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Advanced Packaging Analysis at DesignConby Tom Dillinger on 06-07-2022 at 10:00 amCategories: EDA, Xpeedic
The slogan for the DesignCon conference has been “where the chip meets the board”. Traditionally, the conference has provided a breadth of technical presentations covering the design and analysis of high-speed communication interfaces and power integrity evaluations between chip, board, and system.
The recent DesignCon… Read More
Everyone saw Shift Left, the EDA blockbuster. Digital logic design, with perfect 1s and 0s simulated through perfect switches, shifted into a higher gear. But the dark arts – RF systems, power supplies, and high-speed digital – didn’t shift smoothly. What do these practitioners need in EDA to see more benefits from shift left? … Read More
For years, there have been rather distinct domains for the extraction of interconnect models from physical design data.
Chip designers commonly focused on RC parasitics for circuit/path delay calculations and dynamic I*R voltage drop analysis. The annotation of extracted parasitics to a netlist model required the layout… Read More
With the increasing density of electronics in product enclosures, combined with a broad range of operating frequencies, designers must be cognizant of the issues associated with the radiation and coupling of electromagnetic energy. The interference between different elements of the design may result in coupling noise-induced… Read More
In the 155 years since James Clerk Maxwell introduced the world to Maxwell’s Equations in the “Dynamic Theory of the Electromagnetic Field” there have been some amazing breakthroughs and avenues of insight. As a young electrical engineering student, we are introduced to the set of equations describing electromagnetic waves,… Read More
At DesignCon 2020, ANSYS sponsored a series of very high-quality presentations. Some focused on advanced methods and new technology exploration and some provided head-on, practical and actionable capabilities to improve advanced designs. The presentation I will discuss here falls into the latter category. The topic was… Read More
This article will describe the motivations for pursuing a new flow in the SoC design methodology. This flow involves the extraction, evaluation, and analysis of a full electromagnetic coupling model for a complex SoC and its package environment. The results of this analysis highlight the impact of electromagnetic coupling… Read More
While there’s a lot of cool technology in modern semiconductors, it’s important to raise our sights periodically to understand how well these chips will work in the systems for which they are designed. One area driving a lot of semiconductor growth is automobile electronics. We’ve had drive-train control forever it seems, but… Read More