WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent DevicesEdge AI is rapidly transforming how intelligent solutions…Read More
WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPsIn today's data-driven systems—from cloud storage and AI…Read More
ChipAgents Tackles Debug. This is ImportantInnovation is never ending in verification, for performance,…Read More
Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and AnalysisIn a major announcement at the 2025 Design…Read More
CEO Interview with Faraj Aalaei of CognichipFaraj Aalaei is a successful visionary entrepreneur with…Read More
Anyone who has been around technology consortia or standards bodies will tell you that the timeline from inception to mainstream adoption of a new embedded technology is about 5 years, give or take a couple dream cycles. You can always tell the early stage, where very different concepts try to latch on to the same, simple term.
Such… Read More
There are two primary microprocessor companies in the world these days: Intel and ARM. Of course there are many others but Intel is dominant on the PC desktop (including Macs) and ARM is dominant in mobile (including tablets).
One of the keynotes at last month’s Jasper User Group (JUG, not the greatest of acronyms) was by Bob… Read More
Design For Manufacturing (DFM) is the art and science of making an IC design yield better in order to receive a higher ROI. Ian Smith, an AE from Mentor in the Calibre group presented a pertinent webinar, IP Scoring Using TSMC DFM Kits. I’ll provide an overview of what I learned at this webinar.… Read More
In an article published this week in microprocessor report and highlighted in Barron’s, Linley Gwennap makes the argument that Intel should stay the course and fix the PC instead of trying to offset its declines with sales into the Smartphone and Tablet space. He cites that lower PC sales growth was due to a dramatic slowdown in processor… Read More
We know by now that clock speeds aren’t everything when it comes to measuring the goodness of a processor. Performance has direct ties to pipeline and interconnect details, power factors into considerations of usability, and the unspoken terms of yield drive cost.
My curiosity kicked in when I looked at the recent press release… Read More
Short news came during last week-end and Linkedin was the most efficient media to learn that NVELO has been acquired. Probably very few people out of the SSD ecosystem knew about NVELO. Based in Santa Clara, the company was a spin off from Denali, privately owned and if you look at the top management, you will recognize a few name, like… Read More
Analog, mixed-signal, RF, and custom digital circuitry implemented in GHz nanometer CMOS introduce a new class of design and verification challenges that traditional transistor‑level simulators cannot adequately address. Berkeley Design Automation, Inc., (BDA) was founded in 2003 by Amit Mehrotra and Amit Narayan,… Read More
In 2012 FinFET is one of the most talked about MOS technologies of the year because traditional planar CMOS has slowed down on scaling below the 28nm node. To learn more about FinFET process modeling I attended a Synopsys webinar where Bari Biswas presented for about 42 minutes include a Q&A portion at the end.
Bari Biswas, Synopsys… Read More
Double patterning at 20nm is one of those big unavoidable changes that it is almost impossible to know too much about. Mentor’s David Abercrombie, DFM Program Manager for Calibre, has written a series of articles detailing the multifaceted impacts of double patterning on advanced node design and verification. There is… Read More
Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.
On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More
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Facing the Quantum Nature of EUV Lithography