Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More
The diamond jewelry industry encourages customers to focus on the 4C’s — cut, clarity, color, and carats. At the recent PCB Forum conducted by Mentor (a Siemens business) in Santa Clara, I learned that current system design flows also require an emphasis on the 4C’s — collaboration, concurrency, consistency… Read More
A couple of recent semiwiki articles reviewed highlights of the annual TSMC Technical Symposium recently held in Santa Clara (links here, here, and here). One of the captivating sessions at every symposium is the status of the Design Enablement for emerging technologies, presented at this year’s event by Suk Lee, Senior… Read More
An earlier article described some of the technical and business highlights from the recent TSMC Symposium in Santa Clara (link). This article continues that discussion, with the top five updates.… Read More
Last week, TSMC held their 23rd annual technical symposium in Santa Clara. In the Fall, TSMC conducts the OIP updates from EDA/IP partners and customers. The theme of the Spring symposium is solely on TSMC’s technology development status and the future roadmap. Indirectly, the presentations also provide insight into … Read More
The difficulty of managing the power domains on a complex SoC led to the development of a power format file description, to serve as the repository for data needed for functional and electrical analysis (e.g., CPF, UPF). Yet, what about complex printed circuit boards? How can the power domain information be effectively represented… Read More
Last month, I made a “no-brainer” forecast that 2017 would be the year in which embedded FPGA (eFPGA) IP would emerge as a key differentiator for new SoC designs (link to the earlier article here).
The fusion of several technical and market factors are motivating design teams to incorporate programmable logic functionality… Read More
The engineering team for the design and analysis of a complex system consists of a diverse set of skills — with the increasing emphasis on both high-speed interface design and multi-domain power management, a critical constituent of the team is the group of signal integrity (SI) and power integrity (PI) engineers.
The training… Read More
If you click FinFET in the SemiWiki.com Latest News: navigation bar at the top of this page you will get a list of 86 blogs that have been viewed more than 600,000 times. If you go to the last blogs on the list, meaning the first blogs to be published, you will see a three part series, “Introduction to FinFET Technology” written by Tom Dillinger… Read More
Photonics IC’s (PIC’s) are used to transmit and receive data through a (single-mode or multi-mode) optical fiber carrier, and provide the requisite electro-optical conversion for system integration. The architecture of the PIC spans the full characteristics of data transmission and reception:
Typically,… Read More
