Intel’s EMIB Packaging Technology – A Deep Dive

Intel’s EMIB Packaging Technology – A Deep Dive
by Tom Dillinger on 05-03-2021 at 6:00 am

EMIB configurations

The evolution of low-cost heterogeneous multi-chip packaging (MCP) has led to significant system-level product innovations.  Three classes of MCP offerings have emerged:

  • wafer-level fan-out redistribution, using reconstituted wafer substrates of molding compound as the surface for interconnections between die (2D)
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Thermo-compression bonding for Large Stacked HBM Die

Thermo-compression bonding for Large Stacked HBM Die
by Tom Dillinger on 07-24-2020 at 8:00 am

HMB stack

Summary

Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.

Introduction

The rapid growth of heterogeneous… Read More


A Compelling Application for AI in Semiconductor Manufacturing

A Compelling Application for AI in Semiconductor Manufacturing
by Tom Dillinger on 07-06-2020 at 6:00 am

AI opportunities

There have been a multitude of announcements recently relative to the incorporation of machine learning (ML) methods into EDA tool algorithms, mostly in the physical implementation flows.  For example, deterministic ML-based decision algorithms applied to cell placement and signal interconnect routing promise to expedite… Read More


Design Technology Co-Optimization (DTCO) for sub-5nm Process Nodes

Design Technology Co-Optimization (DTCO) for sub-5nm Process Nodes
by Tom Dillinger on 06-23-2020 at 6:00 am

scaled metal resistance

Summary
Design Technology Co-Optimization (DTCO) analysis was pursued for library cell PPA estimates for gate-all-around (GAA) devices and new metallurgy options.  The cell design and process recommendations are a bit surprising.

Introduction
During the “golden years” of silicon technology evolution that applied Dennard… Read More