Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology

Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology
by Kalar Rajendiran on 07-25-2024 at 10:00 am

High Speed PAM4 SerDes Use Scenarios

The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More


CadenceCONNECT: Jasper User Group San Jose

CadenceCONNECT: Jasper User Group San Jose
by Admin on 07-23-2024 at 8:08 pm

About

It’s time for our annual CadenceCONNECT: Jasper User Group Conference – San Jose. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal… Read More


Cadence® Janus™ Network-on-Chip (NoC)

Cadence® Janus™ Network-on-Chip (NoC)
by Kalar Rajendiran on 07-23-2024 at 10:00 am

Design Flow when using Janus NoC

A Network-on-Chip (NoC) IP addresses the challenges of interconnect complexity in SoCs by significantly reducing wiring congestion and providing a scalable architecture. It allows for efficient communication among numerous initiators and targets with minimal latency and high speed. A NoC facilitates design changes, enabling… Read More


Podcast EP234: An Update on Chips and Science Act Progress with Mike O’Brien

Podcast EP234: An Update on Chips and Science Act Progress with Mike O’Brien
by Daniel Nenni on 07-05-2024 at 10:00 am

Dan is joined by Mike O’Brien. Mike was recently the vice president of aerospace and government at Synopsys, He has 40 years of experience in the semiconductor, software and computer industries. In his 27 years in EDA and IP at Synopsys and Cadence, Mike helped build new lines of business including outsourced design services, research… Read More


Semi Market Decreased by 8% in 2023… When Design IP Sales Grew by 6%!

Semi Market Decreased by 8% in 2023… When Design IP Sales Grew by 6%!
by Eric Esteve on 04-19-2024 at 6:00 am

Top10 Table 2023

Design IP revenues had achieved $7.04B in 2023, with disparity between license, growing by 14% and royalty decreasing by 6%, and main categories. Processor (CPU, DSP, GPU & ISP) slightly growing by 3.4% when Physical (SRAM Memory Compiler, Flash Memory Compiler, Library and I/O, AMS, Wireless Interface) slightly decreasing… Read More


Preventing SOC Schedule Delays Using the Cloud

Preventing SOC Schedule Delays Using the Cloud
by Ronen Laviv on 12-25-2023 at 6:00 am

compute peaks 1

In my previous article, we touched on ways to pull in the schedule. This time I’d like to analyze how peak usage affects project timeline and cost. The above graph is based on real pattern taken from one development week in Annapurna Labs 5nm Graviton.

The Graph shows the number of variable servers per hour per day. There’s a baseline… Read More


An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards

An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards
by Daniel Nenni on 12-14-2023 at 10:00 am

IMG DEF60C112922 1

My beautiful wife and I attended the annual Global Semiconductor Alliance (GSA) Awards event last week. Usually this is a solo event but since my wife is CFO of SemiWiki I was able to get her an invite. I go every year and she wanted to see what all of the excitement was about. She also knows quite a few industry people from attending the… Read More


New STA Features from Cadence

New STA Features from Cadence
by Daniel Payne on 11-13-2023 at 10:00 am

Tempus DRA Suite

Static Timing Analysis (STA) has been an EDA tool category for many years now, yet with each new generation of smaller foundry process nodes come new physical effects that impact timing, requiring new analysis features to be added. For advanced process nodes, there are five different types of analysis that must be included when… Read More


The True Power of the TSMC Ecosystem!

The True Power of the TSMC Ecosystem!
by Daniel Nenni on 10-02-2023 at 6:00 am

logo chart 092623

The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More


The TSMC OIP Backstory

The TSMC OIP Backstory
by Daniel Nenni on 09-18-2023 at 6:00 am

TSMC OIP 2023

This is the 15th anniversary of the TSMC Open Innovation Platform (OIP). The OIP Ecosystem Forum will kick off on September 27th in Santa Clara, California and continue around the world for the next two months in person and on-line in North America, Europe, China, Japan, Taiwan, and Israel. These are THE most attended semiconductor… Read More