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Intel’s Tale of Two Cities

Intel’s Tale of Two Cities
by Ed McKernan on 11-27-2013 at 11:00 pm

It was a year ago that Paul Otellini made his surprise announcement that he was stepping down as CEO of Intel. Soon after, I wrote an article asserting that the only correct choice for his replacement was Nvidia’s CEO Jen Hsun Huang. I went beck to reread what I wroteand I can scarcely say I would change anything I put in the article assumingRead More


Lithography: Future Technologies

Lithography: Future Technologies
by Paul McLellan on 11-27-2013 at 12:28 pm

The first part of Lars Liebmann’s ICCAD keynote about lithography was on the changes in lithography that have to us to where we are today. In some ways it was an explanation of why we have the odd design rules, double patterning etc that we have in 20nm and 16nm processes. The second part of his talk was a look forward to how we might… Read More


eMMC Mobile Memory

eMMC Mobile Memory
by Paul McLellan on 11-27-2013 at 11:40 am

eMMC is the standard for mobile memory used in smartphones and tablets. The latest standard, released just this year, is eMMC 5.0. The previous standard, 4.51, was only released last year so things are moving quickly.

Arasan have a webinar next week to bring you up to speed on eMMC 5.0 in general and, of course, their own IP offering… Read More


Intel Bay Trail Fail II

Intel Bay Trail Fail II
by Daniel Nenni on 11-27-2013 at 9:00 am

To follow up my Bay Trail Fail blog which predicted that the leading edge Intel 22nm mobile SoC offering would fail, I must admit I was wrong. I did not think Bay Trail would see any traction in the tablet market but, as it turns out, Intel will ship 40M of those parts in 2014. Did you notice I said ship and not sell? Read on……… … Read More


Social Media at ARM

Social Media at ARM
by Daniel Payne on 11-26-2013 at 3:27 pm

The number one semiconductor IP company in the world is ARM, and they have really figured out how to use social media in a big way to communicate with and listen to their customers. When you first visit the Home page for ARM there are four social media icons displayed in monochrome underneath the menu bar. As you hover over the icons (Twitter,… Read More


What’s new in the “Interface IP Survey” ?

What’s new in the “Interface IP Survey” ?
by Eric Esteve on 11-26-2013 at 9:27 am

The reader will find many updates in the “Interface IP Survey” from IPNEST, released in October 2013. Good question, as the IP market is a very fast moving one and the protocol based Interface IP, is moving even faster… exhibiting 20% growth rate in 2012, expected to grow with 10% CAGR between 2012 and 2017 to reach $700M. … Read More


Semiconductor Process Development: A View from the Trenches at IEDM

Semiconductor Process Development: A View from the Trenches at IEDM
by Daniel Nenni on 11-25-2013 at 10:00 pm

There is always a lot of posturing and pontificating when semiconductor executives talk about the future of process development. They are fighting an air war of perception and investor expectations, so naturally want to make sure they have plenty to brag about. But, as we pointed out recently with Intel’s problems at 14nm, moving… Read More


Front-End Design Summit: Physically Aware Design

Front-End Design Summit: Physically Aware Design
by Daniel Nenni on 11-24-2013 at 12:00 pm

Save closure time and boost performance by incorporating knowledge of physically aware design early into your front-end design implementation flow

With the adoption of advanced process nodes, design closure is becoming increasingly difficult due to the lack of convergence between the front end and the back end of the register-transfer… Read More


Intel’s Mea Culpa!

Intel’s Mea Culpa!
by Daniel Nenni on 11-24-2013 at 11:00 am

The Intel analyst meeting last week reads like an absolute train wreck with INTC stock dropping 5%+ the very next day. Since I work in the fabless semiconductor ecosystem during the day I was not able to listen to it live like the other pundits. Nor am I as easily fooled by Power Point slides. I did however review the materials and would… Read More