At IEDM Intel and Micron presented “A Floating Gate Based 3D NAND Technology With CMOS Under Array” authored by Krishna Parat and Chuck Dennison.
As I previously discussed in my blog on the IEDM memory short course and blog on IMEC’s work on high mobility 3D NAND channels, continuing to scale 2D Flash has become extremely difficult… Read More
At IEDM IMEC presented “MOCVD In[SUB]1-x[/SUB]Ga[SUB]x[/SUB]As high mobility channel for 3-D NAND Memory” authored by E. Capogreco, J. G. Lisoni, A. Arreghini, A. Subirats, B. Kunert, W. Guo, T. Maurice, C.-L. Tan, R. Degraeve, K. De Meyer, G. Van den bosch, and J. Van Houdt.
On December 15[SUP]th[/SUP] I had the opportunity … Read More
Shipments of semiconductor wafer fab equipment are expected to grow 2.5% in 2016 after 0.5% growth in 2015 according to the December forecast from Semiconductor Equipment and Materials International (SEMI). Gartner is more pessimistic, with its October forecast calling for fab equipment to decline 0.5% in 2015 and drop 2.5%… Read More
In a balancing global economy, it’s a common phenomenon that at certain times a few sectors or segments within the sectors grow much faster compared to others. And a few companies within the growing sectors lead those sectors. Both the growing sectors and the leading companies in those sectors become the centers of attraction. … Read More
Daniel Nenni recently blogged about Intel’s claims of industry leading process density that were made at their analysts meeting. It isn’t clear to me why Intel makes this such a big focus at the analysts meetings, they really don’t compete with the foundries much but this seems to be a big deal to them. I thought it would be interesting… Read More
I have been silently watching STMicroelectronics pursuing FD-SOI technology since quite a few years. FinFET was anyway getting more attention in the semiconductor industry because of several factors involved. But from a technology as well as economic perspective there are many plus points with FD-SOI. I remember my debate,… Read More
Fabless companies and the need for foundries
The success of fabless semiconductor companies is well documented with companies such as Qualcomm, Broadcom, MediaTek, AMD, Avago and others selling semiconductors made using the fabless model (see Fabless: The Transformation of the Semiconductor Industry by Daniel Nenni and … Read More
Last Monday Daniel Nenni and I had a conference call with Jason Gorss and Shubhankar Basu of Global Foundries to get an update on their 14nm process. Shubhankar is the product line manager for 14nm.
Global Foundries 14nm process is a FinFET on bulk process they licensed from Samsung and both companies supply the same process although… Read More
Recent reports have Intel displacing Qualcomm as the modem supplier and TSMC as the foundry for the next Apple A10 SoC. That is if you call this a credible report: … Read More
In the first part of this article I wrote about four types of costs which must be considered when an IP goes through design differentiation, customization, characterization, and selection and evaluation for acquisition. In this part of the article, I will discuss about the other five types of costs which must be considered to enhance… Read More
