Full Spectrum Transient Noise: A must have sign-off analysis for silicon successNoise minimization is required for advanced analog and…Read More
PSS and UVM Work Together for System-Level VerificationIn the early days of the PSS rollout,…Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?Predictions in technology adoption often hinge on a…Read More
Cavium designs some very complex SoCs containing multiple ARM or MIPS cores at 32 and 64 bit. This complexity leads to major challenges in validating the overall chip architecture to ensure that their designs will meet the requirements of their customers once they are completed, with performance as high as 100Gbps.
Cavium have… Read More
FinFETs are fun! They certainly have kept me busy writing over the past year about the possibilities and probabilities of a disruptive technology that will dramatically change the semiconductor ecosystem. Now that 14nm silicon is making the rounds I will be able to start writing about the realities of FinFETs which is very exciting!… Read More
Those of us who spend a lot of time at EDA marketing events cannot help but notice the dramatic shrinking of the floor space, and to some extent attendance, at the major EDA shows such as DAC and DATE. DAC used to occupy both the north and south halls of Moscone Center when in San Francisco, but now only takes up one hall. So, I did not have… Read More
Back in 2011, TSMC announced it was extending its IP Alliance Program to include soft, or synthesizable IP. Around that time it was also announced that Atrenta’s SpyGlass platform would be used as the sole analysis tool to verify the completeness and quality of soft IP before being admitted to the program. Since then, the … Read More
Almost no design these days is created from scratch. Typical designs can contain 500 or more IP blocks. But there is still a big difference between the first design for a new system or platform, and later designs which can be extensively based on the old design. These are known as derivatives and should be much easier to design since… Read More
Often as we move down the process node treadmill, new challenges appear that we didn’t really have to worry about before. Often, these challenges require addressing at a number of different levels: the process, the cell libraries, the design, the EDA tools that we use.
One well known example is the problem of metal migration.… Read More
Most mixed-signal design teams don’t use data management. Well, that’s not entirely true, everyone has to do data management of some sort, it is just that it is often very ad hoc, often done by some vaguely systematic way of doing file naming, using email to keep track of changes, no access control and so on. This leads… Read More
Embedded NVM technology based functions can be implemented in large SoC designed in advanced technology nodes down to 28nm, as there is no requirement for extra mask levels, like when integrating Nand Flash, negatively impacting the final cost. And it is also possible to integrate One Time Programmable (OTP) to store trim and … Read More
Tech aficionados love roadmaps. The confidence a roadmap instills – whether using tangible evidence or just a good story – can be priceless. Decisions on “the next big thing”, sometimes years and a lot of uncertain advancements away, hinge on the ability of a technology marketing team to define and communicate a roadmap.
Any roadmap… Read More
Usually I sleep on long flights, if not, I watch movies and read. The Lincoln movie was playing on EVA Air this week which reminded me that Abraham Lincoln was one of the greatest U.S. Presidents. If I was asked to pick a U.S. President as a spokesperson for TSMC it would be Honest Abe Lincoln. Chairman Morris Chang said it best during … Read More
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Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?