Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?

Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?
by Paul McLellan on 08-24-2013 at 3:23 pm

I attended the semi-annual SEMI Silicon Valley Lunch meeting last week. The semiconductor equipment people are the ones that really know what is going on. People can talk about capex numbers on conference calls but it is the equipment vendors who either do or do not get orders for particular types of equipment. In turn, the analysts… Read More


Intel Is Continuing to Scale While Others Pause

Intel Is Continuing to Scale While Others Pause
by Paul McLellan on 08-09-2013 at 11:52 am

Back in May, William Holt, EVP of technology and manufacturing at Intel gave a presentation to analysts entitled Advancing Moore’s Law, Imperatives and Opportunity. A pdf of the presentation is available here. I just saw it for the first time today and I’m not sure how to get my head around it. It starts off with a lot … Read More


TSMC Q2 Results: Up 17%; 20nm and 16nm on track

TSMC Q2 Results: Up 17%; 20nm and 16nm on track
by Paul McLellan on 07-24-2013 at 10:47 am

TSMC announced their Q2 financial results yesterday. Revenue was $5.2B (at the high end of guidance) with net income of $1.6B. This is up 17.4% on Q1 and up 21.6% year-to-year. Gross margin is up too, at 49% which is up 3.2 points on Q1 and 0.3 points year-to-year. As usual the financial results are not directly that interesting since… Read More


The Semiconductor IDM Business Model is Dead!

The Semiconductor IDM Business Model is Dead!
by Daniel Nenni on 07-10-2013 at 7:00 pm


While this was not specifically stated, it was certainly implied during the sessions I attended at SEMICON West this week: The traditional semiconductor business model (IDM) is coming to an end. Starting with the keynote: Foundry-driven Innovation in the Mobility Era,cost was the common theme in any discussion involving mobile… Read More


What is inside the iPhone5s? Samsung or TSMC?

What is inside the iPhone5s? Samsung or TSMC?
by Daniel Nenni on 06-26-2013 at 6:00 pm

As a semiconductor professional and an Apple customer I’m very interested to see what is inside the iPhone5s. Rumors are spreading, photos are leaking, creating a nice build up to the next release of the mobile device that changed the world.

Honestly, last year I was a bit disappointed with the iPhone5. Inside is the A6 SoC which uses… Read More


Taiwan Semiconductor Tries To Pull A FinFAST One!

Taiwan Semiconductor Tries To Pull A FinFAST One!
by Daniel Nenni on 06-16-2013 at 7:00 pm


This completely misleading title is from a Seeking Alpha (SA) article, a stock investment version of the National Enquirer. As I mentioned inA Call to ARMs, fame and fortune seeking SA Authors make a penny per click so sensationalism sells. The article is not worth your time so I will save you the click and skip to the misguided conclusion:… Read More


Sagantec’s nmigrate adopted and deployed for 14nm technology

Sagantec’s nmigrate adopted and deployed for 14nm technology
by Daniel Nenni on 05-29-2013 at 3:00 pm

Major semiconductor company successfully migrated 28nm libraries to 14nm FinFET

Santa Clara, California – May 29, 2013 – Sagantec announced that its nmigrate tool was adopted by a major semiconductor company for the development of standard cell libraries at 14nm and 16nm FinFET technologies.
This customer already… Read More


Enabling 14nm FinFET Design

Enabling 14nm FinFET Design
by Daniel Payne on 05-28-2013 at 12:54 pm

There’s never a dull moment in the foundry race to offer FinFET processes that enable leading-edge SoC design. Today I attended a webinar hosted by Samsung and Synopsys on how to enable 14nm FinFET design. The two speakers were Dr. Kuang-Kuo Lin from Samsung and Dr. Henry Sheng from Synopsys.


Dr. Kuang-Kuo Lin, Samsung


Dr.Read More


Moore, or More Than Moore?

Moore, or More Than Moore?
by Paul McLellan on 04-19-2013 at 12:05 pm

Yesterday was the 2013 GSA Silicon Summit, which was largely focused on contrasting what advances in delivering systems will depend on marching down the ladder of process nodes, and which will depend on innovations in packaging technology. So essentially contrasting Moore’s Law with what has come to be known as More Than… Read More


Cutting the Key to 14nm Lithography

Cutting the Key to 14nm Lithography
by Beth Martin on 04-08-2013 at 2:30 pm

It appears that immersion lithography is now the plan of record for manufacturing ICs at 14nm. How is it possible to use 193nm wavelength light at 14nm? How can we provide the process window to pattern the such tight pitches? The secret lies in computational lithography. For 20nm, the two key innovations in computational lithography… Read More