One of TSMC’s two big Silicon Valley events each year is the Open Innovation Platform (OIP) Forum. This year it is on Tuesday October 1st. It is in the San Jose Convention Center and starts at 9am (registration opens at 8am). Pre-registration to attend is now open here or click on the image to the right.
From 9.10 to 9.40 is the … Read More
The legend of Intel being two process nodes ahead of the rest of the industry is quickly coming to an end. To come to terms with this you need to do an apple to apple comparison which is what I will do right here, right now.
First and foremost let’s compare SoC silicon delivery since SoCs are driving the semiconductor industry and will … Read More
At TSMC’s OIP on October 1st, Mentor Graphics have 5 different presentations. Collect the whole set!
11am, EDA track. Design Reliability with Calibre Smartfill and PERC. Muni Mohan of Broadcom and Jeff Wilson of Mentor. New methodologies were invented for 28nm for smart fill meeting DFM requirements (and at 20nm me may … Read More
Increasingly, end users in some markets are requiring soft error rate (SER) data. This is a measure of how resistant the design (library, chip, system) is to single event effects (SEE). These manifest themselves as SEU (upset), SET (transient), SEL (latch-up), SEFI (functional interrupt).
There are two main sources that cause… Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
You will never meet a more approachable CEO in the semiconductor ecosystem than Dr. Walden C. Rhines. The first time I met Wally was way back when I blogged for food and he invited me over for lunch. Even better, a year or two later I was having dinner with a friend at the DBL Tree in San Jose. Wally was waiting for his flight home so he joined… Read More
At TSMC’s Open Innovation Platform (OIP) Ecosystem Forum, Mentor made technical presentations on four different topics, two of them co-presented with TSMC and LSI Corporation. Those presentations are described below with links to downloadable pdf presentation files.
Finding and Fixing Double Patterning Errors in… Read More
Silicon Creations will be presenting a paper with Berkeley Design Automation at the TSMC Open Innovation Platform (OIP) Ecosystem Forum next week where TSMC’s design ecosystem member companies and customers share real-case solutions for design challenges within TSMC’s design ecosystem:
This presentation will describe … Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem. More than 90% of the attendees last year said “this… Read More
