Semiconductor Reliability and Product Qualification

Semiconductor Reliability and Product Qualification
by Admin on 07-24-2024 at 3:00 pm

Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability… Read More


Building Reliability into Advanced Automotive Electronics

Building Reliability into Advanced Automotive Electronics
by Bernard Murphy on 12-05-2023 at 6:00 am

Automotive reliability min

Those of you who have been in the industry for a little while will remember that the recipe for reliable electronics in cars (and other vehicles) used to be simple. Stick to old (like 10 years old) and well-proven processes and tweak rather than tear up and restart well-proven designs to the greatest extent possible. Because incrementing… Read More


Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


Closing the Communication Chasms in the SoC Design and Manufacturing Supply Chain

Closing the Communication Chasms in the SoC Design and Manufacturing Supply Chain
by Kalar Rajendiran on 06-08-2022 at 6:00 am

Sondrel Soup to Nuts

In sports, we’re all familiar with how even a team with the best individual players for every role needs to be coordinated as a team to win a championship. In healthcare, a patient is better served with a well-trained primary physician to coordinate with the various medical specialists. The field of semiconductors involves a series… Read More


Reliable Line Cutting for Spacer-based Patterning

Reliable Line Cutting for Spacer-based Patterning
by Fred Chen on 05-06-2020 at 6:00 am

Reliable Line Cutting for Spacer based Patterning

Spacer-defined patterning is an expected requirement for advanced semiconductor patterning nodes with feature sizes of 25 nm or less. As the required gaps between features go well below the lithography tool’s resolution limit, the use of cut exposures to separate features is used more often, especially in chips produced… Read More


Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling

Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More


Safety Methods Meet Enterprise SSDs

Safety Methods Meet Enterprise SSDs
by Bernard Murphy on 07-16-2019 at 5:00 am

The use of safety-centric logic design techniques for automotive applications is now widely appreciated, but did you know that similar methods are gaining traction in the design of enterprise-level SSD controllers? In the never-ending optimization of datacenters, a lot attention is being paid to smart storage, offloading… Read More


Accelerating SOC Development for Automobile Applications

Accelerating SOC Development for Automobile Applications
by Tom Simon on 03-11-2019 at 12:00 pm

No area of electronics is moving faster than automotive semiconductors. Everyone has been talking about the increasing electronics content of automobiles for decades. With Advanced Driver Assistance System (ADAS) and autonomous driving becoming a reality the pace has picked up even more. These new designs combine just about… Read More


Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Mentor’s Busy ITC and Major Test Product Updates

Mentor’s Busy ITC and Major Test Product Updates
by Tom Simon on 10-31-2018 at 1:00 pm

In conjunction with the 2018 International Test Conference, Mentor has several interesting test announcements. They also have a busy round of technical activities, including a number of technical papers, presentations, tutorials and a poster from a major customer about using Mentor. I’d like to touch on the two product related… Read More