IC designers use EDA tools to implement their logical and physical design, and these tools require foundry-specific information for:
Dassault have recently been granted a patent on their approach to managing design hierarchy. I asked them how long it took from filing the patent until it was granted and they said the whole process had taken 8 years. It is a bit of an indictment of the patent system when it takes 8 years, also known as 4 or 5 process nodes, for a patent to… Read More
Last week I heard about the Indian Cabinet approving the proposal for setting up of two Fabs in India. One led by IBM, Tower Jazzand JP Associates(an Indian business house), and the other led by HSMC(Hindustan Semiconductor Manufacturing Co.), ST Microelectronicsand Silterra. Indian Semiconductor community including IESA… Read More
Lately I was studying about new innovations in memory world such as ReRAM and Memristor. As DRAM (although it has become a commodity) has found its extensive use in mobile, PC, tablet and so on, that was an inclination too to know more about. While reviewing Cadence’s offering in memory subsystems, I came across this whitepaperwhich… Read More
Remember? During DAC2013 I talked about a new kind of innovation: A Virtual Fabrication Platform, SEMulator3D, developed by COVENTOR. Now, to my pleasant surprise, there is something to report on the proven results from this platform. IBM, in association with COVENTOR, has successfully implemented a 3D Virtual Fabrication… Read More
Layout editing is a complex task, traditionally done manually by designers, and the layout design productivity largely depends on the designer’s skills and expertise. However, a good tool with features for ease of design is a must. Layout productivity has been an area of focus and various features are constantly being added in… Read More
Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More
I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More
After looking at various aspects of this company, to sum up, I couldn’t find any better statement than this; thoughtful management here is actually leadership with passion which achieves tangible results. This reflects in the methodology of doing things in this company which has given it a place among top EDA companies in a span… Read More
My Samsung Galaxy Note II lasts about two days on a single battery charge, which is quite the improvement from the Galaxy Note I with only a one day battery charge. Mobile SoCs are being constrained by battery life limitations, and consumers love longer-laster devices.
There are at least two approaches to Design For Power:
