I have written a lot of articles looking at leading edge processes and comparing the process density. One comment I often get are that the process density numbers I present do not correlate with the actual transistor density on released products. A lot of people want to draw conclusions an Intel’s processes versus TSMC’s processes… Read More
I mentioned a while back that I’m really getting into the role that sensors play in our new hyper-connected world – in the IoT, intelligent cars, homes, cities, industry, utilities, medicine, agriculture, etc, etc. If we can think of a way to sense it and connect it, someone is probably already doing it. But there’s more to … Read More
I enjoy learning and writing about new technologies closely connected to our personal and working lives (the kind you could explain to your Mom or a neighbor). So naturally I’m interested in AI, communication and security as applied to the home automation, transportation, virtual, augmented and mixed reality, industry and so… Read More
It seems that it has always been that there were packages and ICs, and in the design tool world “never the twain shall meet”. The tools for designing packages were completely separate from the tools used to design IC’s. This was so profoundly true that even after Cadence merged with Valid Logic back in the early 90’s, their Allegro … Read More
Cadence has done a good job of keeping up with the needs of analog RF designs. Of course, the term RF used to be reserved for a thin slice of designs that were used specifically in RF applications. Now, it covers things like SerDes for networking chips that have to operate in the gigahertz range. Add that to the trend of combining RF and… Read More
25th annual IEEE Electronic Design Process Symposium
Accelerating Design and Manufacturing
September 13 & 14, 2018, SEMI, 673 S. Milpitas Blvd, Milpitas, CA 95035
This year marks a milestone in EDPS’s history as it turns 25. The event will be held at SEMI’s new headquarter facility and will provide a forum for EDA, foundry … Read More
A large part of the effort in designing SOCs has shifted to the integration of their constituent IP blocks. Many IP blocks used in SOCs come as ready to use components and the real work has become making them work together. Network on Chip (NoC) has been a huge help in this task, handling the interconnections between blocks and planning… Read More
The phrase “where the rubber meets the road” is especially apt when it comes to discussions about the Internet of Things. The obvious interpretation is that dissimilar things are being put together in a mutually dependent fashion. When I hear the phrase I always think of the things that can go wrong, such a tire sliding instead of … Read More
DAC is where both sides of the design equation come together for discussion and learning. This is what makes attending DAC discussion panels so interesting; you are going to hear from providers of tools, methodologies and IP as well as those who need to use them to deliver working solutions. There are few places where the interplay… Read More
During the design cycle as tape out approaches, time pressure usually goes up dramatically. To make matters worse the design itself is much larger, because all the block level work is done and there is a requirement to work with the entire database. It feels like it’s time to put aside the garden trowel and start using a steam shovel.… Read More
