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No IoT No Justice!by Daniel Nenni on 12-03-2014 at 9:00 amCategories: IoT
It looks like even President Obama is on the IoT bandwagon now with his $263M in matching funds for state and local police body cameras and training. It is a shame that it took a tragic event to spur this type of Government investment in semiconductor technology but I appreciate it just the same.
As I have mentioned before, when I read… Read More
In today’s world, the three pillars of security are confidentiality, integrity (of the data), and authentication (i.e. “C.I.A.”). Fortunately, Atmel CryptoAuthentication crypto engines with secure key storage can be used in systems to provide all three of these.
Focusing on the confidentiality pillar, in a symmetric system… Read More
I am a believer of continuous improvement in anything we do; it’s pleasant to see rapid innovation in technology these days, especially in semiconductor space – technology, design, tools, methodologies… Imagine a 100K gates up to 1M gates design running at a few hundred MHz frequency and at technology node in the range of .18 to … Read More
The traditional batch-oriented DRC process run as a final check to ensure compliance with foundry yield goals is quickly moving toward a concurrent DRC process performed early and often throughout design, especially at the 28 nm and smaller process nodes. What are the technology factors causing this change?
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Fitness Watch Anyone?by mbriggs on 12-01-2014 at 4:30 pmCategories: Mobile
I’m an exercise junkie. I’m also not a spring chicken so I like having the time on my wrist. I’ve been anxiously awaiting an iWatch to go with my iPhone 6. As patience is not a virtue of mine, and the iWatch is rumored to be expensive ($400-500). I decided to try a fitness watch.
This is a crowded area that includes activity… Read More
3DIC in Burlingameby Paul McLellan on 12-01-2014 at 7:00 amCategories: Events
Every year in December is what I think of as the main 3D IC conference where you can get up to speed on all the latest. Officially it is called 3D Architectures for Semiconductor and Packaging or 3D ASIP. It is held in the Hyatt Regency in Burlingame (the one right by 101 near the airport). This year it is from December 10-12th.
The first… Read More
SerDes stands for Serializer/Deserializer, and SerDes is a serious piece of design, requiring an extremely experienced team of analog engineers (below 10 years’ experience, you’re still a quasi-beginner). Better to rely on an analog guru to draw the SerDes architecture and manage the team! Why does SerDes is becoming more and… Read More
Last week I was traveling in Munich attending the MunEDA User Group meetingso I missed a live webinar on the topic of optimizing for power at RTL. I finally got caught up in my email this week and had time to view this 47 minute webinar, presented by Guillaume Boilletof Atrenta. He recommended using a combination of automatic, semi-automatic… Read More
As we move towards packing more and more functionalities and increasing densities of SoCs, the power, thermal and signal integrity issues keep on rising. 3D-IC is a great concept to stack multiple dies on top of each other vertically. While it brings lot of avenues to package dies with multiple functions together, it has challenges… Read More
High-capacity IC place and route (P&R) tools can cost $200K and more to own from the big three vendors (Cadence, Synopsys, Mentor), but what about IC designs that are primarily Big Analog and Little Digital? In the EDA world we often have multiple choices for tools, and there are affordable alternatives to place and route out… Read More
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