You are probably familiar with the acronym PPA, which stands for Power/Performance/Area. Sometimes it is PPAC, where C is for cost, since there is more to cost than just area. For example, did you know that adding an additional metal layer to a chip dramatically increases the cost, sometimes by millions of dollars? It requires a … Read More
Long-standing Roadblock to Viable L4/L5 Autonomous Driving and Generative AI Inference at the Edge
Two recent software-based algorithmic technologies –– autonomous driving (ADAS/AD) and generative AI (GenAI) –– are keeping the semiconductor engineering community up at night.
While ADAS at Level 2 and Level 3 are on track, AD at Levels 4 and 5 are far from reality, causing a drop in venture capital enthusiasm and money. Today,… Read More
Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
Disaggregated Systems: Enabling Computing with UCIe Interconnect and Chiplets-Based Design
The world of computing is evolving rapidly, with a constant demand for more powerful and efficient systems. Generative AI has driven exponential growth in the amount of data that is generated and processed at very high data speeds and very low latencies. Traditionally, computing systems have been built using monolithic designs,… Read More
Can Generative AI Recharge Phone Markets?
Consensus on smartphone markets hovers somewhere between slight decline and slight growth indicating lack of obvious drivers for more robust growth. As a business opportunity this unappealing state is somewhat offset by sheer volume ($500B in 2023 according to one source) but we’re already close to peak adoption outside of … Read More
SPIE- EUV & Photomask conference- Anticipating High NA- Mask Size Matters- China
– SPIE EUV & Photomask conference well attended with great talks
– Chip industry focused on next gen High NA EUV & what it impacts
– Do big chips=big masks? Another Actinic tool?
– AI & chip tools, a game changer- China pre-empting more sanctions
The SPIE EUV & Photomask conference in Monterey
… Read MorePodcast EP186: The History and Design Impact of Glass Substrates with Intel’s Dr. Rahul Manepalli
Dan is joined by Dr. Rahul Manepalli. Rahul is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization. Rahul and his team are responsible for developing the next generation of materials, processes and equipment for Intel’s package substrate pathfinding and development… Read More
McKinsey & Company Shines a Light on Domain Specific Architectures
When we hear McKinsey & Company, we may think of one of the “Big Three” management consultancies. While that’s true, this firm has a reach and impact that goes far beyond management consulting. According to its website, the firm accelerates sustainable and inclusive growth. While this is an inspirational statement, the… Read More
CEO Interview: Sanjeev Kumar – Co-Founder & Mentor of Logic Fruit Technologies
Sanjeev is a renowned technopreneur in the semiconductor industry. With more than 20+ years of experience, he is known for his enormous resilience and deep tech knowledge that sets him apart from others in the industry.
Sanjeev started his career as a hardware designer and then forayed into the FPGA domain due to his love for configurable… Read More
proteanTecs On-Chip Monitoring and Deep Data Analytics System
State-of-the-art electronics demand high performance, low power consumption, small footprint and high reliability from their semiconductor products. While this imperative is true across many different market segments, it is critical for applications such as the automotive/autonomous driving and data centers. As electronic… Read More
Bluetooth 6.0 Channel Sounding is Here