Reachability in Analog and AMS. Innovation in VerificationCan a combination of learning-based surrogate models plus…Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural PivotIn 2003, legendary computer architect Michael J. Flynn…Read More
Enabling RISC-V & AI Innovations with Andes AX45MPV Running Live on S2C Prodigy S8-100 Prototyping SystemQualifying an AI-class RISC-V SoC demands proving that…Read More
DAC News – A New Era of Electronic Design Begins with Siemens EDA AIAI is the centerpiece of DAC this year.…Read More
PCI Express 3.0 increased the supported data rate to 8 Gbps, which effectively doubles the data rate supported by PCI Express 2.0. While the data rate was increased, no improvement was made to the channels. As such, an 8 Gbps channel in PCIe 3.0 experiences significantly more loss than one implemented in PCIe 2.0. To compensate for… Read More
While this iconic advertising phrase was first used to describe the ink reliability of a ballpoint pen, it perfectly summarizes the average consumer’s attitude toward automobile reliability as well. We don’t really care how it’s done, as long as everything in our car works first time, every time. Even when that includes heated… Read More
TSMC and Synopsys hosted a webinar in December on this topic of double patterning and how it impacts the IC extraction flow. The 20nm process node has IC layout geometries so closely spaced that the traditional optical-based lithography cannot be used, instead lower layers like Poly and Metal 1 require a new approach of using two… Read More
This is the second blog entry about an ST Ericsson white-paper on multiprocessors in mobile. The first part was here.
The first part of the white-paper basically shows that for mobile the optimal number of cores is two. It is much better to use process technology (and good EDA) to run the processor at higher frequency rather than add… Read More
In my never ending quest to promote the fabless semiconductor ecosystem I cannot pass up a discouraging word about one of the oldest financial services companies. You can consult with me for $300 per hour to answer your questions about the semiconductor industry on the phone or you can buy me lunch and get it in person (lunch will probably… Read More
I came across an interesting white-paper from ST Ericsson on two topics: multi-processors in mobile platforms and FD-SOI. FD-SOI is the ST Microelectronics alternative to FinFETs for 20nm and below. It stands for Fully-Depeleted Silicon-on-Insulator. But I’m going to save that part of the white-paper for another blog… Read More
CES is the preeminent gadget show, and in the LVCC South Hall a wave has been building for some time. It’s now the place where chipsets are introduced, and this year saw a wide range of introductions from Atmel, Bosch, Broadcom, Intel (OK, they’re still in Central Hall), InvenSense, Marvell, NVIDIA, Qualcomm, Samsung, ST-Ericsson,… Read More
We will soon start to see the quarterly financial reporting installments of the “Big 3” public EDA companies. I predict they will be as boring as usual. I am not sure if I would want it any differently though.
Back in the 90s there were times when it was truly interesting to wait to see what Cadence, Mentor, or later Synopsys, might announce.… Read More
Scott Seaton is the new CEO of Oasys Design Systems. Paul van Besouw, the CEO since the company’s founding, becomes the CTO. I met Scott last year when I was doing some consulting work for Carbon Design where he was VP of sales (the new VP sales at Carbon is Hal Conklin, by the way).
I talked to Scott about why he had joined Oasys. … Read More
We all know the concept of “one stop shop”, becoming popular in the Design IP market. The topic we will address today is NOT the “one stop shop”, even if it looks similar, but rather that we could call “consistent design flow”.
What does that means? Simply that, if your SoC design is integrating a DDRn (LPDDR2, DDR3 or even DDR4, let’s… Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot