Intelligent Electronic Design Exploration with Large System Modeling and Analysis

Intelligent Electronic Design Exploration with Large System Modeling and Analysis
by Camille Kokozaki on 03-07-2019 at 7:00 am

At the recent DesignCon 2019 in Santa Clara, I attended a couple of sessions where Cadence and their research partners provided some insight on machine learning/AI and on large system design analysis; with the first one focused on real-world cloud & machine learning/AI deployment for hardware design and the second one focused… Read More


GLOBALFOUNDRIES Talks About Enabling Development of 5G ICs

GLOBALFOUNDRIES Talks About Enabling Development of 5G ICs
by Tom Simon on 02-12-2019 at 7:00 am

5G is in the news again. Sprint has mounted a legal challenge against ATT, claiming that ATT is misleading people into believing that they already are offering 5G. While ATT is about to start testing of 5G, they have also sent out updates that causes customer phones to display 5GE when they are still on 4G LTE systems. The truth is that… Read More


Getting to 56G Takes The Right Stuff

Getting to 56G Takes The Right Stuff
by Tom Simon on 02-04-2019 at 12:00 pm

During the 1940s when aerospace engineers were attempting to break the sound barrier for the first time, they were confronting a slew of new technical issues that had never been dealt with before, and in some cases never seen before. In subsonic flight airflow was predictable and well understood. In crossing the sound barrier, … Read More


Accelerating 5G Design Innovation Through Simulation Workshop

Accelerating 5G Design Innovation Through Simulation Workshop
by Daniel Nenni on 01-22-2019 at 12:00 pm

DesignCon is coming up, kicking off the first of many industry conferences for the year. It’s at the Santa Clara Convention Center which is the best venue in Northern California. Not only is this a semiconductor crowd, it’s also a systems crowd covering chips, boards, and systems. More than 175 companies participate with an expected… Read More


Machine Learning And Design Into 2018 – A Quick Recap

Machine Learning And Design Into 2018 – A Quick Recap
by Alex Tan on 02-07-2018 at 3:00 pm

How could we differentiate between deep learning and machine learning as there are many ways of describing them? A simple definition of these software terms can be found here. Let’s look into Artificial Intelligence (AI), which was coined back in 1956. The term AI can be defined as human intelligence exhibited by machines.Read More


Analyze Substrate Noise in SoC Design?

Analyze Substrate Noise in SoC Design?
by Pawan Fangaria on 01-19-2015 at 4:00 pm

Often substrate noise analysis takes place when everything is there on the chip, but that stage comes near the tape-out which is too late to make major changes in architecture, placement, introducing noise protection circuitry for the victims and so on. It was okay when there used to be very little analog content on the chip. But … Read More


Xilinx & Apache Team up for FPGA Reliability at 20nm

Xilinx & Apache Team up for FPGA Reliability at 20nm
by Pawan Fangaria on 03-17-2014 at 12:00 am

In this age of SoCs with hundreds of IPs from different sources integrated together and working at high operating frequencies, FPGA designers are hard pressed keeping up the chip reliability from issues arising out of excessive static & dynamic IR drop, power & ground noise, electro migration and so on. While the IPs are… Read More


Who Won the DesignVision Awards at DesignCon this year?

Who Won the DesignVision Awards at DesignCon this year?
by Daniel Payne on 02-07-2014 at 7:37 pm

The Seattle Seahawks had an awesome victory in the SuperBowl against the Denver Broncos, so folks living here in the Pacific Northwest are feeling proud and optimistic. The recent DesignConconference and exhibit ended 10 days ago and there were also victors announced in terms of the annual DesignVision awards that have three … Read More


Special Interest Group for HSPICE at DesignCon in Two Weeks

Special Interest Group for HSPICE at DesignCon in Two Weeks
by Daniel Payne on 01-13-2014 at 8:00 pm

DesignCon brings together engineers from around the world that are interested in IC design, package design and board design, plus the signal integrity issues of creating high-speed systems. In just two weeks there’s a Special Interest Group(SIG) just for users of HSPICE in their tool flow, and it meets for three hours during… Read More


Low Power @ DesignCon 2014

Low Power @ DesignCon 2014
by Daniel Nenni on 01-08-2014 at 11:00 am

Taking place annually in Silicon Valley, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.

Created by engineers for engineers, DesignCon is the largest gathering of chip, board and systems designersRead More