MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile DevicesIn a bold move to dominate the premium…Read More
CEO Interview with Adam Khan of Diamond QuantaKey Takeaways Diamond Quanta is bringing diamond out…Read More
Rise Design Automation Webinar: SystemVerilog at the Core: Scalable Verification and Debug in HLSKey Takeaways - High-Level Synthesis (HLS) delivers not…Read More
Eric Xu’s Keynote at Huawei Connect 2025: Redefining AI InfrastructureAt Huawei Connect 2025, held in Shanghai, Eric…Read More
SiFive Launches Second-Generation Intelligence Family of RISC-V CoresSiFive, founded by the original creators of the…Read More
What is the biggest challenge facing an EDA startup today? By a startup, I mean a brand new company, not a company that already has a few customers and is either on a fast path to success or a slower path whereby the company can continue to grow slowly forever.
Obviously, one challenge is the funding environment. Since EDA acquisitions… Read More
Engineers have this fascination with how things work. They are thrilled to tear stuff apart, and sometimes to even be able to put it back together afterwords. So I can keep my recovering engineer card, I thought I’d take a few moments and look inside a technology Daniel Payne and I have been covering here, exploring where the idea started… Read More
Embedded memories have an important impact on power. SoCs that integrate multiple functions on a single silicon die are at the heart of many electronic devices. As process geometries have scaled, design teams have used more and more of the additional silicon real estate available to integrate embedded memories that serve as scratch-pads,… Read More
Oasys has joined the TSMC Soft-IP Alliance Program. This means that TSMC IP partners have access to a new RTL exploration tool to improve QoR and reduce the iterations needed for design closure. In modern process nodes, RTL engineers implementing complex IP cores for graphics, networking, and mobile computing are struggling … Read More
I spent some quality time with Subi Kengeri, Vice President, Technology Architecture, Office of the CTO, GLOBALFOUNDRIES in Las Vegas during CES. Great guy, he worked at Silicon Access, Virage and TSMC before GF. One thing you should know about embedded memory guys, SRAM is the first thing that goes through a new process so they … Read More
My oldest son just upgraded Smart Phones from a 3″ display to a 4.5″ display and was shocked to discover that his battery barely lasted 8 hours, so I welcomed him to the reality of limited battery life in modern SoC-based mobile devices. There is some hope in increasing battery life for our consumer-oriented devices … Read More
Going to DAC? I just booked my plane ticket last weekend since flights from the Bay Area to wherever DAC is are so often overbooked. It’s in Austin this year in case you’ve been living under a rock. There are lots of reasons to go, from the academic conference to the world’s biggest EDA exhibition. And here is one … Read More
Jasper is presenting at both ends of the world at both ends of February.
First in Israel, it is SemiIsrael Verification Day 2013 on February 5th (next Tuesday) at Green House in Tel Aviv.
I already talked about how Cadence is splitting Virtuoso into two. Anyway, it is now officially announced. The 6.1 version will continue to be developed as a sort of Virtuoso classic for people doing designs off the bleeding edge that don’t require the new features. And a new Virtuoso 12.1 intended for people doing 20nm and… Read More
Oh, awards season! The glitz! The glamour! The most important and innovative new design products!
That last part is a key feature of the annual DesignVision awards and the Best in Test awards presented at DesignCon 2013. Mentor Graphics’ test products scored two wins: a DesignVision award for their new Tessent IJTAG product, and… Read More
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