DesignCon is coming up, kicking off the first of many industry conferences for the year. It’s at the Santa Clara Convention Center which is the best venue in Northern California. Not only is this a semiconductor crowd, it’s also a systems crowd covering chips, boards, and systems. More than 175 companies participate with an expected… Read More
Tag: designcon
Machine Learning And Design Into 2018 – A Quick Recap
How could we differentiate between deep learning and machine learning as there are many ways of describing them? A simple definition of these software terms can be found here. Let’s look into Artificial Intelligence (AI), which was coined back in 1956. The term AI can be defined as human intelligence exhibited by machines.… Read More
Analyze Substrate Noise in SoC Design?
Often substrate noise analysis takes place when everything is there on the chip, but that stage comes near the tape-out which is too late to make major changes in architecture, placement, introducing noise protection circuitry for the victims and so on. It was okay when there used to be very little analog content on the chip. But … Read More
Xilinx & Apache Team up for FPGA Reliability at 20nm
In this age of SoCs with hundreds of IPs from different sources integrated together and working at high operating frequencies, FPGA designers are hard pressed keeping up the chip reliability from issues arising out of excessive static & dynamic IR drop, power & ground noise, electro migration and so on. While the IPs are… Read More
Who Won the DesignVision Awards at DesignCon this year?
The Seattle Seahawks had an awesome victory in the SuperBowl against the Denver Broncos, so folks living here in the Pacific Northwest are feeling proud and optimistic. The recent DesignConconference and exhibit ended 10 days ago and there were also victors announced in terms of the annual DesignVision awards that have three … Read More
Special Interest Group for HSPICE at DesignCon in Two Weeks
DesignCon brings together engineers from around the world that are interested in IC design, package design and board design, plus the signal integrity issues of creating high-speed systems. In just two weeks there’s a Special Interest Group(SIG) just for users of HSPICE in their tool flow, and it meets for three hours during… Read More
Low Power @ DesignCon 2014
Taking place annually in Silicon Valley, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.
Created by engineers for engineers, DesignCon is the largest gathering of chip, board and systems designers… Read More
Another Winner at DesignCon
After a show like DesignConwraps up we get a chance to ask ourself what it all meant, and how was this year different than last year. Reading through many posts about DesignCon I came to discover that the Awards at DesignCon are less contentious than at CES, and also that ANSYSreceived a DesignVision awardfor the 2nd year running. … Read More
Power, Signal and Thermal Updates from ANSYS at DesignCon
DesignConis next week in Santa Clara, so today I spoke with Mark Ravenstahlfrom ANSYS to get an idea of what to expect at the conference and trade show.
Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis
Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.
On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More