SEMICON Taiwan is September 3rd to 6th in TWTC Nangang Exhibition Hall. Just as with Semicon West in July in San Francisco, there is lots going on. But one special focus is 3D IC. There is a 3DIC and substrate pavilion on the exhibit floor and an Advanced Packaging Symposium. Design tools, manufacturing, packaging and testing solutions… Read More
Tag: semi
Equipment Down 16% in 2012, Flat to Down in 2013
Shipments of semiconductor manufacturing equipment have been trending downward since June 2012, based on combined data from SEMI for North American and European manufacturers and from SEAJ for Japanese manufacturers. The market bounced back strongly in late 2009 and in 2010 after the 2008 downturn to return to the $3 billion… Read More
Semiconductor equipment returns to growth
Semiconductor manufacturing equipment has returned to growth after a falloff in the second half of 2011. Combined data from SEMI (U.S. andEuropean companies) and SEAJ (Japanese companies) show billings peaked at a three-month-average of $3.2 billion in May 2011. Bookings and billings began todrop in June 2011, with billings… Read More
3D-IC Physical Design
When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More
IC capacity utilization declined in 3Q 2011
SICAS (Semiconductor Industry Capacity Statistics) has released its 3Q 2011 data, available through the SIA at: SICAS data . Beginning with 2Q 2011 the SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United Microelectronics Corporation… Read More
Semiconductor equipment spending beginning to decline
Semiconductor manufacturing equipment shipments have leveled off after a strong rebound from the 2008-2009 downturn. August 2011 three-month-average shipments based on combined data from SEMI (North American and European companies) and SEAJ (Japanese companies) were $2.9 billion, down from a peak of $3.2 billion in May … Read More
Dawn at the OASIS, Dusk for GDSII
For an industry committed to constant innovation, changes in any part of the design flow are only slowly adopted, and only when absolutely necessary. Almost 10 years ago, it became clear that shrinking process technologies would bring a massive growth of layout and mask data—rougly 50% per node. This avalanche of data seriously… Read More