Can semiconductor devices change the temperature of the earth? The heat from my Dell XPS changes the temperature of my lap! A 63” flat screen TV changes the temperature of my living room. I just purchased six of the latest iPhones for my family (under duress) and signed up for another two years with Verizon, so our carbon footprint … Read More
Physical Verification of 3D-IC Designs using TSVs
3D-IC design has become a popular discussion topic in the past few years because of the integration benefits and potential cost savings, so I wanted to learn more about how the DRC and LVS flows were being adapted. My first stop was the Global Semiconductor Alliance web site where I found a presentation about how DRC and LVS flows were… Read More
SPICE Circuit Simulation at Magma
All four of the public EDA companies offer SPICE circuit simulation tools for use by IC designers at the transistor-level, and Magma has been offering two SPICE circuit simulators:
- FineSIM SPICE (parallel SPICE)
- FineSIM PRO (accelerated, parallel SPICE)
An early advantage offered by Magma was a SPICE simulator that could be … Read More
Old standards never die
I just put up a blog about the EDA interoperability forum, much of which is focused on standards. Which reminded me just how long-lived some standards turn out to be.
Back in the late 1970s Calma shipped workstations (actually re-badged Data General minicomputers) with a graphic display. That was how layout was done. It’s… Read More
EDA Interoperability Forum
The 24th Interoperability Forum is coming up at the end of the month on November 30th to be held at the Synopsys compus in Mountain View. It lasts from 9am until lunch (and yes, Virginia, there is such a thing as a free lunch). I think it looks like a very interesting way to spend a morning.
Here are the speakers and what they are speaking… Read More
Synopsys Awarded TSMC’s Interface IP Partner of the Year
Is it surprising to see that Synopsys has been selected Interface IP partner of the year by TSMC? Not really, as the company is the clear leader on this IP market segment (which includes USB, PCI Express, SATA, DDRn, HDMI, MIPI and others protocols like Ethernet, DisplayPort, Hyper Transport, Infiniband, Serial RapidIO…). But,… Read More
Using Processors in the SoC Dataplane
Almost any chip of any complexity contains a control processor of some sort. These blocks are good at executing a wide range of algorithms but there are often two problems with them: the performance is inadequate for some application or the amount of power required is much too high. Control processors pay in limited performance … Read More
RTL Power Models
One of the challenges of doing a design in the 28nm world is that everything depends on everything else. But some decisions need to be made early with imperfect information. But the better the information we have, the better those early decisions will be. One area of particular importance is selecting a package, designing a power… Read More
Managing Test Power for ICs
The goal for automatic test pattern generation (ATPG) is to achieve maximum coverage with the fewest test patterns. This conflicts with the goals of managing power because during test, the IC is often operated beyond its normal functional modes to get the highest quality test results. When switching activity exceeds a device’s… Read More
3D Transistors @ TSMC 20nm!
Ever since the TSMC OIP Forum where Dr. Shang-Yi Chiang openly asked customers, “When do you want 3D Transistors (FinFETS)?” I have heard quite a few debates on the topic inside the top fabless semiconductor companies. The bottom line, in my expert opinion, is that TSMC will add FinFETS to the N20 (20nm) process node in parallel with… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay