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Intel announced their quarterly results today. Revenue was $12.8B, up 1% from a year ago with operating income of $2.5B also up 1% from last year.
Since the future of the world is mobile and not desktop/laptop, the mobile results are the most interesting. Mobile sales fell 61% to $156M. This includes mobile products and anything … Read More
Last February Xilinx presented a prototype device at the 2014 IEEE international Solid-State Circuits Conference (ISSCC, titled “A Heterogeneous 3D-IC Consisting of Two 28nm FPGA Die and 32 Reconfigurable High-Performance Data Converters” and click here to get a copy of the paper. Let me just share the intro my dear reader… … Read More
I was in a Twitter conversation over the weekend with some very smart people, and one of the discussion points was how slow and painful the formal standardization process can be. One suggestion was that IoT companies should “just do it”, creating specification-by-implementation. … Read More
On SemiWiki we have some 247 blogs and forum discussions on the topic of “automotive“, so I’m pleased to learn that at DAC in San Francisco there is a new track just for automotive systems and software. Just consider all of that electronic content in your typical auto:… Read More
To further my quest to comprehend the latest trends in the semiconductor industry continues, I spent the morning with SEMI at the “The Silicon Valley Breakfast Forum: Internet of Things (IoT) – Driving the Microelectronics Revolution” seminar. I’m a big fan of the breakfast seminar concept. I’m up early anyway and it is … Read More
Most IC engineers learn best by hands-on experience when another more experienced person can show us what to do. If you cannot find that experienced person, then the next best thing is a video from an expert. I was surprised to find out that video was so important today that the #2 most viewed web site on the Internet was www.youtube.com… Read More
As Moore’s law started saturating on a single semiconductor die, the semiconductor community came up with the approach of growing vertically by stacking dies one above other in a 3D-IC arrangement. However, a major concern with a 3D-IC is that the heat generated by each die can get trapped in the stack, and hence it’s extremely important… Read More
Usually these brief history pieces are totally written by the SemiWiki blogger whose name is at the top. Often me since that was how I prototyped book chapters (buy). Well, OK, I did actually write this but it is completely cribbed from a presentation earlier this week by Wally Rhines who gave a sort of keynote at the announcement of… Read More
Hopefully we all know what memes are, if not, ask one of your children or grandchildren. Having four grown children of my own I see memes posted on my FaceBook page now and again in support of my superior parenting skills. Remember when EETimes used to run a picture and readers would send in funny captions? An early form of meme, not that… Read More
The SoC designs of today are much more complex than ever in terms of number of clocks, IPs, levels of hierarchies, several modes of operations, different types of validations and checks for growing number of constraints at various stages in the design flow. As a semiconductor design evolves through several stages from RTL to layout,… Read More
Facing the Quantum Nature of EUV Lithography