For the first time ever, IEDM held a sustainability session at the 2023 conference. I was one of the authors who presented an invited paper, the following is a summary of my presentation.
From the United Nations [1]:
“Climate Change is the defining issue of our time, and we are at a defining moment.”
“Without drastic … Read More
News suggests Intel will get 6 of first 10 High NA tools made by ASML in 2024
An industry news source, Trendforce, reports… Read More
Dan is joined by Ritesh Jain. Ritesh is the senior vice president of engineering and operations for Lightmatter. Prior to joining Lightmatter, Ritesh was a vice president in Intel’s Data Center and AI group where he directed the hardware development across silicon packaging, power integrity, signal integrity, mechanical &… Read More
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
The release and scattering of photoelectrons and secondary electrons in EUV resists has often been glossed over in most studies in EUV lithography, despite being a fundamental factor in the image formation. Fortunately, Intel has provided us with a laboriously simulated electron release and scattering model, using the GEANT4… Read More
The global semiconductor market is now solidly in a turnaround. WSTS revised its data for 2Q 2023 growth over 1Q 2023 to 6.0% from 4.2% previously. 3Q 2023 was up 6.3% from 2Q 2023. With our Semiconductor Intelligence forecast of 3% growth in 4Q 2023, the year-to-year growth in 4Q 2023 will be a positive 6%. This will set the stage for… Read More
As expected KLAC reported earnings at the … Read More
Anyone who has read my previous IEDM articles will know I view it as one of the best conferences on semiconductor process technology. From the tutorials, short courses and the conference papers there are so many great opportunities to keep up to date on the latest developments. The following are the conference organizers’ announcements… Read More
Dan is joined by Dr. Rahul Manepalli. Rahul is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization. Rahul and his team are responsible for developing the next generation of materials, processes and equipment for Intel’s package substrate pathfinding and development… Read More
Nvidia will likely become the largest semiconductor company for the year 2023. We at Semiconductor Intelligence (SC-IQ) estimate Nvidia’s total 2023 revenue will be about $52.9 billion, passing previous number one Intel at an estimated $51.6 billion. Nvidia’s 2023 revenue will be almost double its 2022 revenue on the strength… Read More
