IEDM: TSMC Ongoing Research on a CFET Process

IEDM: TSMC Ongoing Research on a CFET Process
by Paul McLellan on 12-18-2023 at 6:00 am

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I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More


An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards

An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards
by Daniel Nenni on 12-14-2023 at 10:00 am

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My beautiful wife and I attended the annual Global Semiconductor Alliance (GSA) Awards event last week. Usually this is a solo event but since my wife is CFO of SemiWiki I was able to get her an invite. I go every year and she wanted to see what all of the excitement was about. She also knows quite a few industry people from attending the… Read More


UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem

UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
by Kalar Rajendiran on 12-11-2023 at 6:00 am

Pike Creek UCIe Test chip

Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More


Podcast EP194: The Impact of Joining TSMC’s OIP From the Perspective of Agile Analog

Podcast EP194: The Impact of Joining TSMC’s OIP From the Perspective of Agile Analog
by Daniel Nenni on 11-17-2023 at 10:00 am

Dan is joined by Chris Morrison. Chris has 15 years’ experience of delivering innovative analog, digital, power management and audio solutions for international electronics. Currently he is the director of product marketing at Agile Analog, the analog IP innovators. Previously he has held engineering positions, including… Read More


KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good

KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good
by Robert Maire on 10-29-2023 at 10:00 am

KLAC Tencor
  • KLA has an OK quarter in an ugly market- bouncing along bottom
  • Like Lam & ASML, China was huge at 43% represents more risk
  • 2/3 Foundry/logic, 1/3 memory – Process tools were weak
  • No change, stable , no visibility on recovery
Quarter and guide were good in continued ugly industry

As expected KLAC reported earnings at the … Read More


IEDM 2023 is Coming in December

IEDM 2023 is Coming in December
by Scotten Jones on 10-19-2023 at 6:00 am

IEDM 2023

Anyone who has read my previous IEDM articles will know I view it as one of the best conferences on semiconductor process technology. From the tutorials, short courses and the conference papers there are so many great opportunities to keep up to date on the latest developments. The following are the conference organizers’ announcements… Read More


Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem

Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
by Kalar Rajendiran on 10-10-2023 at 10:00 am

L.C. OIP 2023

As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More


The True Power of the TSMC Ecosystem!

The True Power of the TSMC Ecosystem!
by Daniel Nenni on 10-02-2023 at 6:00 am

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The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More


Podcast EP184: The History and Industry-Wide Impact of TSMC OIP with Dan Kochpatcharin

Podcast EP184: The History and Industry-Wide Impact of TSMC OIP with Dan Kochpatcharin
by Daniel Nenni on 09-27-2023 at 2:00 pm

Dan is joined by Dan Kochpatcharin, Dan joined TSMC in 2007. Prior to his current role heading up the Design Infrastructure Management Division, Dan led the Japan customer strategy team, the technical marketing and support team for the EMEA region in Amsterdam and was a part of the team leading the formation of the TSMC Open Innovation… Read More