How early symmetry validation eliminates costly late-stage respins

How early symmetry validation eliminates costly late-stage respins
by Admin on 07-27-2026 at 2:00 pm

article fig1 shift left

By Mauli Shah, Product Engineer, Siemens

Analog and mixed-signal design teams face a persistent challenge that directly impacts tape-out schedules and project predictability: symmetry violations discovered at signoff trigger expensive respins, delay schedules and create unpredictable iteration cycles. Despite symmetry… Read More


Solido AI in action: Transforming every step of custom IC design & verification workflow

Solido AI in action: Transforming every step of custom IC design & verification workflow
by Admin on 07-14-2026 at 10:30 pm

Siemens hosted session at DAC 2026

Solido AI in action: Transforming every step of custom IC design & verification workflow

When: Tuesday, July 28 | 12:00 PM – 1:30 PM | Lunch provided

Where: Long Beach Convention Center

Agentic AI is redefining what’s possible in custom IC design and verification, and Solido is leading

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A Webinar About Electrical Verification – The Invisible Bottleneck in IC Design

A Webinar About Electrical Verification – The Invisible Bottleneck in IC Design
by Mike Gianfagna on 12-16-2025 at 6:00 am

A Webinar About Electrical Verification – The Invisible Bottleneck in IC Design

Electrical rule checking (ERC) is a standard part of any design flow. There is a hidden problem with the traditional approach, however. As designs grow in complexity, whether full-custom analog, mixed-signal, or advanced-node digital, the limitations of traditional ERC tools are becoming more problematic. This can lead to… Read More


WEBINAR: Revolutionizing Electrical Verification in IC Design

WEBINAR: Revolutionizing Electrical Verification in IC Design
by Daniel Nenni on 11-27-2025 at 10:00 am

Electrical Verification – The invisible bottleneck in IC design 2

In the complex world of IC design, electrical verification has emerged as a critical yet often overlooked bottleneck. Aniah’s upcoming webinar on December 4, 2025, titled “Electrical Verification: The Invisible Bottleneck in IC Design,” sheds light on this issue, introducing their groundbreaking OneCheck® solution. … Read More


Safeguard power domain compatibility by finding missing level shifters

Safeguard power domain compatibility by finding missing level shifters
by Admin on 05-14-2025 at 10:00 am

fig1 missing level shifters

In the realm of mixed signal design for integrated circuits (ICs), level shifters play a critical role for interfacing circuits that operate at different voltage levels. A level shifter converts signal from one voltage level to another, ensuring compatibility between components. Figure 1 illustrates a missing level shifter… Read More


The Git Dilemma: Is Version Control Enough for Semiconductor Success?

The Git Dilemma: Is Version Control Enough for Semiconductor Success?
by admin on 05-22-2024 at 10:00 am

Data in Software Vs Semiconductor Design Flow

Git is a version control system that saves every change made to files. It offers powerful tools for managing these changes. This makes Git ideal for software development, as it lets you keep all project files in one place.

Software has grown in complexity, necessitating more collaboration among engineers across various time zones.… Read More


DAC 2020 – Call for Contributions

DAC 2020 – Call for Contributions
by Daniel Payne on 10-28-2019 at 6:00 am

57DAC in SFO

My first DAC was in 1987 so I’ve seen our industry expand greatly over the years, and I expect that #57DAC on July 19-23, 2020 in SFO to be another exciting event to attend for semiconductor professionals from around the globe. What makes DAC so compelling for me to visit are the people, exhibitors, panel discussions, technical… Read More


Analog IC design across PVT conditions, something new

Analog IC design across PVT conditions, something new
by Daniel Payne on 08-30-2018 at 12:00 pm

Transistor-level design for full-custom and analog circuits has long been a way for IC design companies to get the absolute best performance out of silicon and keep ahead of the competition. One challenge to circuit designers is meeting all of the specs across all Process, Voltage and Temperature (PVT) corners, so that silicon… Read More


Approaches for EM, IR and Thermal Analysis of ICs

Approaches for EM, IR and Thermal Analysis of ICs
by Daniel Payne on 04-26-2017 at 12:10 pm

As an engineer I’ve learned how to trade off using various EDA tools based on the accuracy requirements and the time available to complete a project. EDA vendors have been offering software tools to help us with reliability concerns like EM, IR drop and thermal analysis for several years now. Last week I attended a webinar … Read More


Why is Low Frequency Noise Measurement for ICs Such a Big Deal?

Why is Low Frequency Noise Measurement for ICs Such a Big Deal?
by Daniel Payne on 09-27-2016 at 12:00 pm

Even digital designers need to be aware of how noise impacts their circuits because most clocked designs today use a Phase Locked Loop (PLL) block which contains a circuit called a Voltage Controlled Oscillator (VCO) that is quite sensitive in operation to the effects of noise and process variation. As process node scaling continues… Read More