I will see you at the Substrate Vision Summit in Santa ClaraWIth packaging being one of the top sources…Read More
The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)The Impact of AI on Software and Hardware…Read More
Alchip is Paving the Way to Future 3D Design InnovationAt the recent TSMC OIP Ecosystem Forum in…Read More
When considering SoC architectures it is easy to become trapped in simple narratives. These assume the center of compute revolves around a central core or core cluster, typically Arm, more recently perhaps a RISC-V option. Throw in an accelerator or two and the rest is detail. But for today’s competitive products that view is a … Read More
Water, the planet’s lifeblood, remains a finite and precious resource. The Earth’s total water supply has remained relatively constant over millennia. However, it is the uneven distribution of freshwater and the challenges of providing access to clean water that are causing stress in various parts of the world.… Read More
Many people either thought or assumed… Read More
Founded in 1990, Hyperstone is a fabless NAND flash memory controller company enabling safe, reliable and secure storage systems. The company designs, develops and delivers high-quality, innovative semiconductor solutions to enable its customers to produce world-class products for industrial, embedded, automotive and… Read More
Support for AI at the edge has prompted a good deal of innovation in accelerators, initially in CNNs, evolving to DNNs and RNNs (convolutional neural nets, deep neural nets, and recurrent neural nets). Most recently, the transformer technology behind the craze in large language models is proving to have important relevance at… Read More
Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules… Read More
This is the 15th anniversary of the TSMC Open Innovation Platform (OIP). The OIP Ecosystem Forum will kick off on September 27th in Santa Clara, California and continue around the world for the next two months in person and on-line in North America, Europe, China, Japan, Taiwan, and Israel. These are THE most attended semiconductor… Read More
Dan is joined by Mike Ingster from Quantum Leap Solutions (QLS) and Ken Potts from Alphacore. Mike and Ken explain how QLS and Alphacore collaborate to provide industry-leading IP and system solutions to their mutual customers. The markets served by both QLS and Alphacore are discussed and the synergies are explained in this informative… Read More
Koen Verhaege, CEO of Sofics (“Solutions for ICs”), has developed his career first as an engineer, later as a business leader and entrepreneur, working on IP development and valorisation. Koen’s technical accomplishments, publications and patents are in the field of on-chip ESD protection design.
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Many modern processor performance benchmarks rely on as many as three levels of cache staying continuously fed. Yet, new data-intensive applications like multithreaded generative AI and 4K image processing often break conventional caching, leaving the expensive execution units behind them stalled. A while back, Semidynamics… Read More
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