The inaugural event for the 2025 TSMC Technology Symposium recently concluded in Santa Clara, California. This will be followed by events around the world over the next two months. We have summarized information from this event regarding process technology innovation and advanced packaging innovation. Overall, the A14 process… Read More
A recent survey of more than 120 anonymous semiconductor professionals offers a grounded view of how the industry is evaluating non-volatile memory (NVM) technologies—and where things may be heading next.
The 2024 NVM Survey, run in late 2024 and promoted through various semiconductor-related platforms and portals including… Read More
At the pre-conference briefing, Dr. Kevin Zhang gave quite a few of us media types an overview of what will be highlighted at the 2025 TSMC Technical Symposium here in Silicon Valley. Since most of the semiconductor media are not local this was a very nice thing to do. I will be at the conference and will write more tomorrow after the … Read More
President Donald Trump has initially excluded semiconductors from his latest round of U.S. tariffs. However, he could put tariffs on semiconductors in the future. If tariffs are placed on semiconductors imported to the U.S., how would that affect U.S.-based semiconductor companies? The chart below shows U.S. semiconductor… Read More
Semiconductor Intelligence (SC-IQ) estimates semiconductor capital expenditures (CapEx) in 2024 were $155 billion, down 5% from $164 billion in 2023. Our forecast for 2025 is $160 billion, up 3%. The increase in 2025 is primarily driven by two companies. TSMC, the largest foundry company, plans between $38 billion and $42 billion… Read More
Reuters: Exclusive: Trump prepares to change US CHIPS Act conditions,… Read More
Applied reported $7.166B in revenues and Non … Read More
Initial thoughts
At IEDM held in December 2024, TSMC presented: “2nm Platform Technology featuring Energy-efficient Nanosheet Transistors and Interconnects co-optimized with 3DIC for AI, HPC and Mobile SoC Applications,” the authors are:
Geoffrey Yeap, S.S. Lin, H.L. Shang, H.C. Lin, Y.C. Peng, M. Wang, PW Wang, CP Lin, KF… Read More
