The RISC-V and Open-Source Functional Verification ChallengeMost of the RISC-V action at the end…Read More
Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers2.5D package design is rapidly finding its stride…Read More
Addressing Reliability and Safety of Power Modules for Electric VehiclesAs electric vehicles (EVs) gain widespread adoption, safety,…Read More
Shaping Tomorrow’s Semiconductor Technology IEDM 2024Anyone who has read my articles about IEDM…Read More
SI and PI Update from Cadence on Sigrity XSignal Integrity (SI) and Power Integrity (PI) issues…Read More
I attended the 3D architectures for semiconductor integration and packaging conference just before Christmas. I learned a lot and have put together an overview of what is going on in 3D ICs. This is not intended for experts (and if I’ve made egregious errors then please correct them in the forum) but more for people who are … Read More
Atrenta Inc., the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow, announced today that it will participate in a worldwide social media platform aimed at facilitating mass communication for electronic design professionals through Web 2.0 technologies.… Read More
Unlike the last CES, this year I saw compelling technology, technology that will definitely drive the semiconductor industry and make the analyst fortunetellers look bad yet again. Anyone who thinks semiconductor growth next year will be in single digits is absolutely wrong, TSMC will grow even more, 20%+. First and foremost… Read More
At the EDAC CEO panel, Daniel pointed out that he used EDA360 as a good introduction to non-specialists (e.g. financial sector). I just discovered today that the cover article of PC Today is by John Bruggeman (well, Cadence) about EDA360. Having some idea of just how difficult it is to get that sort of specialist article into a general… Read More
First, lets review the business model transitions EDA has seen. We started with perpetual licensing which is a software license for the life of the product. EDA companies did their best to change product names to get incremental revenue above and beyond the yearly 15% maintenance fee but that is a dead end business model for a confined… Read More
I will share with you the most interesting I have heard during IP-SoC 2010, last December in Grenoble. Today, let’s summarize what I heard about the future of the IP business. The presentation was done by Gartner, in the “Auditorium” (largest room). It first started with the results for 2010, and I took some notes, as you can see the… Read More
Solidohas run an interesting survey on variation-aware design. The data is generic and not specific to Solido’s products although you won’t be surprised to know that they have tools in this area.
What is variation-aware design? Semiconductor manufacturing is a statistical process and there are two ways to handle this in the design… Read More
One of the important but often unrecognized aspects of engineering is re-building the infrastructure underneath key design tools. Sometimes this gives a new desirable capability but often a lot of the effort is simply to modernize the code base so that it is possible to continue development effectively going forward. For example,… Read More
I love SPICE and Fast SPICE circuit simulators, so here’s my feature list for the ultimate SPICE circuit simulator:
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