Very Large Scale Integration (VLSI) engineering organizations are known for their intricate workflows that require high-performance simulation software and an abundance of simulation licenses to create cutting-edge chips. These workflows involve complex dependency trees, where one task depends on the completion of another… Read More
Tag: collaboration
Webinar: Trusted Traceability – Follow cold brew coffee from farm to fork throughout supply chain collaboration
Learn how to leverage IoT, cloud analytics and blockchain technology to provide transparency across the value chain.
Customer trust has a direct impact on the sales potential of any industry. The basis for customers’ decision-making is changing from brand loyalty to data-based evidence to understand more about the food origin,… Read More
Webinar: Accelerate Time to Market by Enhancing Cross-Team Collaboration in Real-Time
Date: June 15, 2022, 11 AM CET
Duration: 45 Minutes
Nili Segal
Product Engineering Architect
Cadence Design Systems
Purvesh Maharaja
Global Sales Manager
OpsHub, Inc.
In the highly competitive chip design business, the winner is the company that has faster time to market. As SoC design becomes more complex, teams struggle
Design to Layout Collaboration Mixed Signal
When talking about today’s sophisticated advanced node designs it’s easy to first think about the digital challenges. Yet, the effort to design the needed analog and mixed signal blocks for them should not be underestimated. The need for high speed clocks, high frequency RF circuits and high bit rate IOs makes the analog portions,… Read More
Perforce Embedded DevOps Summit 2021 and the Path to Secure Collaboration on the Cloud
Perforce recently held their virtual Embedded DevOps Summit. There was a lot of great presentations across many disciplines. Of particular interest to me, and likely to the SemiWiki readership as well, was a presentation by Warren Savage entitled Secure Collaboration on a Cloud-based Chip Design Environment. I’ll provide … Read More
Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More
Behind the 3DEXPERIENCE for Silicon
We’ve been covering the Dassault Systèmes “Silicon Thinking” platform for a while here, but, as I’m often prone to do, I wanted to explore the backstory to uncover more about the concept. With over 25M users of their product lifecycle management (PLM) solutions, why is Dassault Systèmes becoming so interested in semiconductor… Read More
Webinar Alert – Helping Mixed Signal not be Mixed Up
Today’s profound statement: “don’t fall in love with your tools, figure out the biz process change first.” Mixed-signal SoC designers are having ample challenges with their design process and are in need of design management, but don’t want another tool to do it.… Read More
10 Challenges in IP Design Collaboration
Enterprise design management can be summed up in one word: collaboration. Intellectual property (IP) reuse and the success of distributed system-on-chip (SoC) design efforts depend strongly on how well designers can collaborate. As time-to-market windows have shortened, the challenges around design collaboration have… Read More
Latest Pinpoint Release Tackles DRC and Trend Lines
After reading previous SemiWiki coverage on Dassault Systèmes and their ENOVIA Pinpoint solution, one big item seemed missing: how does this thing actually work? With all due respect to our other bloggers who covered when Dassault Systèmes acquired Pinpoint from Tuscany Design Automation, why Qualcomm is using Pinpoint, and… Read More