At Semicon Japan a few days ago, Subi Kengeri of GlobalFoundries delivered the keynote. While he covered a number of topics, using Tokyo’s recent win of the 2020 Olympics as a hook, one major theme was the increasing importance of processes other than the bleeding edge digital processes that get all the news.
What is leading… Read More
Major power reductions are possible by reducing power at the RTL and system levels, and not just at the gate and physical level. In fact, as is so often the case in design, changes can have much more impact when done at the higher level, even given that at that point in the design there is less accurate feedback about changes. Later the… Read More
With multiple functionalities added into a single chip, be it a SoC or an ASIC, maintaining low power consumption has become critical for any design. Various techniques at the technology as well as design level are employed to accomplish the low power target. These include thinner oxides in transistors, different sections of … Read More
I wrote in April about Andes Technology, a microprocessor IP licensing company that even the person sitting next to me, a strategic marketing guy from Qualcomm had never heard of. So, OK, if you read that earlier article you had at least heard of them.
Part of the reason you haven’t heard of them is that they are in Taiwan (in Hsinchu)… Read More
Smartphones are smart but they are about to get smarter. The next big thing in mobile phones is to have a rich sensor environment: proximity, temperature and humidity, atmospheric pressure, light color, cover, gyroscope, magnetometer, accelerometer, ambient light, gesture and more. Some of these are already here, of course,… Read More
It was an interesting webinar I attended, presented by STMicroelectronicson how they are benefited in power saving and thermal dissipation by using FDSOI technology and also by using PowerArtist in their design. So, it’s an advantage from both sides – semiconductor technology and semiconductor design tool. It’s worth attending… Read More
With all the focus in design on SoCs in the latest sexy process (Hi-K Metal Gate! FinFETs!) it is easy to forget all the other chips that go into a system. When we say “system on a chip” there are actually very few systems that really get everything onto a single chip. One of the big areas that usually cannot go on the latest… Read More
Virtually all SoCs require one-time programmable (OTP) memory. Each SoC is different, of course, but two main uses are large memories for holding boot and programming code and small memories for holding encryption keys and trimming parameters, such as radio tuning information and so on.
There are alternatives to putting an OTP… Read More
Almost without exception these days, semiconductor products face strict power and thermal budgets. Of course there are many issues with dynamic power but one big area that has been getting increasingly problematic is static power. For various technical reasons we can no longer reduce the voltage as much as we would like from one… Read More
Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More
