Throughout the debate on fab incentives and the Chips Act I keep seeing comments like; TSMC makes >90% of all advanced silicon, or sometimes Taiwan make >90% of all advanced silicon. This kind of ill-defined and grossly inaccurate statement drives me crazy. I just saw someone make that same claim in the SemiWiki forums and… Read More
In December 2023, we published the Intel Revenue forecast for external wafer sales, gave a breakdown on how customers plan to ramp the foundry. The forecast is still valid (it assumes Intel executes on all plans) but since then we have a better understanding of Intel’s strategy and scenarios that could unfold.
The scenarios… Read More
Born in France, now living in the Netherlands, Christelle Faucon has over 25 years’ experience of working across the global semiconductor ecosystem. Currently she is VP of Sales at Agile Analog, the analog IP innovators. Following a Master’s Degree in Electronics Engineering, Christelle began her career as a Design Engineer.… Read More
On Wednesday, February 21st Intel held their first Foundry Direct Connect event. The event had both public and NDA sessions, and I was in both. In this article I will summarize what I learned (that is not covered by NDA) about Intel’s business, process, and wafer fab plans (my focus is process technology and wafer fabs).
For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in ten years from a technology, economics, and sustainability perspective. The following is a discussion of my presentation.
To understand logic, I believe it is useful to understand what makes… Read More
There are trillions of dollars at stake with AI and huge geopolitical consequences. However, the weak foundation to American technological power is their dependence on Taiwan and TSMC, which is where most advanced silicon is manufactured. America has also been taking China to the ropes lately in their economic/technology proxy… Read More
– ASML orders more than triple sequentially- Utilization increases
– Management remains conservative with flat revenues 2024 vs 2023
– Recovery will be slow, targeting 2025- Long & weak cyclical bottom
– Litho orders are leading indicator of future wider recovery
At IEDM 2023, Naoto Horiguchi presented on CFETs and Middle of Line integration. I had a chance to speak with Naoto about this work and this write up is based on his presentation at IEDM and our follow up discussion. I always enjoy talking to Naoto, he is one of the leaders in logic technology development, explains the technology in … Read More
Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More
