UBM’s EETimes and EDN today announced Kathryn Kranen as the lifetime achievement award winner for this years ACE awards program. Kathryn, of course, is the CEO of Jasper (and is also currently the chairman of EDAC). Past winners exemplify the prestige and significance of the award. Since 2005 the award was given to Gordon… Read More
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Cell Level Reliability
I blogged last month about single event effects (SEE) where a semiconductor chip behaves incorrectly due to being hit by an ion or a neutron. Since we live on a radioactive planet and are bombarded by cosmic rays from space, this is a real problem, and it is getting worse at each process node. But just how big of a problem is it?
TFIT is … Read More
Rare earth syndrome: PHY IP analogy
If you ask to IP vendors selling functions, PHY or Controller, supporting Interface based protocols which part is the master piece, the controller IP only vendors will answer: certainly my digital block, look how complex it has to be to support the transport and logical part of the protocol! Just think about the PCI Express gen-3… Read More
Phil Kaufman Award Recipient 2013: Chenming Hu
This year’s recipient of the Kaufman Award is Dr Chenming Hu. I can’t think of a more deserving recipient. He is the father of the FinFET transistor which is clearly the most revolutionary thing to come along in semiconductor for a long time. Of course he wasn’t working alone but he was the leader of the team at UC… Read More
TSMC to Talk About 10nm at Symposium Next Week
Given the compressed time between 20nm and 16nm, twelve months versus the industry average twenty four months, it is time to start talking about 10nm, absolutely. Next Tuesday is the 19th annual TSMC Technology Symposium keynoted of course by the Chairman, Dr. Morris Chang.
Join the 2013 TSMC Technology Symposium. Get the latest… Read More
Intelligent tools for complex low power verification
The burgeoning need of high density of electronic content on a single chip, thereby necessitating critical PPA (Power, Performance, Area) optimization, has pushed the technology node below 0.1 micron where static power becomes equally relevant as dynamic power. Moreover, multiple power rails run through the circuit at different… Read More
What really means high reliability for OTP NVM?
Normal operation range for a Semiconductor device is not made equal for systems… If you consider a CPU running inside an aircraft engine control system, this device should operate at temperature ranged between -55°C and +125°C, when an Application Processor for smartphone is only required to operate in the 0°C to +70°C range. … Read More
TSMC Tapes Out First 64-bit ARM
TSMC announced today that together with ARM they have taped out the first ARM Cortex-A57 64-bit processor on TSMC’s 16nm FinFET technology. The two companies cooperated in the implementation from RTL to tape-out over six months using ARM physical IP, TSMC memory macros, and a commercial 16nm FinFET tool chain enabled by… Read More
GF, Analog and Singapore
The world is analog and despite enormous SoCs in the most leading-edge process node being the most glamorous segment of the semiconductor industry, it turns out that one of the fastest growing segments is actually analog and power chips in older process technologies. Overall, according to Semico, analog and power ICs, including… Read More
April 17-19: Overbooked!
For three days in a couple of weeks time there is a crash of conferences, spread out all over the extended Bay Area.
Firstly, from 17-19th April at the Santa Clara Hyatt is the Linley Mobile Conference. This covers all things microprocessor in the mobile industry. Details of the conference including the full agenda are here. The conference… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?