The announcement by Intel during their January earnings call that they were going to hike Capex in 2013 over 2012 left many folks scrambling as to the reasons and the what-the hecks? Here was a company that was exiting 2012 with 50% utilization of their advanced 22nm process and yet signaling more building was to come. Furthermore,… Read More
TSMC ♥ Cadence
In a shocking move TSMC now favors Cadence over Synopsys! Okay, not so shocking, especially after the Synopsys acquisitions of Magma, Ciranova, SpringSoft, and the resulting product consolidations. Not shocking to me at all since my day job is Strategic Foundry Relationships for emerging EDA, IP, and fabless companies.
Rick… Read More
Want 10nm Wafers? That’ll Cost You
As you know, I’ve been a bit of a bear about what is happening to wafer costs at 20nm and below. At the Common Platform Technology Forum last week there were a number of people talking about this in presentations and at Harvey Jones’s “fireside chat”.
At the press lunch I asked about this. There are obviously… Read More
Please Help Me Understand IBM – Common Platform Technology Forum 2013
“Innovations for Next Generation Scaling”
The 2013 Forum today (Feb 5, 2013) started with a presentation by Dr. Gary Patton, VP, IBM Semiconductor Research & Development Center. Gary very clearly articulated the two irresolvable challenges the industry now faces:
- On chip interconnect
- Lithography
These … Read More
Apple and Samsung Do It Again
The numbers are starting to come in for how everyone did in Q4. According to Cannacord Genuity, Apple made 69% of the profit and Samsung made 34%. What do you notice about those numbers? They add up to more than 100%. HTC supposedly made 1% of the profit and everyone else either broke even or lost money. Basically Apple and Samsung have… Read More
ARMs in the Clouds
The most interesting session at the Linley Tech Data Center Conference last week was the last one, on Designing Power Efficient Servers. What this was really about was whether ARM would have any success in the server market and what Intel’s response might be.
Datacenters are now very focused on power efficiency and many track… Read More
Notes from Common Platform: Collaborate or Die
FinFETs are hot, carbon nanotubes are cool, and collaboration is the key to continued semiconductor scaling. These were the main messages at the 2013 Common Platform Technology Forum in Santa Clara.
The collaboration message ran through most presenations, like the afternoon talk by Subi Kengeri of GLOBALFOUNDRIES and Joe Sawicki… Read More
No EUV before 7nm?
I was at the Common Platform Technology Forum this week. One of the most interesting sessions is IBM’s Gary Patton giving an overview of the state of semiconductor fabrication. Then, at lunchtime, he is one of the people that the press can question. In this post, I’m going to focus on Extreme Ultra-Violet (EUV) lithography.… Read More
Using Soft IP and Not Getting Burned
The most exciting EDA + Semi IP company that I ever worked at was Silicon Compilers in the 1980’s because it allowed you to start with a concept then implement to physical layout using a library of parameterized IP, the big problem was verifying that all of the IP combinations were in fact correct. Speed forward to today and our… Read More
Common Platform Technology Forum February 5th 2013 Live or Online!
Can’t make it to Santa Clara? Join us online!
The detailed 2013 CPTF agenda is now up in preparation for the February 5th event at the Santa Clara Convention Center. This is one of the rare times that you can get a free lunch! Watch this quick video to see what is in store for us this year. Dr. Paul McLellan and I will be there so please… Read More


TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel