think China is primarily a threat as a fast follower.
  • C.J. – thinks Micron will roll up Inotera and Nanya in the next two years.
  • Weston – Teradyne has said parallel testing has hit a limit and could drive more demand for test equipment.
  • C.J. – DRAM, Samsung had a one year lead over Micron and 6 months over Hynix, what happens when Micron comes up on 20nm. What happens as 3D ramps (presumably NAND), will there be a drop in margin. Intel qualified into iPhone 6 and Samsung Galaxy, thinks Intel will be a real player in SOC. Thinks 10nm and below for foundry really changes their business model. TSMC has too much pricing power, if Samsung stumbles Intel could be a big player. Thinks Intel could be a player at 10nm and 7nm.
  • Weston – in response to a question about the next equipment down cycle – 3D NAND and FinFET build outs are driving the current cycle, could be weakness when they end but haven’t see over building that has driven contractions in the past.

EDPS: Fins and FinFETs

EDPS: Fins and FinFETs
by Paul McLellan on 04-02-2015 at 7:00 am

Look at those dolphins with fins on their backs. Did you know that FinFETs are actually named after them since Chenming Hu and his team though that they looked like a fish’s fin? And since they invented FinFETs they got to name them too. But those dolphins also mean that it is nearly time for this years Electronic Design Process Symposium (EDPS) which is held as usual in the Monterey Beach Hotel. This year it is Thursday and Friday April 23rd and 24th.

Register here with Promo Code: SemiWiki-EDPS2015

I blogged earlier this weekabout the Linley Mobile Conference and the observant among you will notice that they overlap, the second day of Linley is the first day of EDPS.

Apurna Dey of Cadence is the general chair and opens the meeting on Thursday at (I’m guessing, the program doesn’t have any times at all yet) 9am.

The first session is chaired by Dan Nenni and is on FinFET vs FD-SOI. It kicks off with a keynote from Tom Dillinger of Oracle (think Sun) followed by a panel session with Tom, Kelvin Low of Samsung Foundry, Boris Murman of Stanford University, Marco Brambilla of Synapse Design, and Jamie Shaeffer of GlobalFoundries:

The emergence of multiple transistor technology options at today’s deep submicron process nodes introduces a variety of power, performance, and area tradeoffs. This session will start with an overview of the FinFET and Fully-Depleted Silicon-on-Insulator devices (FD-SOI, also known as Ultra-Thin Body SOI), in comparison to traditional bulk planar transistor technology. The session will then delve into a detailed discussion of the architectural and circuit implementation tradeoffs of these new offerings, to assist designers make the right choice for their target application.

That takes us up to lunch. After lunch it is Multi-Die Design Challenges and Applications, which I think is just a long title for 3DIC. The sessions are:

  • Herb himself on 3D-IC EcoSystem Today and What’s Next
  • Brandon Wang of Cadence on Versatile 3D-IC Design Environment
  • Dusan Petranovic of Mentor on Verification and Extraction of 3D Stack Components Interaction
  • Rich Rice of ASE on Multi-die Packaging—How Ready Are We?

Then a change of scenery with Hybrid Virtual Platforms moderated by Gary Smith (himself, as Regis McKenna’s business card used to say) and John Swan (now of Intel). Sessions are:

  • Vikramheet Singh of nVidia on Hybrid Pre-Silicon Platforms for Accelerated SW Development
  • Vinoo Srinivasan of Intel on Hybrid VP – Are they the highbred Virtual Platforms?
  • Frank Schirrmeister of Cadence on Stop Abstracting! Use the Real Design Earlier for Software Verification Using Hybrid Approaches
  • Russel Klein of Mentor on The Need For Speed

After that it is off to dinner at the Monterey Yacht Club down on the old wharf. The dinner keynote is by Dileep Bhandarkar of Qualcomm titled The Yellow Brick Road of Semiconductor Technology. The talk will provide a historical perspective on how the computer industry has taken advantage of Moore’s Law and how we got to the era of multicore processors. The talk will also address some of the challenges facing the industry in the future.

And so to bed. Next morning we wak up to Low Power Day. The keynote is by Jim Kardach of FinSix on Low Power Design, Standards and Evolution.

Naresh Sehgal then chairs a session on Low Power Technologies and Ecosystems. Presentations are by:

  • Steve Carlson of Cadence on Low-power and Mixed Signal Solutions
  • Pat Sheridan of Synopsys on Power-aware Architecture Design for Multicore SoCs
  • Bernard Murphy of Atrenta on Low Power on the Bleeding Edge
  • Prasad Subramaniam of eSilicon on Low Power Design Methodologies

After lunch, Andrew Khang of UCSD gives a keynote on EDA/ESL Low Power Design Trends, ITRS/CAD and Tools. That wins the prize for getting the most acronyms into a title.


There is then a panel session with Brian Fuller of Cadence as the emcee. The subject is Can Power Go Any Lower or Have We Hit Almost Hit the Floor, Especially For IoT Devices?which wins this conference’s prize for getting the most words into a title (they could have got bonus points for spelling out IoT in full). The panel participants are Jim Kardach along with the presenters from the previous session.

Nahresh Sehgal and Apurna Dey close out and send us all back on our way up Highway 1.

Complete program info and a link for registration is here. Be sure and use promo code SemiWiki-EDPS2015 for a reduced rate.


Intel Goes After Broadcom

Intel Goes After Broadcom
by Robert Maire on 04-01-2015 at 1:00 pm

Intel continues shopping spree with Broadcom
AMAT drops TEL merger due to high remedy cost
Global Foundries wins Apple A9 business at 20nm for 6S & “6C”

Intel follows Altera with Broadcom chaser…..
Sources in the industry have confirmed that Intel is advanced discussions to acquire Broadcom, following closely on the heels of its rumored acquisition of Altera.

Industry sources confirm that this is a broader push by Intel into the foundry space following Intels unsuccessful foray into the mobile market. After it was learned that Altera was going to abandon Intel’s foundry services to go back to TSMC at the 10nm node , Intel decided to use a preemptive strike and acquire Altera.

The logic of acquiring Broadcom follows that same line of reasoning allowing Intel to grow its foundry business through similar acquisitions. While this may be an expensive way to grow business, we would agree with Intel that this is a much more certain way to gain what has been an otherwise elusive foundry business.

In our view it is clear that Intel is following the “Abjad Ordinal” strategy in this regard and we would speculate that Cypress Semiconductor could be next on the list if CEO Brian Krzanich continues to follow this course.


AMAT leaves TEL at the alter….

Applied Materials has announced it has dropped plans to merge with Tokyo Electron. It would appear that the remedy costs became just too high for Applied to bear. It was rumored that US regulators had asked Applied to divest its advanced etch business while still being allowed to retain its trailing edge etch products for 28nm and above. This followed recent decisions coming out of the Chinese regulatory agency restricting Applied’s CMP and Ion implant business units. Though there has been no announcement from Japanese regulators, it can be assumed that they would move against Applied’s thermal business given Japan’s participation in the furnace market.

Facing the prospect of being boxed out of the semiconductor equipment market, the company would be left with the flat panel and solar business units as well as service revenues which would certainly not be financially attractive to the company or investors.

After announcing the surprise move from his new Tokyo office Gary Dickerson, CEO of Applied was asked what his next move would be to which he replied ” 私はディズニーの世界に行くつもりです “.
TEL will be paid a significant breakup fee as a result of the canceled plans and will likely look to other “White Knight ” potential acquirers to restore their virtue.

Apple A9 for both 6S & 6C goes to GloFo
Global Foundries has shocked the industry and leap frogged over both Samsung and TSMC to win Apple’s iPhone processor business. Sources say that the new processor will be manufactured using a 20nm design at slightly larger die size than the previous A8 processor adding on an additional core and GPU. Global Foundries has more than enough, highly yielding, 20nm capacity in its Malta NY fab to cover Apples entire needs. This will now also include an updated version of the A8 processor, also at 20nm, aimed at the new , lower cost iPhone 6C also due out in the fall at the same time as the 6S.

This gives Apple a 100% US based supply of the critical components and takes business away from “frenemy” Samsung. It is rumored that the decision to do a less aggressive version of the A9 was made after the launch of Samsungs latest phone was found to be severely lacking and thus no threat to Apple’s franchise.

Though there has been no official comment out of either Apple or Global Foundries it is suspected that GloFo is paying a licensing fee of roughly $20 per unit to Apple for the rights to manufacture & supply the chips to Apple.


ASML makes EUV power breakthrough…

Following the recent announcement at SPIE of the pellicle “pop top” which allows for the critical inspection of the reticle used to print semiconductor devices, ASML has announced another breakthrough technology which appears to have solved a major road block in the generation of high EUV power.

The problem up to this point has been the issue of debris mitigation on the “collector”, the parabolic shaped reflector which collects and directs the EUV energy produced by laser annihilation of molten tin droplets. Debris issues have limited power levels and service up time. ASML has introduced a new system in which a new “disposable” collector is swapped in at the same time that the next wafer is also swapped in thereby not impacting system throughput.

The new collector handling system also eliminates the potential of contamination by robotic handling as it is done with a unique “no touch” method. The new collector is rotated at an adequate velocity to create lift to float it into place much like a child’s frisbee toy. Additionally, the new collectors cost will be kept very low as ASML has outsourced their manufacture to Asian cookware manufacturer Iamawok. In the press release, ASML’s CEO Peter Wennink said “This will allow us to finally achieve our long term goal of 1000 wafers per month”

By Robert Maire
Semiconductor Advisors LLC



Semiconductor CAPEX Growth Increases Fab Equipment Spending!

Semiconductor CAPEX Growth Increases Fab Equipment Spending!
by Daniel Nenni on 04-01-2015 at 8:00 am

SEMI Forecasts 15% Increase in Fab Equipment Spending for 2015

With worldwide capex growth of 8%, fab equipment spending is expected to increase by 15% in 2015, according to the most recent edition of the SEMI (www.semi.org) World Fab Forecast. SEMI’s data also predicts a slowdown of fab equipment spending in 2016 to low single digits (2-4%). Looking back to the last 25 years, after two years of growth a negative year typically followed. This may not be the case this time as developments in the industry are pointing to a small but positive 2016.

Most fab equipment spending in 2015 is expected for Foundry followed by Memory. The share in 2015 for both is the same with each about 40%, and the share for Logic and MPU is expected at about 11%. Looking into 2016, the share for foundry is expected to increase to almost 44% followed by Memory with about 38% and Logic/MPU with 13%.

Since its last publication in November 2014, about 270 updates were made to the SEMI report, including data on 17 new facilities. The report tracks fab spending for construction and equipment, as well as capacity changes, and technology nodes transitions and product type changes by fab.

Fab Equipment/Fab Construction (2013-2016)

[TABLE] align=”center” border=”1″
|-
| style=”width: 173px; height: 29px” |
| style=”width: 72px; height: 29px” | 2013
| style=”width: 72px; height: 29px” | 2014
| style=”width: 72px; height: 29px” | 2015
| style=”width: 93px; height: 29px” | 2016
|-
| style=”width: 173px; height: 19px” | Fab equipment*
| style=”width: 72px; height: 19px” | $29
| style=”width: 72px; height: 19px” | $35
| style=”width: 72px; height: 19px” | $40
| style=”width: 93px; height: 19px” | $41 to $42
|-
| style=”width: 173px; height: 29px” | Change % Fab equipment
| style=”width: 72px; height: 29px” | -10%
| style=”width: 72px; height: 29px” | +19%
| style=”width: 72px; height: 29px” | +15%
| style=”width: 93px; height: 29px” | +2% to 4%
|-
| style=”width: 173px; height: 28px” | Fab construction US$
| style=”width: 72px; height: 28px” | $9
| style=”width: 72px; height: 28px” | $8
| style=”width: 72px; height: 28px” | $5
| style=”width: 93px; height: 28px” | $7
|-
| style=”width: 173px; height: 28px” | Change % construction
| style=”width: 72px; height: 28px” | +14%
| style=”width: 72px; height: 28px” | -11%
| style=”width: 72px; height: 28px” | -31%
| style=”width: 93px; height: 28px” | +31%
|-

*Chart US$, in billions; Source: SEMI, March 2015

According to the SEMI forecast, the highest fab equipment spending in 2015 will occur in:

  • Taiwan (US$ 11.9 billion, 40% increase over 2014)
  • Korea ($8.7 billion, a 19% increase)
  • Americas ($6.7 billion, a 12% decline)
  • China ($4.8 billion, a 17% increase)
  • Japan ($4.2 billion, a 10% increase)
  • Europe/Mideast region ($2.7 billion, a 16% increase)
  • South East Asia ($1.3 billion, a 15% increase)

Total capital expenditure (CAPEX) for most of the large semiconductor companies is expected to increase by 8% in 2015, and grow another 3% in 2016. These increases are driven by new fab construction projects and also ramp of new technology nodes. Fab spending, such as construction spending and equipment spending, are fractions of a company’s CAPEX. Typically, if CAPEX shows a trend to increase, fab spending follows. Spending on construction projects, which typically represents new cleanroom projects, will see a significant (-31%) decline in 2015, but is expected to rebound by 31% in 2016.

New facilities beginning construction in 2015 and 2016 will start equipping in 2016 or later. SEMI’s data show that eight facilities with various probabilities may start construction in 2015 (including one LED. In 2016, construction will possibly begin on five or eight new fabs.

The SEMI positive outlook for the year is based on spending trends tracked as part of our fab investment research. For the World Fab Watch, SEMI uses a “bottom’s up” company-by-company and fab-by-fab approach which points to strong investments by foundries and memory companies, driving this year’s growth. Learn more about the SEMI fab databases at: www.semi.org/MarketInfo/FabDatabase.


What is Skipper?

What is Skipper?
by Paul McLellan on 04-01-2015 at 1:00 am

What is Skipper? Well, it seems it’s a penguin in the movie Madagascar. And one of Barbie’s sisters. Who knew? But for Semiwiki readers it’s an integrated chip finishing platform from ICScape. Skipper can read in full-chip layout extremely fast, examine it and manipulate it in various ways, and write it out again.

Skipper solves a number of different problems, both before tapeout and when debugging silicon exhibiting problems:

  • True chip finishing, taking the output from the primary design system and producing the file for sending to the mask shop for fabrication
  • Debugging a chip when it fails test in a non-obvious way or when a chip fails and the cause needs to be determined
  • Interfacing to focused ion beam (FIB) systems for microsurgery and deeper analysis of the chip using the real silicon
    Much of the challenge in handling designs at this stage is their sheer size. For Skipper to have good interactive response then it needs to have the most efficient data structures. After all, even a moderate-sized chip has billions of polygons these days, and if the design is being handled after reticle enhancement (RET) and addition of artifacts like dummy metal fill then the polygon count explodes. Skipper has been optimized for handling designs at the full-chip level in order that it can read, manipulate and write back huge GDS files.In its chip finishing mode, Skipper can:

    • handle very large layouts (100GB+ files in GDS, Oasis, MEBES etc) with fast load and refresh
    • merge in standard cells and IP blocks to replace footprints, switch cells, add seal rings
    • make detailed layout changes down to the polygon level
    • debug DRC and LVS errors at the full-chip level including setting waivers, eliminating duplicate errors and generating DRC reports
    • compare layout between any two full-chip representations including checking individual layers of mask representation versus the original layout (e.g. MEBES vs GDS). This is done using multi-core operating for highest performance


    For debugging chips and analyzing failures, Skipper has a number of additional features:

    • despite not requiring a full technology file or a PDK, it can still trace nets, even the largest nets such as power, ground and clock nets
    • failure analysis engineers can pump simulated current into pins of a failed chip to narrow down where a fault may be occurring so as to assist in locating faults to a given area, small enough to be examined in details with scanning electron microscope (SEM)
    • cut out an area of the chip across the whole hierarchy for detailed examination

  • FIB allows chips to be altered using nano-machining with beams of Gallium ions. Some FIB machines also allow the design to be inspected without requiring a separate SEM pass. One problem is communicating what cuts to make since the FIB machines do not operate directly from mask data. Skipper can create layout/edit directives for use on the FIB machine to ensure accuracy and reduce turn-round times.Skipper is the highest performance chip-finishing environment available today. It is regularly used today on some of the most demanding designs such as large memories at leading memory manufacturers, or large SoCs at leading communications companies.

    ICScape’s website page on Skipper is here.


Secret Sauce for Successful Mixed-signal SoCs

Secret Sauce for Successful Mixed-signal SoCs
by admin on 03-31-2015 at 12:00 pm

For a design engineer engulfed in the daily rigorous routine of having to keep in sync with updates from various design team members as well the dictums of the design management team, the task of remaining up-to-date with the design information is very often daunting.

What design changes have been checked in this week? Is the verification team using the correct behavioral model of the analog IP? Is the layout for this design DRC/LVS clean? Looks like the schematic had some ECOs! What changed? Which rev. of the schematic was the layout created for? Is the physical implementation team using the latest pinout of the analog block? Did all teams use version X.X of the USB 3.0 IP?

Sound familiar? These are usually the questions that chip designers are plagued with these days in an increasingly complex and multi-site design environment. Most designers would prefer to focus on the design implementation — such as creating the design or perhaps managing the challenges of scalability and performance of analog/mixed-signal blocks at advanced process nodes — instead of dealing with the increased demands of system-on-chip (SoC) integration and working with various design teams (front-end digital, verification, physical integration, etc.). With design teams located either locally or at different locations across the globe, it becomes imperative for all teams to work in tandem to ensure smooth design handoffs at various stages of the design flow.

To ensure a cohesive work environment for designers, one which enables them to focus primarily on the design creation and implementation, while subtly handling the mundane aspects of managing the sanctity of huge amounts of design data, it becomes important to use a design data management system. Most mixed-signal design modules are co-designed, with design teams working closely and interfacing with each other, and keeping the different design views synchronized often represents a challenge. If the behavioral model, block abstract, layout, timing or power model is not synchronized, it can prolong the turnaround time or, in the worst-case scenario, force a silicon re-spin. Moreover, analog/digital integration at advanced process nodes requires close collaboration between the various teams.

Design teams ignore investing in a design management system at their own peril. To realize a successful mixed-signal tapeout, it has become important to invest in a design management platform that covers all types of designs – analog, digital, RF and mixed-signal – and one that is closely integrated with design tools from various EDA vendors. While some teams have invested in software-based data management systems, with additional layers built on top to adapt to mixed-signal designs, the reality is that they neither meet the rigorous demands of complex mixed-signal design flows nor provide optimal performance. The result is that the designer often has to spend considerable time manually managing the tool and the design data.


Figure-1: Stability of a mixed-design flow with and without a design management platform

The power and size of mixed-signal SoCs are quickly expanding to new levels of integration in order to accommodate highly demanding features in consumer, automotive, industrial, medical and bio-tech applications. This has led to new revolutions in various fields, such as bio-tech. Take the case of DNA sequencing using mixed-signal SoCs as an example. Genia Technologies, acquired by Roche Molecular Systems in June 2014, recently provided a detailed view of its SoC device for DNA sequencing at CDN LIVE in Silicon Valley. The life sciences chipmaker is developing a faster and more cost-effective way of sequencing DNA chains.

For a bio-tech novice like me, who has no clue about the ramifications of having a fast and an affordable means of DNA sequencing, this was quite an eye opener. DNA sequencing provides the ability to assess individuals’ genetic profiles over their lifetime. What this implies is that hospitals and medical clinics can monitor or screen for future diseases efficiently and cost-effectively to provide personalized health care. Since the variation in genes can make people respond differently to the same drugs, doctors now have a means to decide which drugs to prescribe.

The traditional methods of DNA sequencing have been very expensive and time consuming. Genia Technologies is aiming to create a device that can reduce the cost of the sequencing to a few hundred dollars as opposed to a few thousands today. Their SoC-based solution bypasses specialized, expensive optical sensors and instead uses mixed-signal semiconductor chip with a number of sensors. Genia Technologies is aiming to make the chips as inexpensive as the ones found in mobile phones, tablets and other consumer electronic products.

Genia’s NanoTag sequencing technique, developed in collaboration with Columbia University and Harvard University, uses a single DNA strand, which is then processed using tiny bioengineered nanopores. The chip reads the DNA sequence electronically with the help of a number of sensors. According to Hui Tian, vice president of Genia Technologies, electronic reading of single DNA strands requires less “informatics horsepower” to reconstruct a sequence accurately. Each sensor generates kilobytes of data per base and each bio-machine runs at a few bases per second. Each human genome sequencing requires nearly 180GB of data. What was equally interesting is that for the SoC to work as desired, once the SoC was taped out, it was sent to another foundry to form mini-wells and biocompatible electrodes on top of the wafer.


Figure-2: Genia’s technology – Nanopore sequencing

Genia claims that its SoC-based solution, developed at the cross-section of NanoTags and CMOS IC technology, brings the crucial advantage of single molecule capability coupled with semiconductor scalability. But how does Genia Technologies manage the complexity of building such a powerful and complex SoC device?

Genia’s Tian says that his company uses the SOS data and IP management system from ClioSoft Inc., which is tightly integrated with Cadence Virtuoso® technology to ensure collaboration and better design handoff between different design teams. Tian further elaborated on the design flow adopted to develop the analog part of Genia’s SoC design using Cadence design tools and ClioSoft’s SOS design data management to create a platform for sequencing single DNA molecules.

As teams continue to grow across multiple sites and regions, it is becoming necessary to have a collaborative solution for engineers and managers to manage design data, track project activities and deliver IP products in a timely, secure and efficient manner. This avoids design and tapeout delays in their SoC projects. While design data management is not a magic elixir that resolves all SoC delays, it mitigates the risk significantly and provides a path for greater designer productivity and design flow efficiency.

Also Read: Data Management: Bridging Digital and Analog Domains in RF Designs

Ranjit Adhikary is director of marketing at ClioSoft Inc. He has over twenty years of experience and has worked in companies such as Cadence Designs Systems, Magma Designs and Atrenta.

Also Read

DNA Sequencing Eyes SoCs for Stability and Scale

Make Semiconductor IP Reuse Successful?

Design Collaboration across Multiple Sites


Linley Mobile Microprocessor Conference

Linley Mobile Microprocessor Conference
by Paul McLellan on 03-31-2015 at 7:00 am

As The Who sang on Who’s Next:Keep me movin’, groovin’, groovin’, yeah
Movin’, Yeah
Mobile, mobile, mobile, mobile, …

On April 22nd and 23rd the place to be moving (or movin’) to will be the Hyatt Regency in Santa Clara. Because What’s Next is this year’s Linley Mobile Conference. The conference basically focuses on processors for mobile handsets with a sprinkling of IoT (mobile base-stations are covered in the Linley Datacenter Conference which you missed in February or the Linley Carrier Conference on June 10th).

This year the organizer is Mike Demler who I worked with at Cadence, then he took up the noble profession of blogging, but has been a senior analyst at Linley Group for a couple of years now. The program will include technical presentations and panel discussions addressing a broad range of topics. The precise agenda is still has not been finalized but I am assuming it will follow the usual format which consists of a few presentations on a particular topic, followed by a panel session with all the presenters.

One change from previous years is that you will not receive a printed copy of the proceedings when you check in at registration. They will be available for download during the conference however, assuming you brought a (mobile!) device.

Here are some of the presenters already committed:

  • The keynote on the first day will be Linley Gwennap’s Mobile Market Overview. This is an overview of the market, technologies, equipment-design, and silicon trends for designers of mobile devices.
  • Morten Christianson of Synopsys will talk about Designing mobile SoCs with USB Type-C connectors. Synopsys has recently produced a complete suite of IP for this connector. I can’t wait for it to be widespread since the plug can be inserted either way up (the original USB connector seems to be the only connector that takes 4 attempts to get it inserted despite only having two orientations).
  • Synopsys again with Hezi Saar on Cost-Effective Implementation for High-Resolution Display Mobile Devices
  • And you can’t keep them away, no wonder they are a premier sponsor: Synopsys’s Yankin Tanurhan on Embedding Vision in Mobile SoCs.
  • On the same topic, Yair Segal of CEVA on Enabling Intelligent Vision Processing in EmbeddedSystems.
  • And keeping with vision, Jeff Bier of the Embedded Vision Alliance on Computer Vision in Mobile Devices: Progress and Challenges.
  • Cadence’s gets a turn with Chris Rowen of Tensilica fame on Always Alert: New Processors for Low-Energy Wireless Sensor Nodes.
  • Tim Saxe of Quicklogic, will talk about Partitioning Between Software and Hardware is Key to Ultra-Low Power. More always-on I suspect.
  • Steve Singer of Inside Secure on Embedding Robust Platform Security into Application Processors and IoT SoCs. Security is clearly truly “a thing” in mobile and especially IoT and destined to be a huge differentiator, I believe
  • Charlie Janac, the CEO of Arteris, will talk about using FlexNoC Physical to accelerate timing closure.
  • Staying with the NoC theme, Joe Rowlands of NetSpeed will present The Next Challenge in SoC Design: Customizable Cache Coherency.
  • Roy Ju of Mediatek will talk about Heterogeneous Computing for Smart and Energy-Efficient Mobile Applications. I’m still waiting to see an energy-inefficient mobile application.
  • Brian Jeff of ARM on all things ARM Cortex-A72. This is the new 64-bit core that they announced earlier this year, for the time being at least positioned for mobile.


Breakfast and lunch are provided both days (and the food is always excellent), and there is an evening reception the first (Wednesday) evening. With prizes.

The conference is free if you are a designer of mobile chips, mobile devices, or mobile software or a service provider, member of the press (me, yea!) or the financial community.

More details, including a link for registration, are here.


Verifying the RTL Coming out of a High-Level Synthesis Tool

Verifying the RTL Coming out of a High-Level Synthesis Tool
by Daniel Payne on 03-30-2015 at 9:30 pm

With High-Level Synthesis (HLS) the first benefit that comes to my mind is reduced design time, because coding with C or SystemC is more efficient than low-level RTL code. What I’ve just learned is that there’s another benefit, a reduction in the amount of functional simulation required. One HLS customer was able to see this reduction by comparing regression tests that took 1,000 servers running for 3 months using an RTL verification methodology, while using an HLS verification approach the same regressions completed on 12 servers in just 1 week, now that’s a huge difference.

A verification engineer can write tests that give 100% functional and structural coverage on synthesizable SystemC or C++, but when you run these same tests on the generated RTL the functional coverage is still 100% while the structural coverage will lower to about only 80%. This coverage difference is understandable because the HLS tool is automatically creating RTL that is:

  • Adding states to an Finite State Machine (FSM)
  • Adding Stall states
  • Adding Pipeline ramp-up and ramp-down states
  • Using one-hot encoded logic
  • Structuring logic that can lower reported coverage

Thankfully for us, the engineers at Calyptohave figured out a methodology to produce verification optimized RTL code. At DVCon this month they presented a paper, and then made that into a White Paper titled, “Closing Functional and Structural Coverage on RTL Generated by High-Level Synthesis“.

Related – Shorten the Learning Curve for High Level Synthesis

The verification flow for testing RTL generated by HLS is shown below in three iterative loops:

In stage 1 you are running directed and constrained random tests so that the C coverage tool shows 100% function, line branch and condition coverage. After stage 1 you run HLS and generate the RTL code, so in stage 2 the RTL code is ready for functional verification. At the end of stage 2 you have to add reset and stall tests. Stage 3 is where RTL structural verification takes place.

Stall and Reset Coverage

During HLS additional states are added, so we need to identify and target tests at these states to improve our stall coverage numbers. In the Catapult HLS tool a small state machine is added per IO cell, and this state is added into a “staller” block which disables flip-flops and the FSM in its thread. You target tests at each IO separately to reach the 100% structural coverage goal.

Related – HLS: Major Improvement through Generations

For reset coverage your tests will place the FSM into every state and then assert reset.

Unreachable Code

It’s likely that a low structural coverage number is being caused by unreachable code, so you can use a formal tool to run an unreachability check. Mentor has a formal tool called Questa CoverCheck and it typically proves that about 50% of uncovered lines are not reachable.

This formal approach still means that the remaining lines have to be manually analyzed by tracing the logic back to prove that it has unreachable conditions. Redundancies in the source code cause these unreachable conditions and they can be traced back to:

  • Writing loops
  • Conditional statements
  • A condition inside of a loop

Example Results

An example design was selected that has a Discrete Cosine Transform (DCT) used in the decoder for a High Efficiency Video Codec (HEVC). This design used just 490 lines of C++ code, and a functional and structural coverage of 100% was achieved.

Related – HLS Tools Coming into Limelight!

The Catapult tool synthesized the C++ code into 15,735 lines of Verilog. Applying the C++ stimulus to the RTL showed about 94% coverage (279 holes). The library components from Catapult are excluded from the coverage data by using a “gray box”, leaving only 153 holes. CoverCheck was run to find unreachable coverage bins, reducing our coverage holes to just 107, about 98% coverage.

Stall and reset testing was next, leaving us with just 25 coverage holes, at 99.5% coverage.

In the end, the last 25 coverage holes were manually waived.

Summary

HLS is an established methodology for modern SoC design, and the challenge of getting high functional and structural coverage at the RTL level is now possible by following a set of high-level modeling coding guidelines. Formal tools are used in this new methodology to identify unreachable lines. The approach presented has the potential to save from weeks to months from your next SoC schedule, something worth checking out.

Read the complete 10 page White Paper here.