New Sensing Scheme for OTP Memories

New Sensing Scheme for OTP Memories
by Paul McLellan on 09-22-2015 at 7:00 am

Last week at TSMC’s OIP symposium, Jen-Tai Hsu, Kilopass’s VP R&D, presented A New Solution to Sensing Scheme Issues Revealed.

See also Jen-Tai Hsu Joins Kilopass and Looks to the Future of Memories

He started with giving some statistics about Kilopass:

  • 50+ employees
  • 10X growth 2008 to 1015
  • over 80 patents (including
Read More

Is 7nm Coming to the TSMC OIP Ecosystem Forum?

Is 7nm Coming to the TSMC OIP Ecosystem Forum?
by Daniel Nenni on 08-07-2015 at 4:00 pm

This is the 5[SUP]th[/SUP] TSMC Open Innovation Platform Ecosystem Forum and it is not to be missed. Please note that the location has moved from the San Jose Convention Center to the Santa Clara Convention Center which is literally right across the street from the new Levi’s Stadium. If you haven’t been to the new stadium you really… Read More


Silvaco at the TSMC 2014 Open Innovation Platform

Silvaco at the TSMC 2014 Open Innovation Platform
by Daniel Payne on 10-31-2014 at 7:00 am

The success of our semiconductor eco-system depends on collaboration, so the annual TSMC OIP Event just held on September 30 at the San Jose Convention Center was a prime example of that. I didn’t attend this year, but I did follow up with Amit Nandaof Silvaco this week to hear about what they presented. As a consultant I’ve… Read More


TSMC ♥ Cadence!

TSMC ♥ Cadence!
by Daniel Nenni on 10-11-2014 at 4:30 pm

One of the questions I routinely ask amongst the fabless semiconductor ecosystem is, “How are the EDA vendors doing?” There are always complaints because, let’s face it, we all like to complain. On occasion however I do hear about a vendor who goes above and beyond the call of duty and it really brightens my day.

Of late,… Read More


Taiwan Trip Report: The Coming Simulation Crisis!

Taiwan Trip Report: The Coming Simulation Crisis!
by Daniel Nenni on 09-15-2014 at 7:00 am

Even though the flight to Taiwan is somewhat difficult, I really do enjoy my trips to Hsinchu. In addition to the top two pure-play foundries being there, one of the top SoC companies (MediaTek) and many of the leading semiconductor design companies are there as well. All are a quick taxi ride from my home away from home, the Hotel Royal.… Read More


TSMC Open Innovation Platform Forum, October 1st

TSMC Open Innovation Platform Forum, October 1st
by Paul McLellan on 09-28-2013 at 5:00 am

One of TSMC’s two big Silicon Valley events each year is the Open Innovation Platform (OIP) Forum. This year it is on Tuesday October 1st. It is in the San Jose Convention Center and starts at 9am (registration opens at 8am). Pre-registration to attend is now open here or click on the image to the right.

From 9.10 to 9.40 is the … Read More


Intel 14nm versus Samsung 14nm

Intel 14nm versus Samsung 14nm
by Daniel Nenni on 09-25-2013 at 4:15 am

The legend of Intel being two process nodes ahead of the rest of the industry is quickly coming to an end. To come to terms with this you need to do an apple to apple comparison which is what I will do right here, right now.

First and foremost let’s compare SoC silicon delivery since SoCs are driving the semiconductor industry and will … Read More


TSMC OIP: Mentor’s 5 Presentations

TSMC OIP: Mentor’s 5 Presentations
by Paul McLellan on 09-09-2013 at 6:30 pm

At TSMC’s OIP on October 1st, Mentor Graphics have 5 different presentations. Collect the whole set!

11am, EDA track. Design Reliability with Calibre Smartfill and PERC. Muni Mohan of Broadcom and Jeff Wilson of Mentor. New methodologies were invented for 28nm for smart fill meeting DFM requirements (and at 20nm me may … Read More


TSMC OIP: Soft Error Rate Analysis

TSMC OIP: Soft Error Rate Analysis
by Paul McLellan on 09-09-2013 at 1:34 pm

Increasingly, end users in some markets are requiring soft error rate (SER) data. This is a measure of how resistant the design (library, chip, system) is to single event effects (SEE). These manifest themselves as SEU (upset), SET (transient), SEL (latch-up), SEFI (functional interrupt).

There are two main sources that cause… Read More


The TSMC OIP Technical Paper Abstracts are up!

The TSMC OIP Technical Paper Abstracts are up!
by Daniel Nenni on 08-25-2013 at 8:10 pm

The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.

More than 90% of the attendees last year said “this… Read More