Virtuoso is 20nm-ready

Virtuoso is 20nm-ready
by Paul McLellan on 01-30-2013 at 1:47 pm

I already talked about how Cadence is splitting Virtuoso into two. Anyway, it is now officially announced. The 6.1 version will continue to be developed as a sort of Virtuoso classic for people doing designs off the bleeding edge that don’t require the new features. And a new Virtuoso 12.1 intended for people doing 20nm and… Read More


Improving Methodology the NVIDIA Way

Improving Methodology the NVIDIA Way
by Paul McLellan on 01-29-2013 at 2:57 pm

I was at DesignCon in Santa Clara today and listened to Jonah Alben of NVIDIA’s keynote on what their approach is to improving design methodology. He started by pointing out that most companies underinvest in EDA (and he includes NVIDIA in this). Partially it is complaceny: that last chip taped out so we know we can do it again.… Read More


Get the Latest Info on DFM at the SPIE Litho Conference

Get the Latest Info on DFM at the SPIE Litho Conference
by glforte on 01-29-2013 at 2:12 pm

While the SPIE Advanced Lithography conference is best known for IC manufacturing, computational lithography, mask preparation and other back-end topics, there is also a significant amount of interest in Design for Manufacturing (DFM) at the conference because some litho issues are best (or only) addressed by modifying the… Read More


A Brief History of Tanner EDA

A Brief History of Tanner EDA
by Daniel Nenni on 01-28-2013 at 11:00 pm

While founder John Tanner, PhD, got his initial exposure to the TTL Cookbook and CMOS Cookbook as an undergraduate, it was his experience as a Caltech graduate student that forged his early path in EDA. In 1979, while enrolled in a VLSI design course at Caltech, John and his classmates received a pre-print of Carver Mead’s seminal… Read More


High Performance or Cycle Accuracy? You can have both

High Performance or Cycle Accuracy? You can have both
by Daniel Payne on 01-26-2013 at 10:55 pm

SoC designers have always wanted to simulate hardware and software together during new product development, so one practical question has been how to trade off performance versus accuracy when creating an early model of the hardware. The creative minds at Carbon Design Systems and ARM have combined to offer us some hope and relief… Read More


Using IC Data Management Tools and Migrating Vendors

Using IC Data Management Tools and Migrating Vendors
by Daniel Payne on 01-23-2013 at 10:50 am

Non-volatile memory is used in a wide variety of consumer and industrial applications and comes in an array of architectures like Serial Flash and CBRAM (Conductive Bridging RAM). I caught up with Shane Hollmer by phone this week to gain some insight into a recent acquisition of Atmel’s serial flash components, and how that… Read More


Verdi: No Requiem for Openness

Verdi: No Requiem for Openness
by Paul McLellan on 01-22-2013 at 8:10 pm

I sat down last week for lunch with Michael Sanie. Mike and I go back a long way, working together at VLSI Technology (where his first job out of school was to take over the circuit extractor that I’d originally written) and then in strategic marketing at Cadence. Now Mike has marketing for (almost?) all of Synopsys’s … Read More


How We Got Here…

How We Got Here…
by Paul McLellan on 01-22-2013 at 12:54 pm

Over at the GSA Forum website I have an article on the history of the semiconductor industry. It is actually based on a couple of brief history of semiconductor blogs (here and here) I published here on SemiWiki last year but edited down a lot and tightened up.

Since the start of the year seems to be the time for predictions, here are the… Read More


Double Patterning for IC Design, Extraction and Signoff

Double Patterning for IC Design, Extraction and Signoff
by Daniel Payne on 01-21-2013 at 3:27 pm

TSMC and Synopsys hosted a webinar in December on this topic of double patterning and how it impacts the IC extraction flow. The 20nm process node has IC layout geometries so closely spaced that the traditional optical-based lithography cannot be used, instead lower layers like Poly and Metal 1 require a new approach of using two… Read More