From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
From 2017 to 2021, the SiP Conference China attracted more than 200 international and regional companies from China, the United States, France, Germany, Italy, the Netherlands, Japan, South Korea, India, Malaysia, Singapore, etc. The participation of enterprises has truly realized the construction from SiP China to SiP World,… Read More
Over the recent years, the volume and velocity of discussions relating to chiplets have intensified. A major reason for this is the projected market opportunity. According to research firm Omdia, chiplets driven market is expected to be $6B by 2024 from just $645M in 2018. That’s an impressive nine-fold projected increase over… Read More
In early May of this year, eSilicon announced the tape-out of a test chip which included the latest additions to its neuASIC™ IP platform. At the upcoming Hot Chips Symposium to be held at Stanford on August 19 and 20, 2019, eSilicon will be demonstrating the software component of this AI-enabling IP platform. At the event, eSilicon… Read More
The emergence of 3D packaging technology has been accompanied by the term “more than Moore”, to reflect the increase in areal circuit density at a rate that exceeds the traditional IC scaling pace associated with Moore’s Law. At the recent Design Automation Conference in Las Vegas, numerous exhibits on the vendor floor presented… Read More
With each new silicon process node, the complexity of SoC design rules and physical verification requirements increases significantly. The foundry and an EDA vendor collaborate to provide a “reference flow” – a set of EDA tools and process design kit (PDK) data that have been qualified for the new node. SoC design methodology … Read More
Open Silicon hosted a webinar today focusing on their High Bandwidth Memory (HBM) IP-subsystem product offering. Their IP-subsystem is based on the HBM2 standard and includes blocks for the memory controller, PHY and high-speed I/Os, all targeted to TSMC 16nm FF+ process. The IP-subsystem supports the full HBM2 standard with… Read More
Calling all ASIC designers working on High-Bandwidth Memory (HBM) access architectures in high-performance computing (HPC), networking, deep learning, virtual reality, gaming, cloud computing and data center applications. You won’t want to miss this upcoming webinar focused on system integration aspects of a HBM2 ASIC… Read More
The EDA Consortium (EDAC) has changed name for Electronic Systems Design Alliance (ESD Alliance). That’s a good reminder that IC are developed (thanks to Design Automation) to be integrated into a System. A wide design ecosystem support system development, including embedded software, design intellectual property (IP), … Read More
While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More
