While FinFET yield controversy is going on, I see a lot being done to improve that yield by various means. One prime trend today, it must be, it’s worthwhile, is to pull up various signoffs as early as possible during the design cycle. And DFM signoff is a must with respect to yield of fabrication. This reminds me about my patents filed… Read More
Tag: dac
DAC Deadlines: Action This Day
DAC is coming up. OK, it’s not actually until next June. It is June 7-11th 2015 at the Moscone Center here in San Francisco. But there are lots of important deadlines coming up for papers, panels and more. The 52[SUP]nd[/SUP] DAC will focus on five key tracks:
- automotive
- IP design
- embedded systems
- hardware/software security
Key Collaboration to Enable Designs at Advanced Nodes
In the semiconductor ecosystem, several partners (or better to say stakeholders) join together in the overall value chain to finally output the most coveted chip, err I should say SoC these days. It becomes really interesting when we start analyzing the real value added by each of them, none appears to be less. Well, then to whom … Read More
IP and Design Management Done Right
At DACin San Francisco this past June I was able to visit and blog about two dozen EDA companies, however there were so many more products and events to see that I couldn’t possibly have enough time to enjoy them all. Fortunately for me there were plenty of videos made of vendor presentations, so this week I got caught up a bit by… Read More
Samsung 14nm FinFET Design with Cadence Tools
The first consumer products with 20nm processing are arriving in 2014 like the 2 billion transistor A8 chip in the iPhone 6, however at the 14nm node there are new designs underway to continue the trend of Moore’s Law. To get a better feel for the challenges of designing with 14nm FinFET technology I watched a 23 minute video … Read More
Automatic RTL Restructuring: A Need Rather Than Convenience
In the semiconductor design industry, most of the designs are created and optimized at the RTL level, mainly through home grown scripts or manual methods. As there can be several iterations in optimizing the hierarchy for physical implementation, it’s too late to do the hierarchical optimizations after reaching the floor plan… Read More
Crossfire – Your partner for IP development, what’s new?
As the SoCs and IPs grow in sizes and complexities, the number of formats, databases, libraries of standard cells and IOs also increase. It becomes a clumsy task to check every cell in a library, its consistency among various format with respect to functionality, timing, naming, labels and so on, and its complex physical properties… Read More
DAC Update on IC Design Tools at Mentor
On Tuesday morning I headed off to the Mentorbooth at DACfor an update on their Custom IC Design and AMS Simulation/Verification tools, Christopher Cone was the presenter. Also in the room were Jay Madiraju, and Mick from Berkeley DA.… Read More
S-engine Moves up the Integration of IPs into SoCs
As the semiconductor design community is seeing higher and higher levels of abstraction with standard IPs and other complex, customized IPs and sub-systems integrated together at the system level, sooner than later we will find SoCs to be just assemblies of numerous IPs selected off-the-self according to the design needs and… Read More
Analog FastSPICE Update at DAC
Tuesday night over dinner at DAC I was able to chat with Ravi Subramanian, CEO of Berkeley DA, recently acquired by Mentor Graphics back on March 21st. This acquisition provided Mentor with an Analog FastSPICE circuit simulator to round out its collection of simulators.… Read More