System Planning and Implementation for Different 3D-IC Design Styles

System Planning and Implementation for Different 3D-IC Design Styles
by Admin on 03-09-2022 at 12:00 am

March 9, 2022

Overview

System planning is a major part of the multi-chiplet design. Whether it’s a 2.5-D configuration with an interposer or full-stacked 3D design mounted on a package, it is important to have an automated way to do bump assignment and optimization along with 3D structures implementation. With methodology evolving

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