The demand for high-bandwidth, low-latency networking solutions has never been greater. As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centers become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative.… Read More
2024 Outlook with Da Chuang of Expedera
Expedera provides customizable neural engine semiconductor IP that dramatically improves performance, power, and latency while reducing cost and complexity in edge AI inference applications. Da is co-founder and CEO of Expedera. Previously, he was cofounder and COO of Memoir Systems, an optimized memory IP startup, leading… Read More
Ansys and Intel Foundry Direct 2024: A Quantum Leap in Innovation
In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global leader in engineering simulation software, has forged a partnership with Intel Foundry to enable multiphysics chip design. The … Read More
Accelerate AI Performance with 9G+ HBM3 System Solutions
In the technology realm of artificial intelligence (AI) and high-performance computing (HPC), the demand for higher throughput and efficiency has never been greater. To meet these evolving demands, innovative memory solutions have emerged as critical enablers, paving the way for transformative advancements in computing… Read More
Siemens Promotes Digital Threads for Electronic Systems Design
Many years ago, I remember discussions around islands of automation/silos. Within the scope of any given silo there is plenty of automation to handle tasks relevant to that phase. But managing the full lifecycle from concept through manufacturing to field support must cross between silos, and those transitions are not as clean… Read More
Designing for Security for Fully Autonomous Vehicles
With the advent of IoT devices, vehicles have become increasingly interconnected, offering enhanced automation, connectivity, electrification, and shared mobility. However, this progress also brings forth unprecedented challenges, particularly in ensuring the safety and security of automotive electronics. The complexity… Read More
INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with advanced analog and mixed-signal EDA technology
Customer case studies have always been my favorite source of information. Press releases are a great start but there is always more to the story. Fortunately, I had the opportunity to speak with Sumit Vishwakarma, principal product manager at Siemens EDA about their recent press release with Interchip. I was an advisor to Berkeley… Read More
A Game-Changer for IP Designers: Design Stage Verification
In today’s rapidly evolving semiconductor industry, the design and integration of intellectual property (IP) play a pivotal role in achieving competitive advantage and market success. Whether sourced from commercial IP providers or developed in-house, ensuring that IP designs are compliant with signoff requirements… Read More
How MZ Technologies is Making Multi-Die Design a Reality
The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More
SPIE Let there be Light! High NA Kickoff! Samsung Slows? “Rapid” Decline?
– High NA EUV’s coming out party – “Dawn” of the Angstrom Era
– Well attended, positive vibes, not much new but good progress
– Concerns about Samsung slowing spend while Intel accelerates
– KLA reticle inspection quandary – Risky business in China
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?