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Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More
Let’s face it, designs are getting harder, much harder. Gone are the days when the electrical and mechanical design of a system occurred separately. Maybe ten years ago this practice was acceptable. Once the electrical design was completed (either the chip or the board) the parameters associated with the design were then given… Read More
