AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoptionSystems-in-package (SIPs) with 2.5D and 3D heterogenous integration,…Read More
The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateI recently posted an overview of an upcoming…Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets EraThe semiconductor industry is entering a new era…Read More
It’s amazing the amount of excitement being ginned up over connected cars. Analyst firms regularly publish estimates of hundreds of millions of connected cars on the road by 2020. It’s enough to make you believe it might happen.
If we even come close to those projections it will be a miracle given the disconnect between the wireless… Read More
Even though design management systems are gaining popularity as a way to manage design data growth, they actually contribute to the problem of exploding data size. What we already know is that a linear increase in die size causes exponential growth in chip area, and that smaller feature sizes compound this effect in the same way.… Read More
If you look back at the beginning of the ASIC business you will see that it was really a critical time in the semiconductor industry. It all began in the 1980s which coincidentally is when I started my career in Silicon Valley. General purpose integrated circuits ruled the market, forcing system designers to cobble together off-the-shelf… Read More
Hardware emulation was conceived in the 1980s to address a design verification crisis looming on the horizon. In those days, the largest digital designs were stressing the limits of the software-based, gate-level simulator that was the mainstream tool for the task.
It was anticipated and confirmed in short notice that adopting… Read More
I’ve done SRAM and DRAM design before as a circuit designer from 1978-1986, but in 2016 there are so many more challenges to using 28nm and 14nm on FDSOI technology. One way to keep abreast of SRAM design is to read conference papers, so I just finished a paper from authors at STMicroelectronics and MunEDA presented at the IEEE… Read More
Silicon Carbide (SiC) is a very interesting material. If you find in nature the mineral moissanite, it will be only minute quantities in certain types of meteorite. The moissanite physical properties are very similar to these of diamond, in term of density and abrasive power. In the semiconductor industry, SiC is characterized… Read More
DAC is again going to be in Austin (reason enough to go), from June 6[SUP]th[/SUP]-8[SUP]th[/SUP] for the main event. A number of events caught my eye:
US 20160132030 illustrate a smart home system for automating operation of the smart home devices (e.g., thermostats, lighting devices, household appliances, etc.) based on aggregation of individual user routines.
User mobile devices and smart home devices can incorporate pattern detection logic to identify patterns in … Read More
There are times when a speaker for a large corporation clearly breaks from the cold corporate talking points and suggests something that you just know his managers will consider cringe-worthy. Haden Kirkpatrick, described on the event agenda of the Future Connected Car event in Santa Clara as “director of strategy and … Read More
A lot of ink has been spilled regarding the impending tsunami of Internet Of Things (IOTs). It is certainly an interesting topic, and not just for geeks. As the next generation computing platform, IOT will see an explosion of connected device (wearables, intelligent refrigerators, smart thermostats, etc.), currently estimated… Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?