The Complexity of Block-Level Placement @ 56thDAC

The Complexity of Block-Level Placement @ 56thDAC
by Tom Dillinger on 06-11-2019 at 10:00 am

The recent Design Automation Conference in Las Vegas was an indication of how the electronics industry is evolving.  In its formative years, DAC was focused on the fundamental algorithms emerging from academic research and industrial R&D, that enabled the continuation of the Moore’s Law complexity curve.  (Indeed, the… Read More


TSMC Technology Symposium Review Part II

TSMC Technology Symposium Review Part II
by Tom Dillinger on 04-30-2019 at 10:00 am

TSMC recently held their annual Technology Symposium in Santa Clara. Part 1 of this article focused on the semiconductor process highlights. This part reviews the advanced packaging technologies presented at the symposium.

TSMC has clearly made a transition from a “pure” wafer-level foundry to a supplier of complex integrated… Read More


2019 TSMC Technology Symposium Review Part I

2019 TSMC Technology Symposium Review Part I
by Tom Dillinger on 04-30-2019 at 7:00 am

Each year, TSMC conducts two major customer events worldwide – the TSMC Technology Symposium in the Spring and the TSMC Open Innovation Platform Ecosystem Forum in the Fall. The Technology Symposium event was recently held in Santa Clara, CA, providing an extensive update on the status of advanced semiconductor and packaging… Read More


A Quick TSMC 2019 Tech Symposium Overview

A Quick TSMC 2019 Tech Symposium Overview
by Daniel Nenni on 04-26-2019 at 7:00 am

This year TSMC did a FinFET victory lap with the success of 16nm, 12nm, 10nm, and 7nm. It really is well deserved. Even though TSMC credits the ecosystem and customers, I credit TSMC and their relationship with Apple since it has pushed us all much harder than ever before. TSMC CEO C.C. Wei summed it up nicely in his keynote: Innovation,… Read More


Update on SystemC for High-Level Synthesis

Update on SystemC for High-Level Synthesis
by Tom Dillinger on 03-26-2019 at 12:00 am

The scope of current system designs continues to present challenges to verification and implementation engineering teams. The algorithmic complexity of image/voice processing applications needs a high-level language description for efficient representation. The development and testing of embedded firmware routines… Read More


Project Verification Planning for Analog Designs

Project Verification Planning for Analog Designs
by Tom Dillinger on 02-18-2019 at 12:00 pm

Successful projects leverage the investment in comprehensive methodology and resource planning, covering design and analysis flows – that planning effort is especially important for functional verification.

The emergence of complex SoC designs for advanced automotive applications has led to a major focus on verification… Read More


Architecture for Machine Learning Applications at the Edge

Architecture for Machine Learning Applications at the Edge
by Tom Dillinger on 10-31-2018 at 2:01 pm

Machine learning applications in data centers (or “the cloud”) have pervasively changed our environment. Advances in speech recognition and natural language understanding have enabled personal assistants to augment our daily lifestyle. Image classification and object recognition techniques enrich our social media experience,… Read More


The Latest in Parasitic Netlist Reduction and Visualization

The Latest in Parasitic Netlist Reduction and Visualization
by Tom Dillinger on 10-22-2018 at 12:00 pm

The user group events held by EDA companies offer a unique opportunity to hear from designers and CAD engineers who are actually using the EDA tools “in the trenches”. Some user presentations are pretty straightforward – e.g., providing a quality-of-results (QoR) design comparison when invoking a new tool feature added to a recent… Read More


Advanced Materials and New Architectures for AI Applications

Advanced Materials and New Architectures for AI Applications
by Tom Dillinger on 10-17-2018 at 7:00 am

Over the past 50 years in our industry, there have been three invariant principles:

  • Moore’s Law drives the pace of Si technology scaling
  • system memory utilizes MOS devices (for SRAM and DRAM)
  • computation relies upon the “von Neumann” architecture

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Top 10 Highlights from the TSMC Open Innovation Platform Ecosystem Forum

Top 10 Highlights from the TSMC Open Innovation Platform Ecosystem Forum
by Tom Dillinger on 10-09-2018 at 7:00 am

Each year, TSMC hosts two major events for customers – the Technology Symposium in the spring, and the Open Innovation Platform Ecosystem Forum in the fall. The Technology Symposium provides updates from TSMC on:
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