The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the most … Read More
Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17 lineup relies on advanced SOITEC based Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology. The discovery highlights a significant architectural shift in high-frequency… Read More
An AI-Native Architecture That Eliminates GPU Inefficiencies
A recent analysis highlighted by MIT Technology Review puts the energy cost of generative AI into stark perspective. Generating a simple text response from Llama 3.1-405B—a model with 405 billion parameters, the adjustable “knobs” that enable prediction—requires on average 3,353 joules, nearly 1 watt-hour (Wh). Once cooling… Read More
TSMC Process Simplification for Advanced Nodes
In the modern world, the semiconductor industry stands at the heart of technological innovation. From smartphones and laptops to advanced medical devices and artificial intelligence systems, nearly every piece of contemporary electronics depends on increasingly sophisticated microchips. Among the leading companies … Read More
TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon
TSMC continues to reinforce its leadership in advanced semiconductor manufacturing through its deepening collaboration with Cadence Design Systems. The expanded partnership focuses on enabling next-generation artificial intelligence and high-performance computing innovations by aligning advanced electronic design… Read More
Podcast EP331: Soitec’s Broad Impact on Quantum Computing and More with Dr. Christophe Maleville
Daniel is joined by Dr. Christophe Maleville, Chief Technology Officer and Senior Executive Vice-President of Soitec’s Innovation. He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer… Read More
TSMC vs Intel Foundry vs Samsung Foundry 2026
The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More
Gate-All-Around (GAA) Technology for Sustainable AI
The transition from FinFET to Gate-All-Around (GAA) transistor technology represents a pivotal moment in the evolution of logic devices, driven by both physical scaling limits and the rapidly growing computational demands of artificial intelligence. As semiconductor technology approaches the sub-3 nm regime, traditional… Read More
VSORA Board Chair Sandra Rivera on Solutions for AI Inference and LLM Processing
Sandra Rivera, a Silicon Valley veteran who is the former CEO of Altera, an Intel FPGA spinout, and long-time Intel executive, recently became Chair of the Board of Directors of Paris-based VSORA. VSORA, a technology leader redefining AI inference for next-generation data centers, cloud infrastructure and edge, is focused … Read More
TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce
The expansion of semiconductor manufacturing in the United States, particularly with TSMC’s multi-fab campus in Phoenix, Arizona, has created a significant need for skilled technical workers. To meet this demand, TSMC has partnered with educational institutions, including Grand Canyon University (GCU), to launch… Read More


Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry